M350825 八、新型說明： 【新型所屬之技術領域】 本創作有關於一種發光元件之切割量測分類整合機構 ，藉由將發光元件之切割、電測及分類步驟進行整合，而 有利於製程效率和發光元件品質的提升。 【先前技術】 隨著科技的不斷進步，發光二極體（Light Emitting Diode，LED)已然成為新一代的照明及顯示光源。在製程 中，主要是利用長晶等半導體技術形成一發光二極體晶片 ，並將發光二極體晶片設置在基板上，導通和膠材保護後 成為一發光二極體元件（簡稱發光元件），再以驅動電路對 發光元件進行供電，達到各種應用之目的。 在發光元件製造程序中，集合式發光元件支架在完成 發發二極體晶片的設置、打線及封膠製程後，會進行集合 1發光元ΐ支架分割的製程，也就是將集合式發光元件i 架分割成單—發光元件。—般而言集合式發光元件支架分 割製程有許多類型，例如油壓沖床、刀具_、雷射切割 和治具折斷等。分離完後的單—發光元件會進人光電量測 ΐ程’ ΐ電量測製料f包括光電量測和光電分類，分類 儿成的單一發光元件進行完包裝後即完成所有製程。 、目刖發光元件的光電量測製程主要是以震動盤或料管 方式進料。在以震動盤進料時主要是將分割後的單—發光 X件放置在震動盤上，而震動盤將會透過震動的方式進行 5 M350825 量測動集中與排列，以利於後續單-發光元件之 人工作業;方式=進料時則是將分割後的單-發光元件以 光電量料管内，以進行後續之自動化 件的量測上麵種方式都可以完成單-發光元 料管進料前需種畴方式還是有其關，例如以 在料管内部，因*/的方式將單—發光元件整齊的排放 而無法有效的提高量過程#中便需要大量的人工， 透過震動盤進料雖狹 花費的時間，然而在震動心m元件所 或基板的脆裂，單可能會造成發光二極體晶片 塵。此外單—發光;=件的膠體也容易㈣毛屑和灰 的形狀，亦二:::所=r單-發光元件 暢的移動。 發先兀件無法在震動盤上順 【新型内容】 本創作之主要目的，在於提供一種 測分類整合機構，主要俅彳Θ隹人1 件之切割1 集合式發光元件支架沿著既定 :!Γ 行集合式發光元件支架的分割動作 ，分割完成之單-發光元件 ^動作 會者权的路㈣動， v進仃早發先几件之光電量測及分類步驟。 本創作之次要目的，在於提供一種發光元件之切割量 6 M350825 測分類整合機構，其中在完成集合式發光元件支架的切割 動作，單一發光元件將會以有次序的方式排列在承載單元 上’並可直接對單一發光元件進行光電量測製程及入料動 作，藉此將可省去以人工方式將單一發光元件放入料管所 花費的時間。 本創作之又一目的，在於提供一種發光元件之切割量 測分類整合機構，主要是將集合式發光元件支架的分割製 程、光電量測製程及分類製程整合在同一個機台上，並以 同一個機台完成發光元件的切割、量測及分類，藉此將可 以增加自動化的程度，同時亦可減少人工的參予以提高產 品的可靠度。 本創作之又一目的’在於提供一種發光元件之切割量 測分類整合機構，其中集合式發光元件支架上設置有至少 一第一溝槽及至少一第二溝槽，而有利於以第一折斷治具 及第二折斷治具沿著第一溝槽及第二溝槽折斷集合式發光 元件支架。 本創作之又一目的，在於提供一種發光元件之切割量 測分類整合機構’主要以第—夾持單元及第二爽持單元對 集合式發光元件支架進行固定，並有利於折斷集合式發光 元件支架。 本創作之又一目的，在於提供一種發光元件之切割量 測分類整合機構，其巾承鮮福傾斜使得集合式發光元 件支架可以在機台上滑動。 為達成上述目的，本創作提供一種發光元件之切割量 7 M350825 測分類整合機構，包括有：―承鮮元， 集合式發光元件支架；一分割單元，< 夕一 用以將集合式發光元件支架進行分二’ !光元:’且單-發光元件以有次序的方=數 夺^用以對單一發光元件進行量測；及一 置測 以對單一發光元件進行分類。 几用 作尚提供一種發光元件之切割 ::法’包括有以下步驟：以-承載單元承載至少一隹ί 式發光元件支架；以一分割單元對集合 ^分割’而成為複數個單-發光元件二=光=進 有次序的m發光元件料往—量解 牛以 以量測單被序對單-發光元件 移動’並 元對單-發光元件騎分類。 4，仏—分類單 【實施方式】 請參閱第1圖，為本創作發光元件之 合機構-較佳實施例之立體示意圖。如圖所示$=類整 述之切割量測分類整合機構1G主要用以進行 ^所 凡件支架2。的切割、量測及分類，並 :::x么光 排列單-發光元件23的轉。 ’料人工方式 切割量測分類整合機構10主要包括有一承 _ 單::ΓΓ13、一量測單元15及一分類單元17早：1 =二 集合式發光元件支架20，集合ί 發先赠支架20可以是-集合式矩陣發光元件技21 ^ 8M350825 VIII. New Description: [New Technology Field] This paper is about a cutting measurement and classification integration mechanism for light-emitting components. It is beneficial to process efficiency by integrating the cutting, electrical measurement and classification steps of light-emitting components. The improvement of the quality of the light-emitting elements. [Prior Art] With the continuous advancement of technology, Light Emitting Diode (LED) has become a new generation of lighting and display light source. In the process, a light-emitting diode chip is formed by using semiconductor technology such as crystal growth, and the light-emitting diode chip is disposed on the substrate, and is turned on and protected by a rubber material to become a light-emitting diode element (referred to as a light-emitting element). Then, the driving circuit supplies power to the light-emitting elements for various purposes. In the manufacturing process of the light-emitting device, after the assembly, the wire bonding and the sealing process of the hair-emitting diode package are completed, the process of integrating the light-emitting element brackets, that is, the collective light-emitting element i is performed. The frame is divided into single-light-emitting elements. In general, there are many types of collective light-emitting component holders, such as