SG160368A1 - Polishing pad and process for producing the same - Google Patents
Polishing pad and process for producing the sameInfo
- Publication number
- SG160368A1 SG160368A1 SG201001574-1A SG2010015741A SG160368A1 SG 160368 A1 SG160368 A1 SG 160368A1 SG 2010015741 A SG2010015741 A SG 2010015741A SG 160368 A1 SG160368 A1 SG 160368A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing pad
- producing
- same
- manufacturing
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 9
- 238000000034 method Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 abstract 3
- 238000012512 characterization method Methods 0.000 abstract 1
- 239000006260 foam Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 229920005749 polyurethane resin Polymers 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2101/00—Manufacture of cellular products
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polyurethanes Or Polyureas (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005063963 | 2005-03-08 | ||
JP2005081974 | 2005-03-22 | ||
JP2005081979 | 2005-03-22 | ||
JP2005163791 | 2005-06-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG160368A1 true SG160368A1 (en) | 2010-04-29 |
Family
ID=36953191
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201001584-0A SG160370A1 (en) | 2005-03-08 | 2006-02-27 | Polishing pad and process for producing the same |
SG201001582-4A SG160369A1 (en) | 2005-03-08 | 2006-02-27 | Polishing pad and process for producing the same |
SG201001574-1A SG160368A1 (en) | 2005-03-08 | 2006-02-27 | Polishing pad and process for producing the same |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG201001584-0A SG160370A1 (en) | 2005-03-08 | 2006-02-27 | Polishing pad and process for producing the same |
SG201001582-4A SG160369A1 (en) | 2005-03-08 | 2006-02-27 | Polishing pad and process for producing the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US8148441B2 (zh) |
KR (1) | KR100909605B1 (zh) |
CN (1) | CN101115779B (zh) |
MY (1) | MY146806A (zh) |
SG (3) | SG160370A1 (zh) |
TW (1) | TWI404736B (zh) |
WO (1) | WO2006095591A1 (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101134432B1 (ko) | 2005-05-17 | 2012-04-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
SG162794A1 (en) * | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
US8993648B2 (en) * | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
WO2008029537A1 (fr) * | 2006-09-08 | 2008-03-13 | Toyo Tire & Rubber Co., Ltd. | Procédé de production d'un tampon à polir |
CN102152232B (zh) | 2007-01-15 | 2013-06-26 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
JP5078000B2 (ja) * | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5074224B2 (ja) * | 2008-02-14 | 2012-11-14 | 東洋ゴム工業株式会社 | 研磨パッド、研磨パッドの製造方法、及び半導体デバイスの製造方法 |
JP4593643B2 (ja) * | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5526895B2 (ja) * | 2009-04-01 | 2014-06-18 | 信越化学工業株式会社 | 大型合成石英ガラス基板の製造方法 |
JP5528169B2 (ja) | 2010-03-26 | 2014-06-25 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
KR101491530B1 (ko) * | 2010-10-26 | 2015-02-09 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
WO2012056512A1 (ja) * | 2010-10-26 | 2012-05-03 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
CN102875769A (zh) * | 2011-07-15 | 2013-01-16 | 株式会社Lg化学 | 聚氨酯树脂组合物及聚氨酯支撑垫片 |
US9079289B2 (en) | 2011-09-22 | 2015-07-14 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5453507B1 (ja) * | 2012-10-31 | 2014-03-26 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
CN103554423B (zh) * | 2013-10-28 | 2016-05-25 | 南通润力机械制造有限公司 | 一种适于海洋柔性接头用改性聚氨酯橡胶的制备方法 |
