CN108701620B - 电子零件处理单元 - Google Patents

电子零件处理单元 Download PDF

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CN108701620B
CN108701620B CN201680082710.0A CN201680082710A CN108701620B CN 108701620 B CN108701620 B CN 108701620B CN 201680082710 A CN201680082710 A CN 201680082710A CN 108701620 B CN108701620 B CN 108701620B
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pickup
mounting
head
tool
semiconductor chip
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CN108701620A (zh
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瀬山耕平
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Shinkawa Ltd
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Abstract

本发明的电子零件处理单元(30)包括：本体(31)；旋转轴(32)，安装于本体(31)；翻转头(40)，安装于旋转轴(32)；以及步进马达(36)，安装于本体(31)，使旋转轴(32)旋转以使翻转头(40)反转，翻转头(40)具有连接于旋转轴(32)的底座(41)、及以排列方向相对于旋转轴(32)的延伸方向倾斜45°的方式而呈直线状地安装于底座(41)的多个拾取吸嘴(42)。由此，能够利用简便的结构来使所拾取的半导体芯片列反转的同时变更其排列方向。

Description

电子零件处理单元
技术领域
本发明涉及一种将半导体芯片(chip)等电子零件安装于电路基板的电子零件安装装置中所用的电子零件处理单元(handling unit)的结构。
背景技术
作为将半导体芯片安装于电路基板的方法，多采用倒装芯片接合(flip chipbonding)方法。此方法是如下所述的方法：通过焊料等在半导体芯片上形成凸块(bump)，从晶片(wafer)拾取(pickup)半导体芯片并使其反转，使半导体芯片的与凸块为相反侧的面吸附于接合工具，通过接合工具，将半导体芯片的凸块热压接于电路基板的电极而将凸块与电路基板的电极予以接合(例如参照专利文献1)。
作为使用此种倒装芯片接合方法来将半导体芯片安装于电路基板的装置，使用有倒装芯片接合器(bonder)(倒装芯片接合装置)(例如参照专利文献2)。专利文献2所记载的倒装芯片接合器900如图8所示，具备：芯片供应部901，供应安装于电路基板912的半导体芯片910；拾取部902，从晶片911拾取半导体芯片910；反转机构903，使所拾取的半导体芯片910反转；接合部904，接收被反转的半导体芯片910并接合于电路基板912；摄像机(camera)908，拍摄电路基板912与半导体芯片910的图像；以及搬送部915，搬送电路基板912。芯片供应部901、拾取部902、反转机构903、接合部904是沿Y方向配置成一列。芯片供应部901具备上顶单元909，所述上顶单元909上顶所拾取的半导体芯片910。而且，拾取部902包含吸附半导体芯片910的拾取工具905与沿Z方向驱动拾取工具905的拾取头(pickup head)902a，接合部904包含对半导体芯片910进行接合的接合工具906与沿Z方向驱动接合工具906的接合头(bonding head)904a。拾取头902a与接合头904a通过Y方向驱动机构907而沿Y方向移动。
现有技术文献
专利文献
专利文献1：日本专利第4840862号公报
