TWI632626B - Electronic parts processing unit - Google Patents

Electronic parts processing unit Download PDF

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TWI632626B
TWI632626B TW105137225A TW105137225A TWI632626B TW I632626 B TWI632626 B TW I632626B TW 105137225 A TW105137225 A TW 105137225A TW 105137225 A TW105137225 A TW 105137225A TW I632626 B TWI632626 B TW I632626B
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semiconductor wafer
pickup
tool
flip
processing unit
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TW105137225A
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TW201730993A (zh
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瀬山耕平
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日商新川股份有限公司
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract

本發明提供一種可利用簡便之構成，於使所拾取之半導體晶片列翻轉之同時變更其排列方向之電子零件處理單元。本發明為電子零件處理單元30，包括：本體31，安裝於本體31之旋轉軸32，安裝於旋轉軸32之倒裝頭40，以及安裝於本體31且使旋轉軸32旋轉並使倒裝頭40翻轉之步進馬達36，倒裝頭40具有：連接於旋轉軸32之基底41，以及以排列方向相對於旋轉軸32之延伸之方向傾斜45°之方式呈直線狀安裝於基底41之複數個拾取噴嘴42。

Description

電子零件處理單元
本發明係關於一種將半導體晶片等電子零件構裝於電路基板之電子零件構裝裝置中所使用的電子零件處理單元之構造。
作為將半導體晶片構裝於電路基板之方法，多使用倒裝晶片接合方法。該方法為如下方法，即，利用焊料等於半導體晶片形成凸塊，自晶圓拾取半導體晶片且使其翻轉，使半導體晶片之與凸塊相反側之面吸附於接合工具，藉由接合工具將半導體晶片之凸塊熱壓接至電路基板之電極而將凸塊與電路基板之電極接合(例如參照專利文獻1)。
作為使用此種倒裝晶片接合方法將半導體晶片構裝於電路基板之裝置，使用倒裝晶片接合機(倒裝晶片接合裝置)(例如參照專利文獻2)。專利文獻2所記載之倒裝晶片接合機900如圖8所示，包括：供給構裝於電路基板912之半導體晶片910之晶片供給部901，自晶圓911拾取半導體晶片910之拾取部902，使所拾取之半導體晶片910翻轉之翻轉機構903，接收經翻轉之半導體晶片910並將其接合於電路基板912之接合部904，對電路基板912與半導體晶片910之圖像進行攝像之相機908，以及搬送電路基板912之搬送部915。晶片供給部901、拾取部902、翻轉機構903、接合部904係於Y方向上配置成一行。晶片供給部901具備將間距擴大之半導體晶片910上推之上推單元909。而且，拾取部902包括吸附半導體晶 片910之拾取工具905、及將拾取工具905沿Z方向驅動之拾取頭902a，接合部904包括接合半導體晶片910之接合工具906、及將接合工具906沿Z方向驅動之接合頭904a。拾取頭902a與接合頭904a藉由Y方向驅動機構907而沿Y方向移動。
[先前技術文獻] [專利文獻]
[專利文獻1]日本專利第4840862號公報
[專利文獻2]日本特開2015-60924號公報