JP6312471B2 (ja) * | 2014-03-14 | 2018-04-18 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 研磨パッド及びその製造方法 |
JP5871978B2 (ja) * | 2014-03-14 | 2016-03-01 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
CN106046313A (zh) * | 2016-06-03 | 2016-10-26 | 湖北鼎龙化学股份有限公司 | 一种化学机械抛光垫、缓冲层及其制备方法 |
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JP7331454B2 (ja) * | 2019-05-17 | 2023-08-23 | Dic株式会社 | 多孔体の製造方法 |
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KR102273097B1 (ko) * | 2019-10-23 | 2021-07-05 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
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US11772230B2 (en) * | 2021-01-21 | 2023-10-03 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith |
CN114452434A (zh) * | 2022-01-26 | 2022-05-10 | 武汉理工大学 | 一种广谱抗菌聚氨酯泡沫敷料及其制备方法和应用 |
Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291279A (ja) | 1988-09-29 | 1990-03-30 | Achilles Corp | 合成皮革及びその製造方法 |
GB9216631D0 (en) * | 1992-08-05 | 1992-09-16 | Ici Plc | Reaction system for preparing microcellular elastomers |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
JPH06220151A (ja) | 1993-01-22 | 1994-08-09 | Sanyo Chem Ind Ltd | 研磨材用ポリウレタン樹脂 |
JPH0871378A (ja) | 1994-09-09 | 1996-03-19 | Kanegafuchi Chem Ind Co Ltd | 中空糸膜ポッティング用ウレタン樹脂 |
US5614575A (en) | 1995-04-24 | 1997-03-25 | Rpg. Inc. | Sprayable polyurethane compositions |
US5587502A (en) | 1995-06-02 | 1996-12-24 | Minnesota Mining & Manufacturing Company | Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom |
DE69812127T2 (de) | 1997-04-04 | 2003-11-27 | Rodel Inc | Polierkissen und verfahren zu seiner herstellung |
KR100499601B1 (ko) | 1997-08-06 | 2005-07-07 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 개선된 연마용 패드 및 연마 방법 |
JP2000017252A (ja) | 1998-06-29 | 2000-01-18 | Dainippon Ink & Chem Inc | 研磨材組成物及びその研磨材 |
JP3516874B2 (ja) | 1998-12-15 | 2004-04-05 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
EP1161322A4 (en) | 1999-01-21 | 2003-09-24 | Rodel Inc | IMPROVED POLISHING CUSHIONS AND RELATED METHODS |
JP2000248034A (ja) | 1999-03-02 | 2000-09-12 | Mitsubishi Chemicals Corp | 研磨材用ポリウレタン系樹脂組成物及びその発泡体 |
JP3316756B2 (ja) | 1999-06-04 | 2002-08-19 | 富士紡績株式会社 | 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物 |
JP3880028B2 (ja) | 1999-08-06 | 2007-02-14 | Jsr株式会社 | 研磨パッド用重合体組成物及びそれを用いた研磨パッド |
JP3558273B2 (ja) | 1999-09-22 | 2004-08-25 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
JP4296655B2 (ja) | 1999-10-12 | 2009-07-15 | 東レ株式会社 | 半導体基板用研磨パッド |
JP2001277101A (ja) | 2000-03-28 | 2001-10-09 | Rodel Nitta Co | 研磨布 |
US6777455B2 (en) | 2000-06-13 | 2004-08-17 | Toyo Tire & Rubber Co., Ltd. | Process for producing polyurethane foam |
US20020016139A1 (en) | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
JP2003011066A (ja) | 2000-07-25 | 2003-01-15 | Ebara Corp | 研磨工具及びその製造方法 |
JP2002059358A (ja) | 2000-08-24 | 2002-02-26 | Toray Ind Inc | 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法 |
US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
US6641471B1 (en) | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
US6706383B1 (en) | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
JP2005503447A (ja) | 2001-01-24 | 2005-02-03 | ハンツマン・インターナショナル・エルエルシー | 短縮した金型滞留時間及び改良された品質で調製された成形発泡物品 |
JP3455187B2 (ja) | 2001-02-01 | 2003-10-14 | 東洋ゴム工業株式会社 | 研磨パッド用ポリウレタン発泡体の製造装置 |
JP2002239905A (ja) | 2001-02-21 | 2002-08-28 | Allied Material Corp | Cmp用パッドコンディショナー及びその製造方法 |
JP3956364B2 (ja) | 2001-04-09 | 2007-08-08 | 東洋ゴム工業株式会社 | ポリウレタン組成物および研磨パッド |