hydraulic presses, cutters, laser cutting, and jig breaks. After the separation, the single-light-emitting component will enter the photoelectric measurement process. ΐ The electricity measurement material f includes photoelectric measurement and photoelectric classification, and the single light-emitting component classified into the finished product completes all the processes after packaging. The photoelectric measurement process for witnessing the light-emitting elements is mainly fed by a vibrating plate or a tube. When feeding with the vibrating plate, the divided single-lighting X pieces are mainly placed on the vibrating plate, and the vibrating plate will be concentrated and arranged by the vibration of the 5 M350825 to facilitate subsequent single-lighting elements. Manual operation; mode=when feeding, the divided single-light-emitting elements are placed in the photoelectric measuring tube to carry out the measurement of the subsequent automatic parts. The above-mentioned methods can complete the single-lighting element tube before feeding. There is still a need to do it in a variety of ways. For example, in the inside of the material tube, the single-light-emitting element is neatly discharged due to the */ method, and the amount of labor cannot be effectively increased. In this case, a large amount of labor is required, and the vibration is fed through the vibrating plate. The time spent in a narrow manner, however, in the case of shaking the core element or the chipping of the substrate, the single light may cause the light-emitting diode wafer dust. In addition, the single-lighting; = the colloid of the piece is also easy (four) the shape of the shavings and ash, also two::: = r single-lighting element smooth movement. The first thing that can't be done on the vibrating plate is the new content. The main purpose of this creation is to provide a measuring and sorting integration mechanism, which is mainly used to cut 1 piece of light-emitting component brackets along the established:!Γ The splitting action of the row-collecting light-emitting device holder, the dividing-completed single-light-emitting element^ the action of the right of the person (4), the v-input and the first-time photoelectric measurement and classification steps. The second objective of the present invention is to provide a cutting element 6 M350825 measuring and sorting integration mechanism in which the cutting action of the collective light-emitting element holder is completed, and a single light-emitting element will be arranged on the carrying unit in an orderly manner. The photoelectric measurement process and the feeding action of the single light-emitting element can be directly performed, thereby eliminating the time taken for manually placing the single light-emitting element into the material tube. Another object of the present invention is to provide a cutting measurement and classification integration mechanism for a light-emitting component, which mainly integrates a division process, a photoelectric measurement process and a classification process of the integrated light-emitting component holder on the same machine, and A machine completes the cutting, measuring and sorting of the illuminating elements, thereby increasing the degree of automation and reducing the reliability of the product by