CN202079354U - Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system - Google Patents
Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system Download PDFInfo
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- CN202079354U CN202079354U CN 201120137508 CN201120137508U CN202079354U CN 202079354 U CN202079354 U CN 202079354U CN 201120137508 CN201120137508 CN 201120137508 CN 201120137508 U CN201120137508 U CN 201120137508U CN 202079354 U CN202079354 U CN 202079354U
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- cutting machine
- workbench
- laser cutting
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Abstract
The utility model relates to a laser cutting machine with a CCD (Charge Coupled Device) automatic focusing system. The laser cutting machine comprises a machine head, a lifting table, a vertical guide rail and a workbench. The machine head is arranged on the lifting table, the lifting table is movably connected with the vertical guide rail, the machine head is provided with a laser head, a galvanometer scanner and a focus lens, the galvanometer scanner and the focus lens are matched for focusing a laser beam, the focal point of the laser beam faces to a machining point on the workbench by movement of the lifting table, and the focused laser beam is used for cutting machining. The laser cutting machine is characterized by further comprising a CCD camera 4, a verifying board and a CPU (Central Processing Unit) control system, wherein the CCD camera 4 is arranged on the lifting table, the verifying board is arranged on the workbench 6, and the CCD camera 4 is electrically connected with the CPU control system to transmit an images shot on the verifying board in a camera memory card to a CPU controller. The utility model provides a simple, convenient, fast and precise laser cutting machine with the CCD automatic focusing system. The laser cutting machine disclosed by the utility model can quickly and precisely find out CCD focal points in the process of changing workpieces of different heights.
Description
[technical field]
The present invention relates to aligning automatically, aim at or focusing on of laser beam, laser beam and workpiece have the device with laser beam processing of relative motion.
[background technology]
Laser cutting machine includes head, lifting platform, setting guide rail and workbench, head is loaded on the lifting platform, lifting platform links with the setting guide rail movably, laser head, galvanometer and focus lamp are arranged on the head, galvanometer and focus lamp cooperation focus on laser beam, the processing stand of the focus that cherry picker makes laser beam on the workbench carries out cutting processing with the laser beam after focusing on.Laser cutting machine is in process, and laser spot can't with the naked eye be judged, needs to use the CCD vision system to come workpiece is positioned and focusing usually.In this process, because the Level Change of processing work often needs the height of adjusting CCD to obtain imaging clearly and determines laser spot.The laser cutting machine of prior art is that the image that collects with manual observation CCD whether clear judges whether to be adjusted to pinpointed focus, because whether everyone really arrives to differentiate the most clearly for image certain difference is arranged all, so can cause equipment might not be in best focus place in the operation of different time sections or different operating personnel's operations by same individual, laser is focused on have artificial difference, brought the certain precision error for the location process of back.So conventional method has bigger defective: focus deterministic process complexity needs more skilled operating personnel.
[summary of the invention]
At the shortcoming of prior art, the object of the present invention is to provide a kind of succinctly, convenient, fast, have the laser cutting machine of CCD autofocus system accurately.Can be when changing the differing heights workpiece, fast, accurately find the CCD focus.
The technical solution adopted for the present invention to solve the technical problems is: a kind of laser cutting machine that has the CCD autofocus system, include head, lifting platform, erect guide rail and workbench, head is loaded on the lifting platform, lifting platform links with the setting guide rail movably, laser head is arranged on the head, galvanometer and focus lamp, galvanometer and focus lamp cooperation focus on laser beam, the processing stand of the focus that cherry picker makes laser beam on the workbench, carry out cutting processing with the laser beam after focusing on, it is characterized in that: also include the CCD camera, verification plate and system control cpu, described CCD camera is loaded on the lifting platform, described verification plate is loaded on workbench, and CCD camera and system control cpu electrical ties send to cpu controller with the image of clapping on the verification plate in the RAM card.