JP2003062748A (ja) | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
JP2003089051A (ja) | 2001-09-17 | 2003-03-25 | Tokyo Seimitsu Co Ltd | 研磨装置 |
JP3851135B2 (ja) | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | 研磨パッド |
JP3455208B2 (ja) | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
JP2003145414A (ja) | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
KR100877383B1 (ko) * | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
JP3325562B1 (ja) | 2001-12-07 | 2002-09-17 | 東洋ゴム工業株式会社 | 発泡ポリウレタン研磨パッドの製造方法 |
KR100467765B1 (ko) | 2002-02-04 | 2005-01-24 | 에스케이씨 주식회사 | 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물 |
JP2004167680A (ja) | 2002-05-20 | 2004-06-17 | Toyobo Co Ltd | 研磨パッド |
JP3571334B2 (ja) | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
JP4101584B2 (ja) * | 2002-08-09 | 2008-06-18 | 東洋ゴム工業株式会社 | 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド |
US7094811B2 (en) * | 2002-10-03 | 2006-08-22 | Bayer Corporation | Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol |
US8845852B2 (en) | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
JP4078643B2 (ja) * | 2002-12-10 | 2008-04-23 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法 |
JP4233319B2 (ja) | 2002-12-12 | 2009-03-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法及び研磨パッド |
JP3637568B2 (ja) | 2002-12-17 | 2005-04-13 | 大日本インキ化学工業株式会社 | 二液硬化型発泡砥石用ポリオール組成物、二液硬化型発泡砥石用組成物、発泡砥石、及び発泡砥石の製造法 |
US20040224622A1 (en) | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
JP4324785B2 (ja) | 2003-04-15 | 2009-09-02 | Jsr株式会社 | 研磨パッドの製造方法 |
JP2005052907A (ja) | 2003-08-07 | 2005-03-03 | Diatex Co Ltd | 研磨パッド用下地材 |
JP4189962B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
JP4189963B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4265366B2 (ja) | 2003-10-17 | 2009-05-20 | 日本ポリウレタン工業株式会社 | 軟質ポリウレタンフォームの製造方法 |
US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
TWI450911B (zh) | 2004-03-11 | 2014-09-01 | Toyo Tire & Rubber Co | Production method of polishing pad and semiconductor device (1) |
US20060089095A1 (en) | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
KR101134432B1 (ko) | 2005-05-17 | 2012-04-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
JP4884726B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
WO2007034980A1 (ja) | 2005-09-22 | 2007-03-29 | Kuraray Co., Ltd. | 高分子材料、それから得られる発泡体及びこれらを用いた研磨パッド |
JP5031236B2 (ja) | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
-
2006
- 2006-02-27 KR KR1020077018737A patent/KR100909605B1/ko active IP Right Grant
- 2006-02-27 US US11/794,284 patent/US8148441B2/en active Active
- 2006-02-27 CN CN2006800043975A patent/CN101115779B/zh active Active
- 2006-02-27 WO PCT/JP2006/303605 patent/WO2006095591A1/ja active Application Filing
- 2006-02-27 SG SG201001584-0A patent/SG160370A1/en unknown
- 2006-02-27 SG SG201001582-4A patent/SG160369A1/en unknown
- 2006-02-27 SG SG201001574-1A patent/SG160368A1/en unknown
- 2006-03-06 TW TW095107425A patent/TWI404736B/zh active
- 2006-03-07 MY MYPI20060951A patent/MY146806A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006095591A1 (ja) | 2006-09-14 |
CN101115779A (zh) | 2008-01-30 |
CN101115779B (zh) | 2012-09-19 |
TW200637877A (en) | 2006-11-01 |
TWI404736B (zh) | 2013-08-11 |
SG160370A1 (en) | 2010-04-29 |
KR20070094974A (ko) | 2007-09-27 |
US20080085943A1 (en) | 2008-04-10 |
US8148441B2 (en) | 2012-04-03 |
SG160369A1 (en) | 2010-04-29 |
MY146806A (en) | 2012-09-28 |
KR100909605B1 (ko) | 2009-07-27 |
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