reducing the manual parameters. Another object of the present invention is to provide a cutting measurement and classification integration mechanism for a light-emitting component, wherein the collective light-emitting component holder is provided with at least one first groove and at least one second groove, which is advantageous for first breaking The jig and the second breaking fixture break the collective light-emitting element bracket along the first groove and the second groove. Another object of the present invention is to provide a cutting measurement and classification integration mechanism for a light-emitting component, which mainly fixes the integrated light-emitting component holder by the first clamping unit and the second cooling unit, and is advantageous for breaking the collective light-emitting component. support. Another object of the present invention is to provide a cutting and sorting and integrating mechanism for a light-emitting element, wherein the towel-like slanting tilt allows the collective light-emitting element holder to slide on the machine table. In order to achieve the above objectives, the present invention provides a cutting amount of a light-emitting element 7 M350825, a classification and integration mechanism, including: a fresh-keeping element, a collective light-emitting element holder; a dividing unit, < one for the collective light-emitting element The stent is divided into two '! light elements: 'and the single-light-emitting elements are measured in an orderly square=number for measuring a single light-emitting element; and one is placed to classify a single light-emitting element. The cutting method of the present invention includes the following steps: the method comprises the steps of: carrying at least one illuminating illuminating element holder by the carrying unit; and dividing the set by a dividing unit to form a plurality of single-light emitting elements. Two = light = enter the order of the m light-emitting elements to the amount of the cow to measure the order of the single-light-emitting element to move the 'single-to-single-light-emitting element to ride. 4, 仏-category list [Embodiment] Please refer to Fig. 1, which is a perspective view of a preferred embodiment of a light-emitting element assembly. As shown in the figure, the $= class of the cutting measurement and classification integration mechanism 1G is mainly used to carry out the workpiece support 2 . Cutting, measuring and sorting, and :::x light aligning the single-lighting element 23. The material manual cutting measurement and classification integration mechanism 10 mainly includes a bearing _ single:: ΓΓ 13, a measuring unit 15 and a sorting unit 17 early: 1 = two-collective light-emitting element bracket 20, a collection ί first gift bracket 20 Can be - collection matrix light-emitting element technology 21 ^ 8