近年來，更強烈地要求倒裝晶片接合裝置之設置面積之省空間化與接合之高速化。作為實現其之方法，考慮圖9所示之倒裝晶片接合裝置950。另外，圖9中，對與圖8相同之部位附上相同之符號並省略說明。圖9所示之倒裝晶片接合裝置950分別搭載有2個接合頭904a及接合工具906、以及2個拾取頭902a及拾取工具905，並且於搬送部915之Y方向負側配置有晶片供給部901、拾取部902、以及使拾取頭902a沿X方向移動之X方向驅動機構957。2個拾取頭902a沿X方向驅動機構957而於X方向上並列配置有2個，2個接合頭904a沿Y方向驅動機構907而於Y方向上並列配置有2個。而且，翻轉機構953如圖10所示，包括：使拾取頭902a翻轉之翻轉部953a，以及使經翻轉之拾取頭902a於水平面內旋轉90°之旋轉部953b。
一面參照圖10，一面對應用了先前技術之倒裝晶片接合裝置950之動作進行簡單說明。如圖10(a)、(c)所示，首先，使2個拾取頭902a沿X方向移動，利用各拾取工具905分別拾取半導體晶片910。拾取了半導體晶片910後，使2個拾取頭902a沿X方向移動至翻轉機構953為止。此時，2個拾取頭902a及拾取工具905於X方向上並列。如圖10(b)、(c)所示，翻轉機構953藉由翻轉部953a使2個拾取頭902a與拾取工具905繞X軸旋轉180°而翻轉，並且藉由旋轉部953b使2個拾取頭902a與拾取工具905之並列方向自X方向而向Y方向旋轉90°。Y方向上並列配置之2個接合頭904a之接合工具906於Y方向上移動至翻轉機構953之位置為止而自2個拾取工具905分別接收半導體晶片910。然後，2個接合頭904a沿Y方向移動至規定之接合位置為止後，將吸附至2個接合工具906之各半導體晶片910接合於電路基板912。
如以上說明般，應用了專利文獻2所記載之先前技術之倒裝晶片接合裝置950中，接合工具906之排列方向與拾取工具905之排列方向不同，為了自拾取工具905對接合工具906交付半導體晶片910，需要藉由翻轉部953a使拾取頭902a與拾取工具905翻轉，並且藉由旋轉部953b使拾取頭902a與拾取工具905旋轉90°而對準其排列方向。然而，若設置此種旋轉部953b則存在翻轉機構953變得複雜之問題。
因此，本發明之目的在於提供一種可利用簡便之構成，於使所拾取之半導體晶片列翻轉之同時變更其排列方向之電子零件處理單元。
本發明之電子零件處理單元之特徵在於包括：本體；旋轉 軸，安裝於本體；以及倒裝頭，安裝於旋轉軸，將吸附並保持半導體晶片之複數個拾取噴嘴呈直線狀配置，複數個拾取噴嘴以相對於旋轉軸之延伸之方向傾斜大致45°之方式排列。
本發明之電子零件處理單元中，較佳為具備使本體沿直線方向移動之直線驅動機構，旋轉軸以旋轉軸之延伸之方向相對於本體之移動方向傾斜大致45°之方式安裝於本體。
本發明可提供一種可利用簡便之構成，於使所拾取之半導體晶片列翻轉之同時變更其排列方向之電子零件處理單元。
11‧‧‧架台
12‧‧‧導軌
13‧‧‧門型框架
14‧‧‧滑塊
15‧‧‧構裝平台
16‧‧‧搬送軌道
17、912‧‧‧電路基板
18、910‧‧‧半導體晶片
19‧‧‧槽
20‧‧‧構裝頭
21‧‧‧馬達
22‧‧‧基體部
23‧‧‧構裝工具
24‧‧‧滾珠螺桿
25‧‧‧脈衝加熱器
26‧‧‧構裝噴嘴
30‧‧‧電子零件處理單元
31‧‧‧本體
32‧‧‧旋轉軸
33‧‧‧安裝臂
34‧‧‧螺栓
35、49‧‧‧中心線
36‧‧‧步進馬達
37‧‧‧滑塊
38‧‧‧導軌
39‧‧‧X方向線性馬達
40‧‧‧倒裝頭
41‧‧‧基底
42‧‧‧拾取噴嘴
43‧‧‧殼體
44、905‧‧‧拾取工具
45‧‧‧電磁線圈
47、48‧‧‧一點鏈線
50‧‧‧晶圓保持具
51、911‧‧‧晶圓
52‧‧‧切割片
55、909‧‧‧上推單元
60‧‧‧控制部
100、900、950‧‧‧倒裝晶片接合裝置
901‧‧‧晶片供給部
902‧‧‧拾取部
902a‧‧‧拾取頭
903、953‧‧‧翻轉機構
904‧‧‧接合部
904a‧‧‧接合頭
906‧‧‧接合工具
907‧‧‧Y方向驅動機構
908‧‧‧相機
915‧‧‧搬送部
953a‧‧‧翻轉部
953b‧‧‧旋轉部
957‧‧‧X方向驅動機構
圖1係表示搭載有本發明之實施形態之電子零件處理單元之倒裝晶片接合裝置之構成之俯視圖。
