SG11202111144YA - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
SG11202111144YA
SG11202111144YA SG11202111144YA SG11202111144YA SG11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA
Authority
SG
Singapore
Prior art keywords
die
electronic component
bonding
semiconductor die
transfer
Prior art date
Application number
SG11202111144YA
Other languages
English (en)
Inventor
Shigeyuki Sekiguchi
Yuji Eguchi
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202111144YA publication Critical patent/SG11202111144YA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG11202111144YA 2019-04-11 2020-04-07 Bonding apparatus SG11202111144YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019075412 2019-04-11
PCT/JP2020/015746 WO2020209269A1 (ja) 2019-04-11 2020-04-07 ボンディング装置

Publications (1)

Publication Number Publication Date
SG11202111144YA true SG11202111144YA (en) 2021-11-29

Family

ID=72751115

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111144YA SG11202111144YA (en) 2019-04-11 2020-04-07 Bonding apparatus

Country Status (7)

Country Link
US (1) US11749541B2 (https=)
JP (1) JP7205941B2 (https=)
KR (1) KR102708943B1 (https=)
CN (1) CN113661564B (https=)
SG (1) SG11202111144YA (https=)
TW (1) TWI734434B (https=)
WO (1) WO2020209269A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
CN119174300A (zh) * 2022-07-26 2024-12-20 雅马哈发动机株式会社 表面安装机和表面安装方法
US20240375251A1 (en) * 2023-05-10 2024-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonding system and die bonding method using the same
CN121487542B (zh) * 2026-01-07 2026-04-07 大连佳峰自动化股份有限公司 一种半导体贴片上料装置及方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
CH693229A5 (de) * 1997-04-30 2003-04-30 Esec Tradingsa Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat.
KR100252317B1 (ko) * 1997-10-30 2000-04-15 윤종용 리드 프레임의 다이 본딩장치
US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP2011035178A (ja) * 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) * 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
CN104604356B (zh) 2012-09-06 2017-05-17 富士机械制造株式会社 元件安装机的控制系统和控制方法
JP6105608B2 (ja) * 2012-09-28 2017-03-29 富士機械製造株式会社 対基板作業機
WO2015075832A1 (ja) * 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
JP6343199B2 (ja) * 2014-07-28 2018-06-13 株式会社Ｆｕｊｉ 通信システム、実装機及び通信データ処理方法
US10199254B2 (en) * 2015-05-12 2019-02-05 Nexperia B.V. Method and system for transferring semiconductor devices from a wafer to a carrier structure
JP6622306B2 (ja) 2015-06-26 2019-12-18 株式会社Ｆｕｊｉ 部品実装機
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元
JP6573289B2 (ja) * 2016-01-06 2019-09-11 ヤマハモーターロボティクスホールディングス株式会社 電子部品実装装置
GB2549250B (en) * 2016-02-15 2021-06-30 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR102047035B1 (ko) * 2017-09-25 2019-11-20 세메스 주식회사 다이 본딩 장치
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

Also Published As

Publication number Publication date
KR20210144881A (ko) 2021-11-30
CN113661564B (zh) 2024-03-01
JPWO2020209269A1 (https=) 2020-10-15
WO2020209269A1 (ja) 2020-10-15
US11749541B2 (en) 2023-09-05
TWI734434B (zh) 2021-07-21
TW202041138A (zh) 2020-11-01
JP7205941B2 (ja) 2023-01-17
US20220165591A1 (en) 2022-05-26
CN113661564A (zh) 2021-11-16
KR102708943B1 (ko) 2024-09-25

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