SG118241A1 - Inspection coaxial probe and inspection unit incorporating the same - Google Patents
Inspection coaxial probe and inspection unit incorporating the sameInfo
- Publication number
- SG118241A1 SG118241A1 SG200402187A SG200402187A SG118241A1 SG 118241 A1 SG118241 A1 SG 118241A1 SG 200402187 A SG200402187 A SG 200402187A SG 200402187 A SG200402187 A SG 200402187A SG 118241 A1 SG118241 A1 SG 118241A1
- Authority
- SG
- Singapore
- Prior art keywords
- inspection
- same
- unit incorporating
- coaxial probe
- inspection unit
- Prior art date
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
- E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
- E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
- E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/28—Treatment of water, waste water, or sewage by sorption
- C02F1/283—Treatment of water, waste water, or sewage by sorption using coal, charred products, or inorganic mixtures containing them
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Ocean & Marine Engineering (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003121574A JP2004325306A (ja) | 2003-04-25 | 2003-04-25 | 検査用同軸プローブおよびそれを用いた検査ユニット |
Publications (1)
Publication Number | Publication Date |
---|---|
SG118241A1 true SG118241A1 (en) | 2006-01-27 |
Family
ID=32959695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200402187A SG118241A1 (en) | 2003-04-25 | 2004-04-22 | Inspection coaxial probe and inspection unit incorporating the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US7456645B2 (ko) |
EP (1) | EP1471358A3 (ko) |
JP (1) | JP2004325306A (ko) |
KR (1) | KR100638694B1 (ko) |
SG (1) | SG118241A1 (ko) |
Families Citing this family (50)
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JP4689196B2 (ja) * | 2003-11-05 | 2011-05-25 | 日本発條株式会社 | 導電性接触子ホルダ、導電性接触子ユニット |
JP4535828B2 (ja) | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | 検査ユニットの製法 |
JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
CN100535676C (zh) * | 2005-04-21 | 2009-09-02 | 株式会社光阳科技 | 检查夹具及检查装置 |
KR100679167B1 (ko) | 2005-07-15 | 2007-02-06 | (주)티에스이 | 동축케이블을 이용한 반도체 웨이퍼 테스트용 프로브 카드 |
JP2007178163A (ja) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | 検査ユニットおよびそれに用いる検査プローブ用外皮チューブ組立体 |
TWM309110U (en) * | 2006-07-13 | 2007-04-01 | Lih Duo Int Co Ltd | Testing card for wafer quality |
JPWO2008072699A1 (ja) * | 2006-12-15 | 2010-04-02 | 日本発條株式会社 | 導電性接触子ホルダおよび導電性接触子ユニット |
KR100880713B1 (ko) * | 2007-01-09 | 2009-02-02 | (주)기가레인 | 기판 실장형의 직각형 동축 코넥터 |
KR100846083B1 (ko) * | 2007-02-08 | 2008-07-14 | 이채갑 | 인쇄회로기판 검사용 프로브 조립체 |
KR100944259B1 (ko) * | 2007-11-23 | 2010-02-24 | 리노공업주식회사 | 반도체 칩 테스트용 검사 소켓 |
US20100311284A1 (en) * | 2007-12-06 | 2010-12-09 | Kenstronics (M) Sdn Bhd | Air gap contactor |
US7816932B2 (en) * | 2008-02-21 | 2010-10-19 | Teradyne, Inc. | Test system with high frequency interposer |
KR100985500B1 (ko) * | 2009-08-17 | 2010-10-26 | 리노공업주식회사 | 검사용 소켓 |
US9689897B2 (en) * | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