圖2係表示搭載有本發明之實施形態之電子零件處理單元之倒裝晶片接合裝置之構成之立面圖。
圖3係本發明之實施形態之電子零件處理單元之俯視圖。
圖4係本發明之實施形態之電子零件處理單元之立面圖。
圖5係表示藉由本發明之實施形態之電子零件處理單元拾取半導體晶片之動作之說明圖。
圖6係表示藉由本發明之實施形態之電子零件處理單元使半導體晶片翻轉之動作之說明圖。
圖7係表示自本發明之實施形態之電子零件處理單元向接合工具交付 半導體晶片之動作與半導體晶片之接合動作之說明圖。
圖8係表示利用先前技術之倒裝晶片接合機之俯視圖。
圖9係表示利用先前技術之其他倒裝晶片接合機之俯視圖。
圖10係表示圖9所示之倒裝晶片接合機之動作之說明圖。
以下，一面參照圖式一面對本發明之實施形態進行說明。首先，參照圖1對搭載有本發明之實施形態之電子零件處理單元30之電子零件構裝裝置即倒裝晶片接合裝置100進行說明。
如圖1所示，倒裝晶片接合裝置100包括：架台11，構裝平台15，跨越構裝平台15之上而沿Y方向延伸且沿X方向移動之門型框架13，安裝於門型框架13且沿Y方向移動之構裝頭20，安裝於構裝頭20且使構裝工具23沿Z方向移動之構裝噴嘴26，晶圓保持具50，進行半導體晶片18之拾取、翻轉、交付之電子零件處理單元30，以及控制各部之動作之控制部60。另外，如圖1所示，將門型框架13延伸之方向設為Y方向，將與其正交之方向設為X方向，將與XY面垂直之上下方向設為Z方向而進行說明。
構裝平台15係將構裝作為電子零件之半導體晶片18之電路基板17真空吸附於表面，並且藉由內部具備之未圖示之加熱器將吸附於表面之電路基板17加熱者。構裝平台15固定於架台11。於構裝平台15上連接有搬送軌道16，該搬送軌道16將電路基板17自未圖示之基板供給部搬送至構裝平台15之上，並且將半導體晶片18之構裝已結束之電路基板17送出至未圖示之製品庫存。
門型框架13為門型之框架，其腳部固定於滑塊14之上，該滑塊14係於固定於架台11之上之沿X方向延伸之2根導軌12之上，沿X方向滑動。滑塊14藉由未圖示之X方向驅動馬達沿X方向移動，因而門型框架13藉由X方向驅動馬達而沿X方向移動。
如圖2所示，構裝頭20安裝於門型框架13，藉由未圖示之Y方向驅動馬達而沿Y方向移動。若門型框架13藉由X方向驅動馬達沿X方向移動，則構裝頭20與門型框架13一併沿X方向移動，因而構裝頭20藉由X方向驅動馬達與Y方向驅動馬達而沿水平方向(XY方向)移動。構裝頭20中，構裝噴嘴26於Y方向上以間距P1而2個並列地安裝。構裝噴嘴26包含：固定於構裝頭20之馬達21，能夠沿Z方向移動地安裝於構裝頭20之基體部22，根據馬達21之旋轉將基體部22沿Z方向驅動之滾珠螺桿24，以及安裝於基體部22之下側之脈衝加熱器25。於脈衝加熱器25之下側，安裝有吸附半導體晶片18並且將半導體晶片18熱壓接至電路基板17之構裝工具23。構裝工具23之中央設置有真空吸附半導體晶片18之真空孔。若藉由馬達21使基體部22沿Z方向移動，則與其相應地，構裝工具23亦沿Z方向移動。另外，2個構裝噴嘴26之間距P1與以後說明之搭載於電子零件處理單元30之2個拾取噴嘴42之間距P2相同。
構裝頭20雖能夠沿XY方向移動，而於以下之說明中，設為構裝頭20沿Y方向移動時構裝工具23之中心於圖1所示之一點鏈線48之上沿Y方向移動而進行說明。
晶圓保持具50為保持經切割之晶圓51之圓環狀之構件。如圖1所示，晶圓保持具50藉由未圖示之Y方向驅動馬達而沿Y方向移動。 而且，於晶圓保持具50之下側配置有將晶圓51之半導體晶片18向上方向上推之上推單元55。上推單元55藉由未圖示之X方向驅動馬達而沿X方向移動。
如圖3、4所示，電子零件處理單元30包括：固定於架台11之沿X方向延伸之槽19之導軌38，由導軌38導引而沿X方向移動之滑塊37，固定於滑塊37且與滑塊37一併沿X方向移動之本體31，安裝於本體31之旋轉軸32，安裝於旋轉軸32且自旋轉軸32之中心線35向Z方向斜下方之方向延伸之安裝臂33，利用螺栓34固定於安裝臂33之前端之倒裝頭40，以及使旋轉軸32旋轉且使倒裝頭40翻轉之翻轉驅動機構即步進馬達36。導軌38中配置有固定件，且滑塊37中配置有可動件，因而導軌38與滑塊37構成使本體31沿X方向驅動之直線驅動機構即X方向線性馬達39。
