SG158117A1 - Wafer support apparatus for electroplating process and method for using the same - Google Patents
Wafer support apparatus for electroplating process and method for using the sameInfo
- Publication number
- SG158117A1 SG158117A1 SG200908144-9A SG2009081449A SG158117A1 SG 158117 A1 SG158117 A1 SG 158117A1 SG 2009081449 A SG2009081449 A SG 2009081449A SG 158117 A1 SG158117 A1 SG 158117A1
- Authority
- SG
- Singapore
- Prior art keywords
- film layer
- wafer
- top film
- support apparatus
- wafer support
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/014,527 US7566390B2 (en) | 2004-12-15 | 2004-12-15 | Wafer support apparatus for electroplating process and method for using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG158117A1 true SG158117A1 (en) | 2010-01-29 |
Family
ID=36582511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200908144-9A SG158117A1 (en) | 2004-12-15 | 2005-12-05 | Wafer support apparatus for electroplating process and method for using the same |
Country Status (9)
Country | Link |
---|---|
US (2) | US7566390B2 (ko) |
EP (1) | EP1838905A2 (ko) |
JP (1) | JP5238261B2 (ko) |
KR (1) | KR100964132B1 (ko) |
CN (1) | CN101443485B (ko) |
MY (1) | MY147737A (ko) |
SG (1) | SG158117A1 (ko) |
TW (1) | TWI285928B (ko) |
WO (1) | WO2006065580A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007022016B3 (de) * | 2007-04-26 | 2008-09-11 | Ramgraber Gmbh | Galvanisierungsvorrichtung für flache, insbesondere scheibenförmige Gegenstände |
CN101348928B (zh) | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | 镀钯及镀钯合金之高速方法 |
US8188575B2 (en) * | 2010-10-05 | 2012-05-29 | Skyworks Solutions, Inc. | Apparatus and method for uniform metal plating |
US20130306465A1 (en) * | 2012-05-17 | 2013-11-21 | Applied Materials, Inc. | Seal rings in electrochemical processors |
US9689084B2 (en) | 2014-05-22 | 2017-06-27 | Globalfounries Inc. | Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101189A (ja) * | 1988-10-05 | 1990-04-12 | L Daburu Ii:Kk | 精密電気めっき方法及びその装置 |
JPH02153089A (ja) * | 1988-12-02 | 1990-06-12 | Hitachi Cable Ltd | ストライプめっき条の製造方法および装置 |
JPH0536698A (ja) * | 1991-07-31 | 1993-02-12 | Matsushita Electron Corp | ウエーハメツキ用治具 |
US5522975A (en) | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
JPH10251895A (ja) * | 1997-03-11 | 1998-09-22 | Dainippon Printing Co Ltd | リードフレームの部分めっき装置および部分めっき方法 |
US6090711A (en) | 1997-09-30 | 2000-07-18 | Semitool, Inc. | Methods for controlling semiconductor workpiece surface exposure to processing liquids |
JP2001518567A (ja) * | 1997-09-30 | 2001-10-16 | セミトウール・インコーポレーテツド | マイクロエレクトロニック部品の製造中プロセッシング液への加工物表面の暴露を制御するための装置及び方法 |
US6416647B1 (en) | 1998-04-21 | 2002-07-09 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
US6143155A (en) | 1998-06-11 | 2000-11-07 | Speedfam Ipec Corp. | Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly |
JP2003520898A (ja) | 1998-07-10 | 2003-07-08 | セミトゥール・インコーポレイテッド | 化学メッキ及び電気メッキを使って銅メッキを行うための方法及び装置 |
JP2000232078A (ja) | 1999-02-10 | 2000-08-22 | Toshiba Corp | メッキ方法及びメッキ装置 |
US6495005B1 (en) | 2000-05-01 | 2002-12-17 | International Business Machines Corporation | Electroplating apparatus |
US6488040B1 (en) * | 2000-06-30 | 2002-12-03 | Lam Research Corporation | Capillary proximity heads for single wafer cleaning and drying |
US7093375B2 (en) * | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US7153400B2 (en) * | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
US7704367B2 (en) * | 2004-06-28 | 2010-04-27 | Lam Research Corporation | Method and apparatus for plating semiconductor wafers |
US20070082299A1 (en) * | 2005-10-11 | 2007-04-12 | Lam Research Corp. | Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays |
-
2004
- 2004-12-15 US US11/014,527 patent/US7566390B2/en active Active
-
2005
- 2005-12-05 CN CN2005800483326A patent/CN101443485B/zh not_active Expired - Fee Related
- 2005-12-05 SG SG200908144-9A patent/SG158117A1/en unknown
- 2005-12-05 KR KR1020077015993A patent/KR100964132B1/ko not_active IP Right Cessation
- 2005-12-05 WO PCT/US2005/044047 patent/WO2006065580A2/en active Search and Examination
- 2005-12-05 JP JP2007546741A patent/JP5238261B2/ja not_active Expired - Fee Related
- 2005-12-05 EP EP05848890A patent/EP1838905A2/en not_active Withdrawn
- 2005-12-12 MY MYPI20055818A patent/MY147737A/en unknown
- 2005-12-15 TW TW094144451A patent/TWI285928B/zh not_active IP Right Cessation
-
2009
- 2009-06-23 US US12/490,239 patent/US7828951B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2006065580A2 (en) | 2006-06-22 |
TW200633068A (en) | 2006-09-16 |
US20090260992A1 (en) | 2009-10-22 |
US7828951B2 (en) | 2010-11-09 |
JP5238261B2 (ja) | 2013-07-17 |
CN101443485A (zh) | 2009-05-27 |
KR100964132B1 (ko) | 2010-06-16 |
KR20070088787A (ko) | 2007-08-29 |
EP1838905A2 (en) | 2007-10-03 |
TWI285928B (en) | 2007-08-21 |
MY147737A (en) | 2013-01-15 |
WO2006065580A3 (en) | 2008-11-13 |
US7566390B2 (en) | 2009-07-28 |
JP2008524847A (ja) | 2008-07-10 |
US20060124451A1 (en) | 2006-06-15 |
CN101443485B (zh) | 2011-03-30 |
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