When carrying out focus adjustment, the verification plate is fixed on the workbench, cpu controller control lifting platform moves along erectting guide rail, and controls CCD at various height and gather a two field picture, carries out the definition evaluation then and calculates.Finally obtain the optimum height position of laser head, and the control lifting platform stays on the optimum position.Automatically obtain the pinpointed focus of CCD, realized that the CCD focus regulates automatically.
Described workbench can be vacuum aided absorption platform or the auxiliary absorption of magnetic platform.
[description of drawings]
The invention will be further described below in conjunction with accompanying drawing.
Accompanying drawing is a structural representation of the present invention;
Among the figure: 1 is that transmission system, 2 is that galvanometer, 4 is that CCD camera, 5 is that light source, 6 is workbench for erectting guide rail, 3.
Focus lamp is installed in galvanometer 3 belows,
Focus is determined not comprise in the drawings with the verification plate.
[specific embodiment]
Referring to accompanying drawing, a kind of laser cutting machine that has the CCD autofocus system of the present invention, include head, lifting platform, erect guide rail and workbench, head is loaded on the lifting platform, lifting platform links with the setting guide rail movably, laser head is arranged on the head, galvanometer and focus lamp, galvanometer and focus lamp cooperation focus on laser beam, the processing stand of the focus that cherry picker makes laser beam on the workbench, carry out cutting processing with the laser beam after focusing on, it is characterized in that: also include CCD camera 4, verification plate and system control cpu, described CCD camera 4 is loaded on the lifting platform, described verification plate is loaded on workbench 6, and CCD camera 4 sends to cpu controller with the system control cpu electrical ties with the image of being clapped on the verification plate in the camera RAM card.
In an embodiment of the present invention, described workbench is a vacuum aided absorption platform.Described system control cpu comprises image processing module and definition evaluation module.
Claims (3)
1. laser cutting machine that has the CCD autofocus system, include head, lifting platform, erect guide rail and workbench, head is loaded on the lifting platform, lifting platform links with the setting guide rail movably, laser head is arranged on the head, galvanometer and focus lamp, galvanometer and focus lamp cooperation focus on laser beam, the processing stand of the focus that cherry picker makes laser beam on the workbench, carry out cutting processing with the laser beam after focusing on, it is characterized in that: also include CCD camera (4), verification plate and system control cpu, described CCD camera (4) is loaded on the lifting platform, described verification plate is loaded on workbench (6), and CCD camera (4) sends to cpu controller with the system control cpu electrical ties with the image of being clapped on the verification plate in the camera RAM card.
2. the laser cutting machine that has the CCD autofocus system according to claim 1 is characterized in that: described workbench is a vacuum aided absorption platform.
3. the laser cutting machine that has the CCD autofocus system according to claim 1 and 2 is characterized in that: described system control cpu comprises image processing module and definition evaluation module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120137508 CN202079354U (en) | 2011-05-04 | 2011-05-04 | Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120137508 CN202079354U (en) | 2011-05-04 | 2011-05-04 | Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202079354U true CN202079354U (en) | 2011-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120137508 Expired - Fee Related CN202079354U (en) | 2011-05-04 | 2011-05-04 | Laser cutting machine with CCD (Charge Coupled Device) automatic focusing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202079354U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| TWI686603B (en) * | 2017-04-26 | 2020-03-01 | 新加坡商先進科技新加坡有限公司 | An inspection system for inspecting a substrate, substrate cutting apparatus, a method of inspecting a substrate and a substrate cutting process |
-
2011
- 2011-05-04 CN CN 201120137508 patent/CN202079354U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189333A (en) * | 2011-05-04 | 2011-09-21 | 苏州天弘激光股份有限公司 | Laser cutting machine with CCD automatic focusing system |
| TWI686603B (en) * | 2017-04-26 | 2020-03-01 | 新加坡商先進科技新加坡有限公司 | An inspection system for inspecting a substrate, substrate cutting apparatus, a method of inspecting a substrate and a substrate cutting process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20180504 |