如圖4所示，倒裝頭40包含基底41、以及安裝於基底41之Z方向之下表面41b之2個拾取噴嘴42。基底41為利用螺栓34固定於安裝臂33之前端之板狀構件，2個拾取噴嘴42以相對於倒裝頭40之Z方向之中心線49沿X方向呈直線狀以間距P2排列之方式固定於基底41之下表面41b。另外，圖3、4中，由實線表示之倒裝頭40表示拾取噴嘴42向下之情形(基底41之上表面41a可看到之狀態)，由一點鏈線表示之倒裝頭40表示倒裝頭40翻轉而下表面41b向Z方向向上而拾取噴嘴42亦向上之情形。圖3中，一點鏈線47表示拾取噴嘴42向下之情形時之2個拾取噴嘴42之排列方向。如圖3所示，拾取噴嘴42之排列方向(一點鏈線47之延伸之方向)自旋轉軸32之中心線35(旋轉軸32之延伸之方向)朝向X軸 方向傾斜45°。若本體31藉由X方向線性馬達39沿X方向移動，則2個拾取噴嘴42於一點鏈線47之上沿X方向移動。而且，一點鏈線47之延伸之方向為X方向，本體31沿X方向移動，因此旋轉軸32之延伸之方向相對於本體31之移動方向亦傾斜45°。
如圖2、4所示，安裝臂33自旋轉軸32之中心線35向Z方向斜下之方向延伸，於其前端利用螺栓34固定有基底41，因而於拾取噴嘴42向下之情形時，基底41之上表面41a成為自旋轉軸32之中心(中心線35)算起低了高度H1之位置。
如圖4所示，拾取噴嘴42包括：呈圓柱狀且中心設置有沿長度方向延伸之孔之殼體43，以及於設置於殼體43之孔之中沿長度方向移動之拾取工具44。殼體43中具備電磁線圈45，藉由使電磁線圈45通電而可變更拾取工具44自殼體43之端面之抽出量。而且，拾取工具44可於中心設置有真空孔，於前端面真空吸附有半導體晶片18。
如圖3、4中實線所示，若拾取工具44自下方向之狀態，藉由步進馬達36使旋轉軸32旋轉180°，則連接於旋轉軸32之基底41繞旋轉軸32旋轉180°而以上表面41a為Z方向下側、下表面41b為Z方向上側之方式翻轉。藉此，如圖3、4中一點鏈線所示，拾取工具44亦成為朝向Z方向上側之狀態。若基底41翻轉，則與之前說明之情況相反，拾取噴嘴42之排列方向成為自旋轉軸32之中心線35(旋轉軸32之延伸之方向)朝向Y軸方向傾斜45°所得之方向之一點鏈線48所示之方向。如此，若旋轉軸32旋轉180°而基底41翻轉，則拾取工具44之排列方向自X方向而向Y方向旋轉90°。而且，如圖2、4所示，若基底41翻轉，則固定有安裝臂33之基 底41之上表面41a成為較旋轉軸32之中心線35高出高度H1之位置。因此，如圖2所示，於使倒裝頭40翻轉時拾取工具44與構裝工具23之距離變短，將以後說明之半導體晶片18自拾取工具44交付至構裝工具23時之拾取工具44之抽出量少亦無妨。
如以上構成之倒裝晶片接合裝置100之馬達21、步進馬達36、X方向驅動馬達、Y方向驅動馬達等全部由控制部60控制。控制部60為內部包含進行運算處理之CPU(Central Processing Unit，中央處理單元)及記憶動作程式或動作資料之記憶部之電腦。以下，參照圖5至圖7對倒裝晶片接合裝置100之動作進行說明。
控制部60如圖3、4中實線所示，於拾取工具44向下之狀態下藉由X方向線性馬達39使拾取工具44移動至晶圓保持具50之上。然後，控制部60如圖5(a)所示，以一拾取噴嘴42之中心位置位於欲拾取之半導體晶片18之正上方之方式進行位置調整。然後，控制部60以上推單元55之位置為欲拾取之半導體晶片18之正下方之方式進行位置調整。
其次，控制部60對拾取噴嘴42之電磁線圈45通電而使拾取工具44之前端面向下方向抽出，與此同時，藉由上推單元55將半導體晶片18自切割片52之下方上推。然後，控制部60將未圖示之真空裝置與拾取工具44連接，使拾取工具44之真空孔為真空。於是，藉由上推單元55而上推且與拾取工具44之前端面相接之半導體晶片18，係與拾取工具44之前端面相接，而真空吸附至拾取工具44之前端面。控制部60藉由拾取工具44拾取半導體晶片18後，控制電磁線圈45之通電電流且如圖5(b)所示，使拾取工具44之前端面退縮直至半導體晶片18位於殼體43之端面附 近為止。