专利文献2：日本专利特开2015-60924号公报
发明内容
发明所要解决的问题
然而，近年来，更强烈要求倒装芯片接合装置的设置面积的省空间(space)化与接合的高速化。作为实现此要求的方法，考虑采用图9所示的倒装芯片接合装置950。另外，图9中，对于与图8同样的部位标注同样的符号并省略说明。图9所示的倒装芯片接合装置950搭载各2个接合头904a及接合工具906与拾取头902a及拾取工具905，并且，将芯片供应部901、拾取部902及使拾取头902a沿X方向移动的X方向驱动机构957配置于搬送部915的Y方向负(minus)侧。2个拾取头902a沿着X方向驱动机构957而在X方向上排列配置有2个，2个接合头904a沿着Y方向驱动机构907而在Y方向上排列配置有2个。而且，反转机构953如图10所示，包含使拾取头902a反转的反转部953a、及使反转的拾取头902a在水平面内旋转90°的旋转部953b。
参照图10来简单说明应用以往技术的倒装芯片接合装置950的动作。如图10的(a)、(c)所示，首先，使2个拾取头902a沿X方向移动，利用各拾取工具905来分别拾取半导体芯片910。拾取半导体芯片910后，使2个拾取头902a沿X方向移动至反转机构953为止。此时，2个拾取头902a及拾取工具905沿X方向排列。如图10的(b)、(c)所示，反转机构953通过反转部953a来使2个拾取头902a与拾取工具905绕X轴旋转180°而使其反转，并且，通过旋转部953b来使2个拾取头902a与拾取工具905的排列方向从X方向旋转90°至Y方向。沿Y方向排列配置的2个接合头904a的接合工具906沿Y方向移动至反转机构953的位置为止，以从2个拾取工具905分别接收半导体芯片910。然后，2个接合头904a沿Y方向移动到规定的接合位置后，将吸附于2个接合工具906的各半导体芯片910接合至电路基板912。
如以上所说明，在适用专利文献2所记载的以往技术的倒装芯片接合装置950中，接合工具906的排列方向与拾取工具905的排列方向不同，在从拾取工具905将半导体芯片910交接至接合工具906时，必须通过反转部953a来使拾取头902a与拾取工具905反转，并且通过旋转部953b来使拾取头902a与拾取工具905旋转90°而使其排列方向一致。然而，若设置此种旋转部953b，则存在反转机构953变得复杂的问题。
因此，本发明的目的在于提供一种电子零件处理单元，能够利用简便的结构来使所拾取的半导体芯片列反转的同时变更其排列方向。
解决问题的技术手段
本发明的电子零件处理单元的特征在于包括：本体；旋转轴，安装于本体；以及翻转头(flip head)，安装于旋转轴，呈直线状地配置有吸附保持半导体管芯(die)的多个拾取吸嘴(pickup nozzle)，多个拾取吸嘴是以相对于旋转轴的延伸方向倾斜大致45°的方式而排列。
本发明的电子零件处理单元中，设为下述结构也优选，即，包括使本体沿直线方向移动的直线驱动机构，旋转轴是以旋转轴的延伸方向相对于本体的移动方向倾斜大致45°的方式而安装于本体。
发明的效果
本发明可提供一种电子零件处理单元，能够利用简便的结构来使所拾取的半导体芯片列反转的同时变更其排列方向。
附图说明
图1是表示搭载有本发明的实施方式的电子零件处理单元的倒装芯片接合装置的结构的平面图。
图2是表示搭载有本发明的实施方式的电子零件处理单元的倒装芯片接合装置的结构的立面图。
图3是本发明的实施方式的电子零件处理单元的平面图。
图4是本发明的实施方式的电子零件处理单元的立面图。
图5的(a)、(b)、(c)是表示通过本发明的实施方式的电子零件处理单元来拾取半导体芯片的动作的说明图。
图6的(a)、(b)是表示通过本发明的实施方式的电子零件处理单元来反转半导体芯片的动作的说明图。
图7的(a)、(b)、(c)是表示从本发明的实施方式的电子零件处理单元向接合工具的半导体芯片交接动作与半导体芯片的接合动作的说明图。
图8是表示以往技术的倒装芯片接合器的平面图。
图9是表示以往技术的另一倒装芯片接合器的平面图。
图10的(a)、(b)、(c)是表示图9所示的倒装芯片接合器的动作的说明图。
