SG117561A1 - Apparatus and method for semiconductor chip detachment - Google Patents

Apparatus and method for semiconductor chip detachment

Info

Publication number
SG117561A1
SG117561A1 SG200502873A SG200502873A SG117561A1 SG 117561 A1 SG117561 A1 SG 117561A1 SG 200502873 A SG200502873 A SG 200502873A SG 200502873 A SG200502873 A SG 200502873A SG 117561 A1 SG117561 A1 SG 117561A1
Authority
SG
Singapore
Prior art keywords
semiconductor chip
chip detachment
detachment
semiconductor
chip
Prior art date
Application number
SG200502873A
Other languages
English (en)
Inventor
Yiu Ming Cheung
Liu Chou Kee Yiu Ching H Peter
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG117561A1 publication Critical patent/SG117561A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/943—Means for delaminating semiconductive product with poking delaminating means, e.g. jabbing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
SG200502873A 2004-05-11 2005-05-04 Apparatus and method for semiconductor chip detachment SG117561A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/843,826 US7240422B2 (en) 2004-05-11 2004-05-11 Apparatus for semiconductor chip detachment

Publications (1)

Publication Number Publication Date
SG117561A1 true SG117561A1 (en) 2005-12-29

Family

ID=34978636

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502873A SG117561A1 (en) 2004-05-11 2005-05-04 Apparatus and method for semiconductor chip detachment

Country Status (7)