其次，控制部60如圖5(b)所示，驅動圖3所示之X方向線性馬達39而使倒裝頭40沿X方向移動，以另一個拾取工具44之位置成為下一次拾取之半導體晶片18之正上方，上推單元55之位置成為下一次欲拾取之半導體晶片18之正下方之方式進行位置調整。然後，控制部60與先前之動作同樣地，對拾取噴嘴42之電磁線圈45通電而使拾取工具44向下方突出，與此同時，藉由上推單元55使半導體晶片18自切割片52之下方上推，於拾取工具44之前端面真空吸附下一個半導體晶片18。控制部60於拾取工具44拾取下一個半導體晶片18之後，控制電磁線圈45之通電電流而如圖5(c)所示，使拾取工具44之前端面退縮直至半導體晶片18位於殼體43之端面附近為止。
控制部60於利用2個拾取噴嘴42拾取2個半導體晶片18後，藉由圖3所示之X方向線性馬達39使電子零件處理單元30沿X方向移動。隨之，如圖5(c)、圖6(a)所示，真空吸附有半導體晶片18之2個拾取噴嘴42亦沿X方向移動。此時，倒裝頭40之2個拾取噴嘴42如參照圖3說明般，於一點鏈線47之上沿X方向移動。
控制部60使倒裝頭40移動至翻轉位置為止之後，如先前所說明般，藉由圖3、4所示之步進馬達36使旋轉軸32旋轉180°，使倒裝頭40翻轉。於是，首先，如參照圖3、4所說明般，基底41翻轉而2個拾取噴嘴42為上方向。然後，如圖6(b)所示，2個拾取噴嘴42之排列方向為自翻轉前之X方向旋轉了90°而成之Y方向。圖6(b)之一點鏈線48為表示倒裝頭40翻轉後之2個拾取噴嘴42之排列方向之線，並且亦為2個構裝 工具23沿Y方向移動時其中心沿Y方向移動之線。
如圖7(a)所示，於倒裝頭40翻轉之狀態下，以拾取工具44之前端面退縮之狀態，半導體晶片18被真空吸附至拾取工具44之前端面。
於如圖2中虛線所示使倒裝頭40翻轉後，控制部60如圖2所示使Y方向驅動馬達動作而使構裝頭20移動至經翻轉之倒裝頭40之正上方。此時，2個構裝工具23之中心沿圖1、6所示之一點鏈線48而沿Y方向移動。如先前說明般，2個構裝噴嘴26之間距P1與2個拾取噴嘴42之間距P2相同，因而當構裝頭20來到經翻轉之拾取噴嘴42之正上方時，如圖2所示，2個構裝工具23之各中心位置與2個拾取工具44之各中心位置分別一致。
控制部60如圖7(b)所示，使各拾取噴嘴42之各電磁線圈45通電而抽出拾取工具44之前端面。由此，吸附於拾取工具44之前端面之半導體晶片18與構裝工具23之表面接近。然後，控制部60解除各拾取工具44之真空抽吸孔之真空，使各構裝工具23之真空孔為真空。於是，半導體晶片18自各拾取工具44之前端面離開而真空吸附於各構裝工具23之表面。如此，自2個拾取工具44向2個構裝工具23交付半導體晶片18。
控制部60於自2個拾取工具44向2個構裝工具23交付了半導體晶片18後，對拾取噴嘴42之電磁線圈45之電流進行調整而使拾取工具44之前端面退縮至原來之狀態為止，使步進馬達36向與翻轉時相反之方向旋轉180°而使倒裝頭40恢復為拾取噴嘴42朝向下方之原來之狀態(未翻轉之狀態)。
而且，控制部60於2個構裝工具23接收了半導體晶片18後，如圖7(c)所示，藉由未圖示之Y方向驅動馬達使構裝頭20移動至電路基板17之上為止。然後，藉由構裝噴嘴26之脈衝加熱器25對真空吸附於構裝工具23之半導體晶片18進行加熱，使馬達21旋轉而使構裝工具23與基體部22一併下降至電路基板17之上，藉由構裝工具23使半導體晶片18熱壓接至電路基板17之上。半導體晶片18之熱壓接可逐個地按順序進行，亦可將2個半導體晶片18同時熱壓接至電路基板17。
如以上說明般，本實施形態之電子零件處理單元30以使複數個拾取噴嘴42相對於旋轉軸32之延伸之方向傾斜45°之方式排列，因而可同時進行藉由使旋轉軸32旋轉180°而拾取之半導體晶片18之翻轉與半導體晶片18之排列方向之90°之變更。因此，藉由使用本實施形態之電子零件處理單元30，以簡便之構造便可將倒裝晶片接合裝置100之構裝工具23之排列方向與拾取噴嘴42之排列方向錯開90°而形成設置面積少之倒裝晶片接合裝置100。
以上說明之實施形態中，設為於倒裝頭40中分別安裝有2個拾取噴嘴42而進行了說明，但只要呈直線狀排列，則倒裝頭40亦可安裝3個以上之拾取噴嘴42。而且，同樣地，配置於構裝頭20之構裝噴嘴26亦只要並列配置，則亦可不為2個而為3個以上。進而，亦可使拾取噴嘴42之排列數多於構裝噴嘴26之排列數。
另外，本發明並非限定於以上說明之實施形態，包含不脫離由申請專利範圍所規定之本發明之技術範圍或本質之全部變更及修正。