[符号的说明]
11：基座
12：导轨
13：龙门架
14：滑块
15：安装载台
16：搬送轨道
17、912：电路基板
18、910：半导体芯片
19：槽
20：安装头
21：马达
22：基体部
23：安装工具
24：滚珠丝杠
25：脉冲加热器
26：安装吸嘴
30：电子零件处理单元
31：本体
32：旋转轴
33：安装臂
34：螺栓
35、49：中心线
36：步进马达
37：滑块
38：导轨
39：X方向线性马达
40：翻转头
41：底座
41a：上表面
41b：下表面
42：拾取吸嘴
43：壳体
44、905：拾取工具
45：电磁线圈
47、48：一点链线
50：晶片支架
51、911：晶片
52：切割片
55、909：上顶单元
60：控制部
100、950：倒装芯片接合装置
901：芯片供应部
902：拾取部
902a：拾取头
903、953：反转机构
904：接合部
904a：接合头
906：接合工具
907：Y方向驱动机构
908：摄像机
915：搬送部
953a：反转部
953b：旋转部
957：X方向驱动机构
P1、P2：间距
H1：高度
900：倒装芯片接合装置(倒装芯片接合器)
41b：下表面
41a：上表面
具体实施方式
以下，参照附图来说明本发明的实施方式。首先，参照图1，对搭载有本发明的实施方式的电子零件处理单元30的电子零件安装装置即倒装芯片接合装置100进行说明。
如图1所示，倒装芯片接合装置100具备：基座11；安装载台(stage)15；龙门架(gantry frame)13，跨过安装载台15之上而沿Y方向延伸，且沿X方向移动；安装头20，安装于龙门架13，且沿Y方向移动；安装吸嘴26，安装于安装头20，使安装工具23沿Z方向移动；晶片支架(wafer holder)50；电子零件处理单元30，进行半导体芯片18的拾取、反转、交接；以及控制部60，控制各部的动作。另外，如图1所示，将龙门架13的延伸方向设为Y方向，与其正交的方向设为X方向，与XY面垂直的上下方向设为Z方向来进行说明。
安装载台15将要安装电子零件即半导体芯片18的电路基板17真空吸附于表面，并且通过配设在内部的未图示的加热器(heater)来对吸附于表面的电路基板17进行加热。安装载台15被固定于基座11。在安装载台15上，连接有搬送轨道(rail)16，所述搬送轨道16将电路基板17从未图示的基板供应部搬送至安装载台15上，并且将半导体芯片18的安装已结束的电路基板17送出至未图示的制品贮架(stock)。
龙门架13为门型的框架，其脚部被固定于滑块(slider)14上，所述滑块14是在固定于基座11上的沿X方向延伸的2根导轨(guide rail)12上沿X方向滑动。滑块14通过未图示的X方向驱动马达而沿X方向移动，因此龙门架13通过X方向驱动马达而沿X方向移动。
如图2所示，安装头20被安装于龙门架13，通过未图示的Y方向驱动马达而沿Y方向移动。当龙门架13通过X方向驱动马达沿X方向移动时，安装头20与龙门架13一同沿X方向移动，因此安装头20通过X方向驱动马达与Y方向驱动马达而沿水平方向(XY方向)移动。在安装头20上，沿Y方向以间距P1排列安装有2个安装吸嘴26。安装吸嘴26包含：马达21，被固定于安装头20；基体部22，可沿Z方向移动地安装于安装头20；滚珠丝杠(ball screw)24，对应于马达21的旋转而沿Z方向驱动基体部22；以及脉冲加热器25，被安装于基体部22的下侧。在脉冲加热器25的下侧，安装有安装工具23，所述安装工具23吸附半导体芯片18，并且将半导体芯片18热压接至电路基板17。在安装工具23的中央，设有真空吸附半导体芯片18的真空孔。当基体部22通过马达21沿Z方向移动时，与此相应地，安装工具23也沿Z方向移动。另外，2个安装吸嘴26的间距P1是与后文说明的电子零件处理单元30中搭载的2个拾取吸嘴42的间距P2相同。
安装头20可沿XY方向移动，但在以下的说明中，设为下述情况进行说明，即，当安装头20沿Y方向移动时，安装工具23的中心在图1所示的一点链线48上沿Y方向移动。