、一在第—折斷治具131及第二折斷治具 133將集合式發 Ϊ兀:t支架2〇折斷成為單-發光元件23後，可進-步二 里測單兀15對單—發光元件23進行量測’例如量測單元 為光予積刀球(Optics Integrating Sphere)，並用以對 M350825 -集合式長條發g件支架22".#，例如在本實施例中集 合式發光το件支架2G為集合式矩陣發光元件支架21，並 將集合式_發光紐支架21整齊的排列在承載單元^ 分割單元13設置於該承載單元u上，用以將集合式 發光兀=支架2G進行分割’並成為複數個單—發光元件 1且單—發光元件23以有次序的方式排列，例如分割 早兀13可以是—折斷治具、—雷射切割器⑺，如第3圖 所示)或刀具，在本實施财分割單元13為一折斷 治具並沿著特定方向折斷集合式發光元件支架Μ，使得集 口式毛光π件支架2〇成單—發光元件23。例如折斷治具 包括有一第—折斷治具131及—第二折斷治具133,且第 一折斷治具131及第二折斷治具133皆設置在承載單元„ 上’並用以折斷集合式轉發光元件支架2卜例如第一折 斷治具131設置在承載單元η上，並沿著—第—方向X 折斷集合式矩陣發光元件支架2卜使得集合式矩陣發光元 件支架21成為—集合式長條發光元件支架μ ;而第二 斷治具133同#設置在承鮮元11上，沿著-第二方向丫 折長條發光元件支架22，並使得集合式長條發光 凡件支4 22成為—單-發光it件23。 9 M350825 單發光元件23的亮度進行量測。 集合式矩陣發光元件支架21 架22及單—發光元件23皆合集合式長條發光元件支 11上移動，·承_ 向X在承載單元 於水平面存在有a，使得歧置，且相對 2卜集合^絲料元件转22及1式_發光元件支架 第-方向X移動。當然在實 =用及= 件支架2G的㈣來調整承载單幻式發光元 式發光元件技2〇可㈣撕動。、肖a，使得集合 在以量測單元15完成單—旅 進-步以分類單元17對單^ ^ 23的量測後，可 量测單元15在對單一發光元行分類’例如 C未顯示)，並可將量測數據^ 控制分類單元17，藉此分類單元 理並進一步 行單一發光元件的分類。此外，將會依據量測數據進 單一發光元件23並沿著第二方向17可用以承载 光元件U送至特定的料i 該單一發 測的單一發光元件23。 从科$ 19收集完成量First, in the first-breaking jig 131 and the second breaking jig 133, the collective hairpin: t-bracket 2〇 is broken into a single-light-emitting element 23, and then the step-by-step measurement can be carried out. The component 23 is measured. For example, the measuring unit is an Optics Integrating Sphere, and is used for the M350825-collective strip e-bracket bracket 22".#, for example, in the embodiment, the collective illumination το The assembly bracket 2G is a collective matrix light-emitting element holder 21, and the collective-type light-emitting button holder 21 is arranged neatly on the carrying unit. The dividing unit 13 is disposed on the carrying unit u for performing the collective luminous unit=bracket 2G. Dividing 'and becoming a plurality of single-light-emitting elements 1 and the single-light-emitting elements 23 are arranged in an orderly manner, for example, dividing the early 13 can be a broken fixture, a laser cutter (7), as shown in FIG. 3) Or the cutter, in the present embodiment, the cutting unit 13 is a folding jig and breaks the collective light-emitting element holder 沿着 in a specific direction, so that the concentrating π-piece holder 2 is formed into a single-light-emitting element 23. For example, the breaking jig includes a first breaking jig 131 and a second breaking jig 133, and the first breaking jig 131 and the second breaking jig 133 are all disposed on the carrying unit „上′ and are used to break the collective turning light. The component holder 2, for example, the first breaking jig 131 is disposed on the carrying unit η, and breaks the collective matrix light-emitting element holder 2 along the first-direction X such that the collective matrix light-emitting element holder 21 becomes a collective strip light The component holder μ is disposed on the circumscribing element 11 and the long illuminating element holder 22 is folded along the second direction, and the collective strip illuminator member 4 22 becomes Single-lighting element 23. 9 M350825 The brightness of the single light-emitting element 23 is measured. The collective matrix light-emitting element holder 21 frame 22 and the single-light-emitting element 23 are all combined with the elongated light-emitting element branch 11, and the bearing _ There is a in the horizontal plane of the bearing unit in the X, so that the dislocation is made, and the relative direction of the 2nd assembly and the filament element 22 and the 1st _ illuminating element holder move in the first direction X. Of course, in the real = use and = bracket 2G (4) to adjust the bearing single illusion luminous element The illuminating element technology can be used to measure the measurement of the unit Φ 23, and the measurable unit 15 is in the pair. A single illuminant line classification 'for example, C is not displayed, and the measurement data ^ can be controlled by the classification unit 17, thereby classifying the unit and further classifying the single illuminating element. In addition, the measurement data will be input into the single illuminating element. 23 and along the second direction 17 can be used to carry the optical element U to a specific material i. The single detected single illuminating element 23. The completion amount is collected from the section $19.