Claims (2)

  1. 一種電子零件處理單元，其特徵在於包括：本體；旋轉軸，安裝於上述本體；以及倒裝頭，安裝於上述旋轉軸，具有吸附並保持半導體晶片之複數個拾取噴嘴，並在上述複數個拾取噴嘴呈直線狀配置之第一位置、上述複數個拾取噴嘴之排列方向與上述第一位置正交之第二位置之間旋轉以使上述半導體晶片翻轉，上述複數個拾取噴嘴以相對於上述旋轉軸之延伸之方向傾斜大致45°之方式排列。
  2. 如申請專利範圍第1項之電子零件處理單元，其具備使上述本體沿直線方向移動之直線驅動機構，上述旋轉軸以上述旋轉軸之延伸之方向相對於上述本體之移動方向傾斜大致45°之方式安裝於上述本體。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111213225B (zh) * 2017-08-28 2023-07-18 株式会社新川 相对于对象物使第一和第二移动体直线移动的装置及方法
TWI686881B (zh) * 2017-08-28 2020-03-01 日商新川股份有限公司 相對於對象物使移動體直線移動的裝置以及方法
TWI744850B (zh) 2019-04-15 2021-11-01 日商新川股份有限公司 封裝裝置
US11972968B2 (en) * 2020-07-02 2024-04-30 Sharpack Technology Pte. Ltd. Fluxless gang die bonding arrangement
CN116583939A (zh) * 2021-03-16 2023-08-11 株式会社新川 搬送装置、搬送方法及程序
CN114951879A (zh) * 2022-06-08 2022-08-30 希诺股份有限公司 一种真空保温杯低温高效抽真空密封设备及密封工艺
US20240107735A1 (en) * 2022-09-27 2024-03-28 Canon Kabushiki Kaisha Apparatus including a plurality of heads and a method of using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200308039A (en) * 2002-01-29 2003-12-16 Tyco Electronics Corp Method of locating and placing eye point features of a semiconductor die on a substrate
TW200515466A (en) * 2002-09-11 2005-05-01 Tdk Corp Apparatus and method for mounting electronic part
TW200539035A (en) * 2004-04-27 2005-12-01 Dainippon Printing Co Ltd Method for manufacturing sheet provided with IC tag, apparatus for manufacturing sheet provided with IC tag, sheet provided with IC tag, method for fixing IC chip, apparatus for fixing IC chip, and IC tag

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840862B1 (zh) 1970-11-02 1973-12-03
JPS4840862A (zh) 1971-09-23 1973-06-15
US4322198A (en) * 1980-04-16 1982-03-30 Northern Telecom Limited Coil handling device
KR920022482A (ko) * 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