JP2013015508A (ja) * | 2011-06-06 | 2013-01-24 | Ricoh Co Ltd | 基板検査用治具及び基板検査方法 |
US8808010B2 (en) * | 2011-06-06 | 2014-08-19 | Interconnect Devices, Inc. | Insulated metal socket |
US8758066B2 (en) * | 2012-02-03 | 2014-06-24 | Interconnect Devices, Inc. | Electrical connector with insulation member |
TWI484201B (zh) * | 2013-07-09 | 2015-05-11 | Rato Technology Corp | Circuit board test device of the MDF module |
WO2015076360A1 (ja) * | 2013-11-22 | 2015-05-28 | 日本発條株式会社 | ソケット取付構造およびばね部材 |
EP3095159A4 (en) | 2014-01-17 | 2017-09-27 | Nuvotronics, Inc. | Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors |
KR101534778B1 (ko) * | 2014-01-24 | 2015-07-09 | 리노공업주식회사 | 검사장치 |
JP2016096297A (ja) * | 2014-11-17 | 2016-05-26 | イビデン株式会社 | 金属塊内蔵配線板及びその製造方法 |
JP6480798B2 (ja) | 2015-04-23 | 2019-03-13 | 株式会社ヨコオ | ソケット |
JP6641818B2 (ja) * | 2015-09-15 | 2020-02-05 | オムロン株式会社 | プローブピン、および、これを備えた検査治具 |
JP6601138B2 (ja) | 2015-10-16 | 2019-11-06 | 山一電機株式会社 | Icソケット |
JP2017142080A (ja) * | 2016-02-08 | 2017-08-17 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
JP6837283B2 (ja) * | 2016-02-29 | 2021-03-03 | 株式会社ヨコオ | ソケット |
DE102017004517A1 (de) * | 2017-03-14 | 2018-09-20 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Testsockel und Kontaktierungsvorrichtung zur Kontaktierung eines Hochfrequenzsignals |
US11221348B2 (en) | 2017-05-26 | 2022-01-11 | Smiths Interconnect Americas, Inc. | Impedance controlled test socket |
US11495901B2 (en) * | 2017-09-08 | 2022-11-08 | Enplas Corporation | Electric connection socket connecting a circuit board and an integrated circuit package |
KR101954086B1 (ko) * | 2017-11-07 | 2019-03-06 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
WO2019093614A1 (en) * | 2017-11-07 | 2019-05-16 | Leeno Industrial Inc. | A test probe assembly and test socket |
CN111316112B (zh) * | 2017-11-30 | 2022-08-09 | 恩普乐股份有限公司 | 电连接用插座 |
CN108802596A (zh) * | 2018-05-07 | 2018-11-13 | 北京中微普业科技有限公司 | 一种大功率芯片测试装置及其测试方法 |
CN108845241A (zh) * | 2018-05-07 | 2018-11-20 | 北京中微普业科技有限公司 | 一种大功率芯片测试用接地散热台及其测试方法 |
JP2020020660A (ja) * | 2018-07-31 | 2020-02-06 | 東京特殊電線株式会社 | 半導体デバイスの検査治具 |
JP2020020664A (ja) * | 2018-07-31 | 2020-02-06 | 東京特殊電線株式会社 | 半導体デバイスの検査治具 |
JP2020020661A (ja) * | 2018-07-31 | 2020-02-06 | 東京特殊電線株式会社 | 半導体デバイスの検査治具 |
KR102103746B1 (ko) * | 2018-11-12 | 2020-04-23 | 주식회사 오킨스전자 | 고주파(rf) 반도체 기기의 테스트 소켓 |
JP7206140B2 (ja) * | 2019-03-22 | 2023-01-17 | 株式会社ヨコオ | 検査装置 |
TWI679424B (zh) * | 2019-03-29 | 2019-12-11 | 矽品精密工業股份有限公司 | 檢測裝置及其製法 |
KR102073689B1 (ko) * | 2019-06-10 | 2020-03-02 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
CN110726918B (zh) * | 2019-09-25 | 2022-04-05 | 苏州韬盛电子科技有限公司 | 阻抗匹配结构的半导体芯片测试同轴插座及其制备方法 |
KR102455150B1 (ko) * | 2020-02-10 | 2022-10-18 | 주식회사 아이에스시 | 피검사 디바이스 검사용 테스트 소켓 |
WO2021162314A1 (ko) * | 2020-02-10 | 2021-08-19 | 주식회사 아이에스시 | 피검사 디바이스 검사용 테스트 소켓 |
KR102321112B1 (ko) * | 2020-05-22 | 2021-11-04 | 리노공업주식회사 | 검사소켓의 제조방법 |
KR102570428B1 (ko) * | 2020-05-22 | 2023-08-25 | 리노공업주식회사 | 검사소켓 및 그의 제조방법 |