切割量測分類整合機構1G 元Μ並設置於該承载單元u上，^包括有至少一夾持單 -第-夾持單元⑷及一第二夾持:如夾::單元14包括有 元⑷的設置位置相對應於第一^ 4 。第一夾持單 集合式矩陣發光元件支架21 ^样〜、⑶，並用以對 丁灭持，而有利於以第一 M350825 $斷治具m沿著第—方向x折斷集合式矩陣發光元件支 ^ ^’使得集合式矩陣發光元件支架21成為集合式長條 發光兀件支架22 ’例如第—折斷治具131可以進行第三^ 向z的作動，並折斷集合式矩陣發光元件支架21。 /第一折斷治具131折斷集合式矩陣發光元件支架21 後，亦可帶著集合式長條發光元件支架22沿著第一方向X ，行，移’而在第-折斷糾⑶進行位移時H持 早π 141所夾持的集合式矩陣發光元件支架21將會 第二方向Υ進行位移，例如第—夾持單元141可沿著第二 ::Υ將夾持的集合式矩陣發光元件支架21往第一折： =具m推送，並可以第一折斷治具131再次沿著第一方 恤㈣w集合式長 、切割量測分類整合機構1G包括有—第二夾持單元⑷The cutting measurement and sorting integration mechanism 1G is disposed on the carrying unit u, and includes at least one clamping single-first clamping unit (4) and a second clamping: such as a clamp: the unit 14 includes a component (4) The set position corresponds to the first ^4. The first clamping single-collector matrix light-emitting device bracket 21 ^ 〜 , (3), and is used for dicing, but is advantageous for breaking the collective matrix light-emitting component along the first direction by the first M350825 $. ^^' causes the collective matrix light-emitting element holder 21 to be an integrated long-length light-emitting element holder 22'. For example, the first-breaking jig 131 can perform the third-direction z-operation and break the collective matrix light-emitting element holder 21. / After the first breaking fixture 131 breaks the collective matrix light-emitting device holder 21, it is also possible to carry the collective elongated light-emitting element holder 22 along the first direction X, row, and shift, and when the first-breaking correction (3) is displaced The collective matrix light-emitting element holder 21 held by the H holding π 141 will be displaced in the second direction, for example, the first clamping unit 141 can clamp the collective matrix light-emitting element bracket along the second:: 21 to the first fold: = with m push, and the first break fixture 131 again along the first square shirt (four) w collective length, cutting measurement classification integration mechanism 1G includes - second clamping unit (4)
進^^第二祕單元143對集合式祕發光元件支架22 而有利於以第二折斷治具133沿著第二方向Y 23 長條發光元件支架22，使之成為單一發光元件 例如第二夹持單元143可設置在第二折斷治具出的 L牌f用以失持長條式發光元件22，而第二折斷治且 光元=三方向Z進行作動’並折斷集合式長條發 =閱第2A圖至第2 W，分別為集合式矩陣發光 牛^、集合式長條發光元件支架及單一發光元件之立 不忍圖。如圖所示，並請配合參閱第工圖，其中集合式 M350825 發光元件支架20可以是集合式矩陣發光元件支架21或集 合式長條發光元件支架22,且集合式發光元件支架2〇包 括有至少-溝槽26’例如集合式發光元件支架2()包括有 一基板25及複數個發光二極體晶片27，其中發光二極體 晶片27設置於基板25上並以矩陣方式排列。 上述之溝槽26可包括有至少一第一溝槽261及至少 一第二溝槽263，例如於基板25上設置有至少一第一溝槽 261及至少一第二溝槽263，其中第一溝槽261沿著第一 方向X设置，而第二溝槽263則沿著第二方向γ設置，且 第-方向X與第二方向γ為正交，如第2A圖所示，藉此 將有利於以第1圖所示之第一折斷治具131及第二折斷治 具133折斷集合式矩陣發光元件支架21。 在實際應用時可以沿著第一方向χ折斷集合式矩陣發 光元件支架21，並形成一集合式長條發光元件支架22， 如第2 Β圖所示。其中集合式長條發光元件支架22上設 置有至少一第一溝槽263，因此可沿著第二方向γ折斷集 合式長條發光元件支架22，以形成一單一發光元件23， 如第2 C圖所示。此外，在不同實施例中亦可選擇以各種 材質製作集合式發光元件支架20,例如集合式發光元件支 采20及基板25可選擇由陶瓷、鋁、鋁合金、銅、玻璃纖 維、高分子聚合物或高分子複合物等材質所製成。 請參閱第3圖’為本創作切割量測分類整合機構又一 實施例之立體示意圖。如圖所示，切割量測分類整合機構 30包括有一承載單元u、一雷射切割器33、一量測單元 12 M350825 15及一分類單元17。