Country Link
US (1) US7240422B2 (fr)
EP (1) EP1596422B1 (fr)
JP (1) JP4515326B2 (fr)
KR (1) KR100701814B1 (fr)
CN (1) CN100373536C (fr)
SG (1) SG117561A1 (fr)
TW (1) TWI254349B (fr)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306695B2 (en) * 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
KR100930178B1 (ko) * 2004-01-15 2009-12-07 인터내셔널 비지네스 머신즈 코포레이션 온 칩 시스템
EP1587138B1 (fr) * 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Dispositif pour la montage de de puces semiconductrices et procédé de séparer de puces semiconductries d'une feuille
US20060137828A1 (en) * 2004-05-31 2006-06-29 Kabushiki Kaisha Shinkawa Die pickup apparatus
US7303647B2 (en) * 2004-10-29 2007-12-04 Asm Assembly Automation Ltd. Driving mechanism for chip detachment apparatus
US20060258051A1 (en) * 2005-05-10 2006-11-16 Texas Instruments Incorporated Method and system for solder die attach
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
US7665204B2 (en) * 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
SG144767A1 (en) * 2007-01-23 2008-08-28 Micron Technology Inc Methods and systems for processing semiconductor workpieces
JP5160135B2 (ja) * 2007-04-18 2013-03-13 キヤノンマシナリー株式会社 半導体装置の製造装置及び製造方法
KR20090012808A (ko) * 2007-07-31 2009-02-04 삼성전자주식회사 칩 분리 장치 및 방법
US7757742B2 (en) * 2007-07-31 2010-07-20 Asm Assembly Automation Ltd Vibration-induced die detachment system
JP2009064938A (ja) * 2007-09-06 2009-03-26 Shinkawa Ltd 半導体ダイのピックアップ装置及びピックアップ方法
JP2009064937A (ja) * 2007-09-06 2009-03-26 Shinkawa Ltd 半導体ダイのピックアップ装置及びピックアップ方法
KR101015027B1 (ko) * 2008-07-28 2011-02-16 주식회사 탑 엔지니어링 칩 픽킹 업 방법
WO2009109447A2 (fr) * 2008-02-29 2009-09-11 Oerlikon Assembly Equipment Ag, Steinhausen Éjecteur de puce
JP2010062472A (ja) * 2008-09-05 2010-03-18 Nec Electronics Corp 半導体チップのピックアップ装置およびこれを用いた半導体チップのピックアップ方法
JP4215818B1 (ja) * 2008-06-30 2009-01-28 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5075770B2 (ja) * 2008-09-05 2012-11-21 ルネサスエレクトロニクス株式会社 半導体チップのピックアップ装置およびこれを用いた半導体チップのピックアップ方法
JP5075769B2 (ja) * 2008-09-05 2012-11-21 ルネサスエレクトロニクス株式会社 半導体チップのピックアップ装置およびこれを用いた半導体チップのピックアップ方法
WO2010052760A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, procédé de fabrication de dispositif semi-conducteur et appareil de décollement de puce
JP5184303B2 (ja) * 2008-11-04 2013-04-17 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP5284040B2 (ja) * 2008-11-04 2013-09-11 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP4704516B2 (ja) * 2008-11-04 2011-06-15 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP4668361B2 (ja) * 2008-11-04 2011-04-13 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法
MY150953A (en) * 2008-11-05 2014-03-31 Esec Ag Die-ejector
JP2012508460A (ja) * 2008-11-12 2012-04-05 エセック アーゲー フォイルからの半導体チップの剥離及び取外し方法
SG163493A1 (en) * 2009-01-22 2010-08-30 Esec Ag Die ejector
JP4397429B1 (ja) * 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
CN102044404B (zh) * 2009-10-12 2015-12-09 桑迪士克科技公司 用于使经切分的半导体裸片与裸片贴胶带分离的系统
JP5616047B2 (ja) * 2009-10-19 2014-10-29 株式会社アドバンテスト 製造装置、試験装置、製造方法および集積回路パッケージ
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP5381821B2 (ja) 2010-03-10 2014-01-08 三菱電機株式会社 保護テープ剥離方法および保護テープ剥離装置
JP4927979B2 (ja) * 2010-09-28 2012-05-09 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
FR2986175A1 (fr) * 2012-01-31 2013-08-02 St Microelectronics Tours Sas Procede et dispositif de decoupe d'une plaquette
WO2013171869A1 (fr) * 2012-05-17 2013-11-21 富士機械製造株式会社 Appareil de décollement de puce
KR101350642B1 (ko) * 2012-05-22 2014-01-16 세메스 주식회사 다이 이젝팅 방법, 다이 이젝팅 유닛 및 다이 픽업 장치
KR101435253B1 (ko) * 2012-05-22 2014-08-28 세메스 주식회사 다이 이젝팅 방법, 다이 이젝팅 유닛 및 다이 픽업 장치
WO2014051622A1 (fr) * 2012-09-28 2014-04-03 Hewlett-Packard Development Company, L.P. Contrôleurs graphiques sélectionnables pour afficher une sortie
CH707236B1 (de) * 2012-11-23 2016-10-31 Besi Switzerland Ag Verfahren zum Ablösen von Halbleiterchips von einer Folie.
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101503018B1 (ko) * 2013-08-20 2015-03-17 주식회사 프로텍 Led 칩용 형광 필름 픽업 장치
JP2015065367A (ja) * 2013-09-26 2015-04-09 株式会社テセック 剥離装置およびピックアップシステム
JP2015184162A (ja) * 2014-03-25 2015-10-22 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN103871936B (zh) * 2014-03-27 2016-11-02 上海华力微电子有限公司 分离上电极与冷却盘的装置
CN104576460A (zh) * 2014-12-31 2015-04-29 苏州凯锝微电子有限公司 一种晶圆切割分离装置
KR101683398B1 (ko) * 2015-10-02 2016-12-07 주식회사 프로텍 칩 디테칭 장치 및 칩 디테칭 방법
CN105428297B (zh) * 2015-12-16 2018-11-09 烟台知兴知识产权咨询服务有限公司 一种用于pss衬底晶片快速分裂承载装置及其方法
CN105514301B (zh) * 2016-01-21 2017-10-24 武汉华星光电技术有限公司 蒸镀装置及蒸镀方法
KR101694748B1 (ko) * 2016-06-15 2017-01-12 제너셈(주) Emi 실드용 반도체패키지의 탈착 하우징
JP6843725B2 (ja) * 2017-10-11 2021-03-17 三菱電機株式会社 半導体ピックアップ装置
JP2019140232A (ja) * 2018-02-09 2019-08-22 トヨタ自動車株式会社 剥離装置
KR102700207B1 (ko) * 2019-03-12 2024-08-28 삼성전자주식회사 칩 이젝팅 장치
KR102245805B1 (ko) * 2019-07-18 2021-04-28 세메스 주식회사 다이 이젝터 및 이를 포함하는 다이 픽업 장치
KR20210009843A (ko) * 2019-07-18 2021-01-27 세메스 주식회사 다이 픽업 방법
JP7443183B2 (ja) * 2020-07-22 2024-03-05 キヤノンマシナリー株式会社 ピックアップ装置およびピックアップ方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607485Y2 (ja) * 1979-10-12 1985-03-13 日本電気ホームエレクトロニクス株式会社 半導体素子の剥離装置
US4296542A (en) * 1980-07-11 1981-10-27 Presco, Inc. Control of small parts in a manufacturing operation
US4778362A (en) * 1986-12-29 1988-10-18 Compression Technologies, Inc. Outer envelope trochoidal rotary device having a two piece rotor assembly
JPH04174535A (ja) * 1990-11-07 1992-06-22 Nec Corp 半導体素子のピックアップ装置
JP3243391B2 (ja) * 1995-03-17 2002-01-07 岩手東芝エレクトロニクス株式会社 半導体製造装置
JP3498877B2 (ja) * 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
KR100278137B1 (ko) * 1997-09-04 2001-01-15 가나이 쓰도무 반도체소자의 탑재방법 및 그 시스템, 반도체소자 분리장치 및ic카드의 제조방법
US6123800A (en) * 1998-08-04 2000-09-26 Lucent Technologies, Inc. Method and apparatus for handling element on an adhesive film
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
US6165310A (en) * 1998-09-29 2000-12-26 Lucent Technologies Inc. Apparatus and method for removing parts from an adhesive film
JP2990197B1 (ja) * 1999-01-20 1999-12-13 熊本日本電気株式会社 半導体チップのピックアップ装置
US6204092B1 (en) * 1999-04-13 2001-03-20 Lucent Technologies, Inc. Apparatus and method for transferring semiconductor die to a carrier
US6290805B1 (en) * 1999-09-17 2001-09-18 Agere Systems Optoelectronics Guardian Corp. System and method for using a pick and place apparatus
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
JP2003224088A (ja) * 2002-01-29 2003-08-08 Nec Electronics Corp 半導体チップピックアップ装置
JP3945632B2 (ja) * 2002-02-06 2007-07-18 シャープ株式会社 チップのピックアップ装置、その製造方法、及び半導体製造装置
US6889427B2 (en) * 2002-02-15 2005-05-10 Freescale Semiconductor, Inc. Process for disengaging semiconductor die from an adhesive film
JP3861710B2 (ja) * 2002-02-15 2006-12-20 松下電器産業株式会社 電子部品供給装置および電子部品実装装置
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法

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EP1596422A3 (fr) 2009-11-11
TW200537588A (en) 2005-11-16
EP1596422A2 (fr) 2005-11-16
KR20060046000A (ko) 2006-05-17
JP2005328054A (ja) 2005-11-24
TWI254349B (en) 2006-05-01
US7240422B2 (en) 2007-07-10
JP4515326B2 (ja) 2010-07-28
KR100701814B1 (ko) 2007-04-02
EP1596422B1 (fr) 2012-08-01
CN1700412A (zh) 2005-11-23
US20050255673A1 (en) 2005-11-17
CN100373536C (zh) 2008-03-05

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