CN112230025A (zh) * | 2020-11-05 | 2021-01-15 | 东莞中探探针有限公司 | 一种射频测试针及射频测试设备 |
KR102315536B1 (ko) | 2021-08-31 | 2021-10-21 | 하병호 | 검사소켓 및 그 제조방법 |
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JPS58219459A (ja) * | 1982-06-16 | 1983-12-20 | Hitachi Ltd | 導通接触端子 |
DE8629926U1 (de) * | 1986-11-08 | 1987-01-02 | Müller, Gerhard, 7750 Konstanz | Prüfeinrichtung mit federnden Prüfstiften zum Abtasten von elektrischen Verbindungen |
US4931726A (en) * | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
JPH0385456A (ja) | 1989-08-30 | 1991-04-10 | Hitachi Electron Eng Co Ltd | プローバ |
JP2572498B2 (ja) | 1991-10-29 | 1997-01-16 | 株式会社ジャパンエナジー | 高純度有機ホスフィン化合物の製造方法 |
US5302923A (en) | 1992-07-16 | 1994-04-12 | Hewlett-Packard Company | Interconnection plate having high frequency transmission line through paths |
JP2532331B2 (ja) * | 1992-11-09 | 1996-09-11 | 日本発条株式会社 | 導電性接触子 |
JPH08111438A (ja) | 1994-10-07 | 1996-04-30 | Aging Tesuta Kaihatsu Kyodo Kumiai | 集積回路素子用プローバ |
US5534787A (en) * | 1994-12-09 | 1996-07-09 | Vlsi Technology, Inc. | High-frequency coaxial interface test fixture |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
JPH10197559A (ja) | 1997-01-14 | 1998-07-31 | Organ Needle Co Ltd | スイッチプローブを備えたテストヘッド |
US6037787A (en) * | 1998-03-24 | 2000-03-14 | Teradyne, Inc. | High performance probe interface for automatic test equipment |
DE69923194T2 (de) * | 1998-07-10 | 2005-12-29 | NHK Spring Co., Ltd., Yokohama | Leitfähiger kontakt |
US6102709A (en) * | 1999-03-31 | 2000-08-15 | Raytheon Company | Threaded double sided compressed wire bundle connector |
KR100664422B1 (ko) * | 1999-05-28 | 2007-01-04 | 닛폰 하츠죠 가부시키가이샤 | 도전성 접촉자 |
JP2001099889A (ja) | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | 高周波回路の検査装置 |
US6264476B1 (en) * | 1999-12-09 | 2001-07-24 | High Connection Density, Inc. | Wire segment based interposer for high frequency electrical connection |
JP2002107408A (ja) | 2000-09-28 | 2002-04-10 | Toshiba Corp | Bga用高周波ソケット |
US6776623B1 (en) | 2001-06-11 | 2004-08-17 | Picolight Incorporated | Transceiver mounting adapters |
US6844749B2 (en) | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
US6784679B2 (en) * | 2002-09-30 | 2004-08-31 | Teradyne, Inc. | Differential coaxial contact array for high-density, high-speed signals |
JP4242199B2 (ja) * | 2003-04-25 | 2009-03-18 | 株式会社ヨコオ | Icソケット |
-
2003
- 2003-04-25 JP JP2003121574A patent/JP2004325306A/ja active Pending
-
2004
- 2004-04-16 EP EP04009154A patent/EP1471358A3/en not_active Withdrawn
- 2004-04-22 SG SG200402187A patent/SG118241A1/en unknown
- 2004-04-23 US US10/830,220 patent/US7456645B2/en active Active
- 2004-04-23 KR KR1020040028276A patent/KR100638694B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2004325306A (ja) | 2004-11-18 |
EP1471358A2 (en) | 2004-10-27 |
US7456645B2 (en) | 2008-11-25 |
KR20040093023A (ko) | 2004-11-04 |
EP1471358A3 (en) | 2012-11-07 |
KR100638694B1 (ko) | 2006-10-30 |
US20040212381A1 (en) | 2004-10-28 |
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