SG164292A1 - System and method for inspecting a wafer - Google Patents

System and method for inspecting a wafer

Info

Publication number
SG164292A1
SG164292A1 SG200901109-9A SG2009011099A SG164292A1 SG 164292 A1 SG164292 A1 SG 164292A1 SG 2009011099 A SG2009011099 A SG 2009011099A SG 164292 A1 SG164292 A1 SG 164292A1
Authority
SG
Singapore
Prior art keywords
illumination
semiconductor wafer
image capture
capture device
broadband illumination
Prior art date
Application number
SG200901109-9A
Other languages
English (en)
Inventor
Ajharali Amanullah
Lin Jing
Ge Hancheng
Wong Kok Weng
Original Assignee
Semiconductor Technologies & Instruments Pte
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200900229-6A external-priority patent/SG163442A1/en
Application filed by Semiconductor Technologies & Instruments Pte filed Critical Semiconductor Technologies & Instruments Pte
Priority to SG200901109-9A priority Critical patent/SG164292A1/en
Priority to PCT/SG2010/000005 priority patent/WO2010082901A2/en
Priority to US12/657,068 priority patent/US10161881B2/en
Priority to TW099100874A priority patent/TWI575625B/zh
Priority to MYPI2010000166A priority patent/MY169618A/en
Priority to CN201010004722.6A priority patent/CN101783306B/zh
Priority to CN201310283291.5A priority patent/CN103630549B/zh
Priority to EP16207592.3A priority patent/EP3173773A1/en
Priority to EP14197439.4A priority patent/EP2848923A1/en
Priority to JP2011545326A priority patent/JP6103171B2/ja
Priority to TW102106188A priority patent/TWI575626B/zh
Priority to EP10731445.2A priority patent/EP2387795A4/en
Priority to EP18189616.8A priority patent/EP3431968B1/en
Priority to KR1020100003272A priority patent/KR101656045B1/ko
Publication of SG164292A1 publication Critical patent/SG164292A1/en
Priority to IL213915A priority patent/IL213915B/he
Priority to KR1020130019364A priority patent/KR101612535B1/ko
Priority to IL225929A priority patent/IL225929A0/he
Priority to JP2013192270A priority patent/JP2014016358A/ja
Priority to US13/998,046 priority patent/US20150233840A1/en
Priority to PH12013000288A priority patent/PH12013000288A1/en
Priority to JP2016140885A priority patent/JP2016183978A/ja
Priority to IL259567A priority patent/IL259567B/he
Priority to US16/119,340 priority patent/US10876975B2/en
Priority to JP2018179667A priority patent/JP6820891B2/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200901109-9A 2009-01-13 2009-02-16 System and method for inspecting a wafer SG164292A1 (en)

Priority Applications (24)

Application Number Priority Date Filing Date Title
SG200901109-9A SG164292A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer
KR1020100003272A KR101656045B1 (ko) 2009-01-13 2010-01-13 웨이퍼 검사 시스템 및 방법
TW102106188A TWI575626B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統及方法
EP18189616.8A EP3431968B1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
TW099100874A TWI575625B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統及方法
MYPI2010000166A MY169618A (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
CN201010004722.6A CN101783306B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
CN201310283291.5A CN103630549B (zh) 2009-01-13 2010-01-13 检测晶片的系统和方法
EP16207592.3A EP3173773A1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
EP14197439.4A EP2848923A1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
JP2011545326A JP6103171B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法
PCT/SG2010/000005 WO2010082901A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
EP10731445.2A EP2387795A4 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
US12/657,068 US10161881B2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
IL213915A IL213915B (he) 2009-01-13 2011-07-04 מערכת ושיטה לבדיקת מצע
KR1020130019364A KR101612535B1 (ko) 2009-01-13 2013-02-22 웨이퍼 검사 시스템 및 방법
IL225929A IL225929A0 (he) 2009-01-13 2013-04-24 מערכת ושיטה לפיקוח על פיצול נתחים
JP2013192270A JP2014016358A (ja) 2009-01-13 2013-09-17 ウェーハを検査するためのシステム及び方法
US13/998,046 US20150233840A1 (en) 2009-01-13 2013-09-25 System and method for inspecting a wafer
PH12013000288A PH12013000288A1 (en) 2009-01-13 2013-09-25 System and method for inspecting a wafer
JP2016140885A JP2016183978A (ja) 2009-01-13 2016-07-15 ウェーハを検査するためのシステム及び方法
IL259567A IL259567B (he) 2009-01-13 2018-05-23 מערכת ושיטה לבדיקת סובסטרט
US16/119,340 US10876975B2 (en) 2009-01-13 2018-08-31 System and method for inspecting a wafer
JP2018179667A JP6820891B2 (ja) 2009-01-13 2018-09-26 ウェーハの検査システム及び方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer
SG200901109-9A SG164292A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer

Publications (1)

Publication Number Publication Date
SG164292A1 true SG164292A1 (en) 2010-09-29

Family

ID=42340239

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200901109-9A SG164292A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer

Country Status (11)

Country Link
US (3) US10161881B2 (he)
EP (4) EP3173773A1 (he)
JP (4) JP6103171B2 (he)
KR (2) KR101656045B1 (he)
CN (2) CN101783306B (he)
IL (3) IL213915B (he)
MY (1) MY169618A (he)
PH (1) PH12013000288A1 (he)
SG (1) SG164292A1 (he)
TW (2) TWI575625B (he)
WO (1) WO2010082901A2 (he)

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