在本創作實施例中同樣是以承载單 70 11承載一集合式發光元件支架40,其中集合式發光元 件支架40可以是集合式矩陣發光元件支架41或集合式長 條發光元件支架42,並以雷射切割器33對集合式發光單 元支架40進行切割，而後再以量測單元15及分類單元 對單一發光元件43進行量測及分類。 由於本實施例中是以雷射切割器33沿著第一方向χ 及第二方向Υ對集合式發光元件支架40進行切割，使得 集合式發光元件支架40成為複數個單一發光元件，因此 集合式發光元件支架4G上不用如第2Α圖所示之集合式 矩陣發光件支架21 -般，需要於矩陣式基板％上設置 第/冓槽261及第二溝槽263。如第4圖所示，集合式發 光兀件支架4G包括有—基板45及複數個發光二極體晶片 27’其中發光一極體晶片27可以矩陣方式排列在基板乜The second secret unit 143 is advantageous for the collective secret light element holder 22 to extend the light-emitting element holder 22 along the second direction Y 23 by the second breaking fixture 133 to make it a single light-emitting element such as a second clip. The holding unit 143 can be disposed on the L-shaped f of the second breaking fixture for the loss of the elongated light-emitting element 22, and the second folding treatment and the optical element=three-direction Z to actuate and break the collective strip hair= Looking at the 2A to 2W, respectively, the collective matrix illuminating cow, the collective strip illuminating element holder and the single illuminating element can not stand. As shown in the figure, please refer to the drawing, wherein the collective M350825 illuminating element holder 20 can be a collective matrix illuminating element holder 21 or a collective strip illuminating element holder 22, and the concentrating illuminating element holder 2 〇 includes At least the trench 26', for example, the integrated light-emitting device holder 2 () includes a substrate 25 and a plurality of light-emitting diode wafers 27, wherein the light-emitting diode wafers 27 are disposed on the substrate 25 and arranged in a matrix. The trench 26 may include at least one first trench 261 and at least one second trench 263. For example, at least one first trench 261 and at least one second trench 263 are disposed on the substrate 25, wherein the first The groove 261 is disposed along the first direction X, and the second groove 263 is disposed along the second direction γ, and the first direction X and the second direction γ are orthogonal, as shown in FIG. 2A, thereby It is advantageous to break the collective matrix light-emitting element holder 21 by the first breaking jig 131 and the second breaking jig 133 shown in FIG. In practical applications, the collective matrix light-emitting device holder 21 can be broken in the first direction and form a collective elongated light-emitting device holder 22, as shown in Fig. 2. The aggregate strip light-emitting element holder 22 is provided with at least one first groove 263, so that the collective strip-shaped light-emitting element holder 22 can be broken along the second direction γ to form a single light-emitting element 23, such as the second C. The figure shows. In addition, in different embodiments, the collective light-emitting device holder 20 can be selected from various materials, for example, the integrated light-emitting device 20 and the substrate 25 can be selected from ceramic, aluminum, aluminum alloy, copper, glass fiber, and polymer. Made of materials or polymer composites. Please refer to Fig. 3' for a perspective view of another embodiment of the creation cutting measurement and classification integration mechanism. As shown, the cutting measurement classification integration mechanism 30 includes a carrier unit u, a laser cutter 33, a measuring