JPH06120465A (ja) * 1992-10-06 1994-04-28 Matsushita Electric Ind Co Ltd 実装装置
US5507614A (en) * 1995-03-02 1996-04-16 Cybeq Systems Holder mechanism for simultaneously tilting and rotating a wafer cassette
JPH1167879A (ja) * 1997-08-26 1999-03-09 Matsushita Electric Works Ltd 半導体実装方法及びその装置
DE19905958C1 (de) * 1999-02-12 2000-06-21 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen mittels mehrerer unabhängiger Handhabungsssyteme
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
JP3879679B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP2007158052A (ja) 2005-12-06 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装エラー修復方法
JP4840862B2 (ja) 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
KR20100012257A (ko) * 2008-07-28 2010-02-08 주식회사 탑 엔지니어링 칩 픽업장치
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
JP5358526B2 (ja) 2010-07-15 2013-12-04 ヤマハ発動機株式会社 実装機
DE102010054360B4 (de) * 2010-12-13 2018-09-20 Leica Biosystems Nussloch Gmbh Vorrichtung, Rackwendermodul, System und Verfahren zum Wenden von Racks
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
JP6211359B2 (ja) 2013-09-18 2017-10-11 ファスフォードテクノロジ株式会社 フリップチップボンダ及びボンディング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200308039A (en) * 2002-01-29 2003-12-16 Tyco Electronics Corp Method of locating and placing eye point features of a semiconductor die on a substrate
TW200515466A (en) * 2002-09-11 2005-05-01 Tdk Corp Apparatus and method for mounting electronic part
TW200539035A (en) * 2004-04-27 2005-12-01 Dainippon Printing Co Ltd Method for manufacturing sheet provided with IC tag, apparatus for manufacturing sheet provided with IC tag, sheet provided with IC tag, method for fixing IC chip, apparatus for fixing IC chip, and IC tag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

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