SG10201802469PA - Substrate Cutting Control and Inspection - Google Patents

Substrate Cutting Control and Inspection

Info

Publication number
SG10201802469PA
SG10201802469PA SG10201802469PA SG10201802469PA SG10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA SG 10201802469P A SG10201802469P A SG 10201802469PA
Authority
SG
Singapore
Prior art keywords
substrate
inspection
cutting control
stage
supported
Prior art date
Application number
SG10201802469PA
Inventor
Maykel Richard Van Der Stam Karel
Knippels Guido
Rifovich SUBKHANGULOV Ruslan
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of SG10201802469PA publication Critical patent/SG10201802469PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dicing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Laser Beam Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Substrate Cutting Control and Inspection A wafer substrate is inspected by illuminating it on both sides, and imaging light which has both been reflected from and transmitted through the substrate. The substrate is supported on a stage, and first and second illumination sources are arranged to respectively illuminate the first surface of the substrate supported by the stage and to illuminate the second surface of the substrate supported by the stage in use. At least one camera is adapted to image light received from the substrate when it is illuminated by the first illumination source and/or the second illumination source. Inspection may occur during a cutting process. (Figure 1A)
SG10201802469PA 2017-04-26 2018-03-26 Substrate Cutting Control and Inspection SG10201802469PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/497,754 US20180311762A1 (en) 2017-04-26 2017-04-26 Substrate cutting control and inspection

Publications (1)

Publication Number Publication Date
SG10201802469PA true SG10201802469PA (en) 2018-11-29

Family

ID=62062788

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802469PA SG10201802469PA (en) 2017-04-26 2018-03-26 Substrate Cutting Control and Inspection

Country Status (9)

Country Link
US (1) US20180311762A1 (en)
EP (1) EP3396706A1 (en)
JP (1) JP2018185309A (en)
KR (1) KR20180120115A (en)
CN (1) CN108788487A (en)
HK (1) HK1256117A1 (en)
PH (1) PH12018000113A1 (en)
SG (1) SG10201802469PA (en)
TW (1) TWI686603B (en)

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WO2018098398A1 (en) * 2016-11-25 2018-05-31 Glowforge Inc. Preset optical components in a computer numerically controlled machine
JP2019040919A (en) * 2017-08-22 2019-03-14 株式会社ディスコ Cutting machine and method for detecting groove
US10919111B2 (en) * 2018-12-05 2021-02-16 Robert Bosch Tool Corporation Laser engraver mirror adjustment system
KR102021033B1 (en) * 2019-03-25 2019-09-11 (주)제이스텍 Cutting method of CF film or TFT film using aligned rotary cutters and cutting of display panels for CF film or TFT film cuttin
KR102273359B1 (en) * 2020-12-04 2021-07-06 (주)네온테크 Dicing Device Capable, Manufacturing Method Thereof And Inspecting Method of Step Cut Electronic Chips
ES2921930A1 (en) * 2021-02-19 2022-09-02 Fund Tekniker MICRO-DRILLING MACHINE AND METHOD FOR MONITORING AND CONTROLLING SINGLE-PULSE LASER MICRO-DRILLING PROCESSES (Machine-translation by Google Translate, not legally binding)

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JPH08264488A (en) * 1995-03-22 1996-10-11 Nec Corp Wafer scribing apparatus and method
US6501061B1 (en) * 1999-04-27 2002-12-31 Gsi Lumonics Inc. Laser calibration apparatus and method
JP2001165632A (en) * 1999-12-03 2001-06-22 Sony Corp Inspection device and inspection method
JP2003098677A (en) * 2001-09-25 2003-04-04 Pentax Corp Aligner system
JP4049723B2 (en) * 2003-09-04 2008-02-20 沖電気工業株式会社 Nitride semiconductor device manufacturing method and nitride semiconductor device manufacturing apparatus
DE102004029212B4 (en) * 2004-06-16 2006-07-13 Leica Microsystems Semiconductor Gmbh Apparatus and method for optical inspection and / or transmitted light inspection of microstructures in the IR
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing
JP2008109015A (en) * 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd Method and apparatus for dividing semiconductor wafer
US20080220590A1 (en) * 2007-03-06 2008-09-11 Texas Instruments Incorporated Thin wafer dicing using UV laser
JP2009266636A (en) * 2008-04-25 2009-11-12 Imac Co Ltd Lighting system
TWM350825U (en) * 2008-06-06 2009-02-11 Universal Optoelectronics Co Ltd Cutting, measurement, and classification integration mechanism of light emitting element
KR101024932B1 (en) * 2008-12-29 2011-03-31 주식회사 포스코 Apprauts for decting defect
TW201143947A (en) 2009-12-07 2011-12-16 J P Sercel Associates Inc Laser machining and scribing systems and methods
WO2012115013A1 (en) 2011-02-25 2012-08-30 株式会社ニコン Inspecting apparatus and method for manufacturing semiconductor device
JP5789802B2 (en) * 2011-03-22 2015-10-07 株式会社ソシオネクスト Manufacturing method of semiconductor chip
CN202079354U (en) * 2011-05-04 2011-12-21 苏州天弘激光股份有限公司 Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system
US20130050468A1 (en) * 2011-08-22 2013-02-28 Camtek Ltd. Inspection system and a method for inspecting multiple wafers
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Also Published As

Publication number Publication date
JP2018185309A (en) 2018-11-22
CN108788487A (en) 2018-11-13
KR20180120115A (en) 2018-11-05
TW201839386A (en) 2018-11-01
TWI686603B (en) 2020-03-01
PH12018000113A1 (en) 2019-05-15
HK1256117A1 (en) 2019-09-13
EP3396706A1 (en) 2018-10-31
US20180311762A1 (en) 2018-11-01

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