unit 12 M350825 15 and a sorting unit 17. In the present embodiment, the collective light-emitting device holder 40 is also carried by the carrier unit 70 11 , wherein the collective light-emitting device holder 40 can be a collective matrix light-emitting device holder 41 or a collective elongated light-emitting device holder 42 . The laser cutter 33 cuts the collective light-emitting unit holder 40, and then measures and classifies the single light-emitting elements 43 by the measuring unit 15 and the sorting unit. In this embodiment, the collective light-emitting device holder 40 is cut along the first direction χ and the second direction 雷 by the laser cutter 33, so that the collective light-emitting device holder 40 becomes a plurality of single light-emitting elements, so The light-emitting element holder 4G does not need to have the collective matrix light-emitting device holder 21 as shown in Fig. 2, and it is necessary to provide the first groove 261 and the second groove 263 on the matrix substrate %. As shown in Fig. 4, the collective light-emitting device holder 4G includes a substrate 45 and a plurality of light-emitting diode wafers 27' in which the light-emitting one-pole wafers 27 are arranged in a matrix on the substrate.
上°㈣第2 Α®所述之集合式發光元件支架2G同樣可 以切割量測分類整合機構進行_、量測及分類。 此外，雷射切割器33的數量可以是一個或兩個，例 如雷射切割器33的數量為兩個’並分別為第-雷射切割 器331及第二雷射切割器333 ’其中第一雷射切割器331 用以對集合式轉發光元件支架41進行第—方向％的切 割並形成冑合式長條發光元件支架42 ;第二雷射切割 器333用以對集合式長條發光元件支架42進行第二方向γ 的切割，並形成—單-發光元件43。 切割里测分類整合機構3G亦可包括有至少一爽持單 13 M350825 〇14，例如夾持單元包括有—第—夾持單元⑷及一第二 143 ’並可以第—夾持單元141夾持及/或推送集 3 =光元件支架41，以第二夾持單元143夾持集合 式長條發光元件支架42，以利於切割步驟的進行。 人閱第5圖，為本創作發光元件之切割量測分類整 二驟流程圖。並請同時參閱第1圖，首先將至少 並^= 支架2G整齊的排列麵載單元11上， 所^承载早元U承載集合式發光元件支架2〇，如步驟51 7成集合式發光元件衫2G的 發光元:====割成複數個單- 將會有次序的排财承載單元步， 15移動，如步驟53所示。 w又彺置測單元 ”上二2:=:=自然的排列在承载單元 單一發光元件23進行測試各個排^整齊的 依序對測試完成的單一:光：;=分 :如!測單元15在完成單-發光元件23的4: 未顯示)至—軟體程式(未顯示里)ί軟= 式將會依據量測數據控制分類單元 ）：軟體程 幻的分類，並可以料管19 仃早一發光元件 23，如步驟55所示。 〃刀類凡成的單一發光元件 14 M350825 以上所述者，僅為本創作 來限定本創作實施之範®，g 施例而已’並非用 述之形狀、構造、特徵及精神所請專利範圍所 應包括於本創作之中請專利範^之轉變化與修飾’均 【圖式簡單說明】 第1圖：為本創作發統件之_相賴整合機構一較 佳實施例之立體示意圖。 ^A圖：為集合式矩陣發光树支架之立體示意圖。 弟2B圖：為集合式長條發光元件支架之立體示意圖。 第2 C圖：為單一發光元件之立體示意圖 第3圖：為本創作蝴㈣分類整合機構又—實施例之立 體示意圖 第4圖：為集合式發光元件支架之立體示意圖。 第5圖：為本創作發光元件之切割量測分類整合方法的步 驟流程圖。 【主要元件符號說明】 10 切割量測分類整合機構 11 承載單元 13 131 第一折斷治具 133 14 夾持單元 141 143 第二夾持單元 15 17 分類單元 19 分割單元 第二折斷治具 第一夾持單元 量測單元 料管 15 M350825The collective light-emitting device holder 2G described in the above (4) 2nd Α® can also be cut, measured, and classified by the measurement and classification mechanism. In addition, the number of the laser cutters 33 may be one or two, for example, the number of the laser cutters 33 is two 'and the first - the first laser cutter 331 and the second laser cutter 333 ' The laser cutter 331 is configured to perform the first direction of the collective rotation of the collective light-emitting component holder 41 and form the twisted elongated light-emitting component holder 42. The second laser cutter 333 is used for the collective elongated light-emitting component bracket. 