晶片支架50是保持经切割的晶片51的圆环状构件。如图1所示，晶片支架50通过未图示的Y方向驱动马达而沿Y方向移动。而且，在晶片支架50的下侧，配置有朝上方向上顶晶片51的半导体芯片18的上顶单元55。上顶单元55通过未图示的X方向驱动马达而沿X方向移动。
如图3、图4所示，电子零件处理单元30具备：导轨38，被固定于基座11的沿X方向延伸的槽19中；滑块37，受导轨38引导而沿X方向移动；本体31，被固定于滑块37，与滑块37一同沿X方向移动；旋转轴32，被安装于本体31；安装臂(arm)33，被安装于旋转轴32，从旋转轴32的中心线35朝Z方向斜下方向延伸；翻转头40，利用螺栓(bolt)34而固定于安装臂33的前端；以及作为反转驱动机构的步进马达36，使旋转轴32旋转而使翻转头40反转。在导轨38上配置有定子，滑块37配置有动子，因此导轨38与滑块37构成沿X方向驱动本体31的作为直线驱动机构的X方向线性马达(1inear motor)39。
如图4所示，翻转头40包含底座41、及被安装于底座41的Z方向的下表面41b的2个拾取吸嘴42。底座41是利用螺栓34固定于安装臂33前端的板状构件，2个拾取吸嘴42以相对于翻转头40的Z方向的中心线49而沿X方向呈直线状地以间距P2排列的方式固定于底座41的下表面41b。另外，图3、图4中，实线所示的翻转头40表示拾取吸嘴42朝下的情况(底座41的上表面41a所见的状态)，一点链线所示的翻转头40表示翻转头40反转而下表面41b朝向Z方向上方，拾取吸嘴42也变得朝上的情况。图3中，一点链线47表示拾取吸嘴42朝下时的2个拾取吸嘴42的排列方向。如图3所示，拾取吸嘴42的排列方向(一点链线47的延伸方向)是从旋转轴32的中心线35(旋转轴32的延伸方向)朝向X轴方向倾斜45°。当本体31通过X方向线性马达39而沿X方向移动时，2个拾取吸嘴42在一点链线47上沿X方向移动。而且，一点链线47的延伸方向为X方向，本体31沿X方向移动，因此旋转轴32的延伸方向相对于本体31的移动方向也倾斜45°。
如图2、图4所示，安装臂33从旋转轴32的中心线35朝Z方向斜下方向延伸，在其前端利用螺栓34而固定有底座41，因此当拾取吸嘴42朝下时，底座41的上表面41a处于从旋转轴32的中心(中心线35)仅低出高度H1的位置。
如图4所示，拾取吸嘴42具备：壳体(casing)43，为圆柱状且在中心设有沿长边方向延伸的孔；以及拾取工具44，在设于壳体43的孔中沿长边方向移动。在壳体43中，配设有电磁线圈45，通过对电磁线圈45通电，能够变更拾取工具44从壳体43的端面的放出量。而且，拾取工具44在中心设有真空孔，能够在前端面真空吸附半导体芯片18。
如图3、图4中实线所示，当从拾取工具44为下方向的状态开始，通过步进马达36使旋转轴32旋转180°时，连接于旋转轴32的底座41绕旋转轴32旋转180°而反转，以使得上表面41a成为Z方向下侧，而下表面41b成为Z方向上侧。由此，如图3、图4中一点链线所示，拾取工具44也成为朝向Z方向上侧的状态。当底座41反转时，与之前说明的相反，拾取吸嘴42的排列方向成为从旋转轴32的中心线35(旋转轴32的延伸方向)朝向Y轴方向倾斜45°的方向的一点链线48所示的方向。这样，当旋转轴32旋转180°而底座41反转时，拾取工具44的排列方向从X方向旋转90°至Y方向。而且，如图2、图4所示，当底座41反转时，固定有安装臂33的底座41的上表面41a处于比旋转轴32的中心线35仅高出高度H1的位置。因此，如图2所示，当使翻转头40反转时，拾取工具44与安装工具23的距离变短，将后文说明的半导体芯片18从拾取工具44交接至安装工具23时的拾取工具44的放出量少即可。
以上述方式构成的倒装芯片接合装置100的马达21、步进马达36、X方向驱动马达、Y方向驱动马达等全部由控制部60予以控制。控制部60是在内部包含进行运算处理的中央处理器(Central Processing Unit，CPU)、及存储动作程序或动作数据的存储部的计算机(computer)。以下，参照图5至图7来说明倒装芯片接合装置100的动作。