42 performs cutting in the second direction γ, and forms a single-light-emitting element 43. The cutting and sorting integration mechanism 3G may further include at least one refreshing 13 M350825 〇14. For example, the clamping unit includes a first clamping unit (4) and a second 143 ′ and may be clamped by the first clamping unit 141. And/or the push set 3 = the light element holder 41, and the collective strip light-emitting element holder 42 is clamped by the second holding unit 143 to facilitate the cutting step. People read the fifth picture, which is a flow chart of the cutting measurement of the creative light-emitting element. Please also refer to FIG. 1 at the same time, firstly, at least the bracket 2G is arranged neatly on the surface carrying unit 11, and carries the early element U-bearing integrated light-emitting element bracket 2〇, as in step 51 7 into a collective light-emitting element shirt. 2G illuminating element: ==== cut into multiple orders - there will be a sequence of arranging the carrying unit steps, 15 moving, as shown in step 53. w 彺 彺 单元 ” 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上In the completion of the single-lighting element 23 4: not shown) to - software program (not shown) ί soft = type will control the classification unit according to the measurement data): software illusion classification, and can be tube 19 early A light-emitting element 23 is shown in step 55. A single light-emitting element 14 of the boring tool M350825 The above is only a limitation of the present invention by the creation of the creation, and the example is not the shape described. The scope of the patents required for the structure, characteristics and spirit should be included in the creation of the patent. Please change the changes and modifications of the patents. [Simplified description of the drawings] Figure 1: Integration of the creation of the creation A perspective view of a preferred embodiment of the mechanism. ^A: a perspective view of a collective matrix light-emitting tree support. 2B Figure: a perspective view of a collective elongated light-emitting element holder. Figure 2C: a single light-emitting element Stereoscopic diagram 3: Original creation (4) Classification and integration mechanism - Stereoscopic diagram of the embodiment FIG. 4 is a perspective view of the assembly of the illuminating element assembly. Fig. 5 is a flow chart showing the steps of the method for integrating the measurement and classification of the illuminating element. Description 10 cutting measurement and classification integration mechanism 11 carrying unit 13 131 first breaking fixture 133 14 clamping unit 141 143 second clamping unit 15 17 classification unit 19 division unit second breaking fixture first clamping unit measurement Unit material tube 15 M350825
20 集合式發光元件支架 21 集合式矩陣發光元件支架 22 集合式長條發光元件支架 23 單一發光元件 25 基板 26 溝槽 261 第一溝槽 263 第二溝槽 27 發光二極體晶片 30 切割量測分類整合機構 33 雷射切割器 331 第一雷射切割器 333 第二雷射切割器 40 集合式發光元件支架 41 集合式矩陣發光元件支架 42 集合式長條發光元件支架 43 單一發光元件 45 基板20 Collective light-emitting element holder 21 Collective matrix light-emitting element holder 22 Collective strip light-emitting element holder 23 Single light-emitting element 25 Substrate 26 Groove 261 First groove 263 Second groove 27 Light-emitting diode wafer 30 Cutting measurement Classification integration mechanism 33 laser cutter 331 first laser cutter 333 second laser cutter 40 collective light-emitting element holder 41 collective matrix light-emitting element holder 42 collective strip light-emitting element holder 43 single light-emitting element 45 substrate
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