控制部60如图3、图4中实线所示，在拾取工具44朝下的状态下，通过X方向线性马达39使拾取工具44移动到晶片支架50之上为止。然后，控制部60进行位置调整，以如图5的(a)所示，其中一个拾取吸嘴42的中心位置处于欲拾取的半导体芯片18的正上方。而且，控制部60进行位置调整，以使上顶单元55的位置处于欲拾取的半导体芯片18的正下方。
接下来，在控制部60对拾取吸嘴42的电磁线圈45通电而将拾取工具44的前端面朝下方向放出的同时，通过上顶单元55从切割片(dicing sheet)52之下，上顶半导体芯片18。而且，控制部60连接未图示的真空装置与拾取工具44，将拾取工具44的真空孔设为真空。于是，被上顶单元55上顶而接触到拾取工具44前端面的半导体芯片18接触到拾取工具44的前端面，且被真空吸附于拾取工具44的前端面。控制部60通过拾取工具44来拾取半导体芯片18后，控制电磁线圈45的通电电流，从而如图5的(b)所示，拉入拾取工具44的前端面，直至半导体芯片18位于壳体43的端面附近为止。
接下来，控制部60如图5的(b)所示，驱动图3所示的X方向线性马达39而使翻转头40沿X方向移动，进行位置调整，以使另一个拾取工具44的位置处于接下来要拾取的半导体芯片18的正上方，且上顶单元55的位置处于接下来要拾取的半导体芯片18的正下方。然后，控制部60与先前的动作同样，在对拾取吸嘴42的电磁线圈45通电而使拾取工具44朝下方向突出的同时，通过上顶单元55来从切割片52之下，上顶半导体芯片18，将下个半导体芯片18真空吸附于拾取工具44的前端面。控制部60在拾取工具44拾取了下个半导体芯片18后，控制电磁线圈45的通电电流，从而如图5的(c)所示，拉入拾取工具44的前端面，直至半导体芯片18位于壳体43的端面附近为止。
控制部60在利用2个拾取吸嘴42拾取了2个半导体芯片18后，通过图3所示的X方向线性马达39来使电子零件处理单元30沿X方向移动。借此，如图5的(c)、图6的(a)所示，真空吸附有半导体芯片18的2个拾取吸嘴42也沿X方向移动。此时，翻转头40的2个拾取吸嘴42如参照图3所说明那样，在一点链线47上沿X方向移动。
控制部60使翻转头40移动至反转位置后，如之前说明的那样，通过图3、图4所示的步进马达36来使旋转轴32旋转180°，使翻转头40反转。于是，如之前参照图3、图4所说明的那样，底座41反转而2个拾取吸嘴42成为上方向。而且，如图6的(b)所示，2个拾取吸嘴42的排列方向成为从反转前的X方向旋转90°后的Y方向。图6的(b)的一点链线48是表示翻转头40反转后的2个拾取吸嘴42的排列方向的线，并且也是当2个安装工具23沿Y方向移动时其中心沿Y方向移动的线。
如图7的(a)所示，在翻转头40反转的状态下，在拾取工具44的前端面拉入的状态下，半导体芯片18被真空吸附于拾取工具44的前端面。
如图2中虚线所示，使翻转头40反转后，控制部60如图2所示，使Y方向驱动马达进行动作，以使安装头20移动至已反转的翻转头40的正上方。此时，2个安装工具23的中心沿着图1、图6所示的一点链线48沿Y方向移动。如之前所说明的那样，2个安装吸嘴26的间距P1与2个拾取吸嘴42的间距P2相同，因此当安装头20来到反转的拾取吸嘴42的正上方时，如图2所示，2个安装工具23的各中心位置与2个拾取工具44的各中心位置各自一致。
控制部60如图7的(b)所示，对各拾取吸嘴42的各电磁线圈45通电，以放出拾取工具44的前端面。由此，被吸附于拾取工具44前端面的半导体芯片18接近安装工具23的表面。然后，控制部60解除各拾取工具44的真空吸引孔的真空，将各安装工具23的真空孔设为真空。于是，半导体芯片18离开各拾取工具44的前端面而被真空吸附至各安装工具23的表面。这样，从2个拾取工具44将半导体芯片18交接至2个安装工具23。
控制部60从2个拾取工具44将半导体芯片18交接至2个安装工具23后，调整拾取吸嘴42的电磁线圈45的电流，以将拾取工具44的前端面拉入至原本的状态为止，使步进马达36与反转时逆向地旋转180°，以使翻转头40恢复为拾取吸嘴42朝向下方向的原本状态(未反转的状态)。
而且，控制部60在2个安装工具23接收半导体芯片18后，如图7的(c)所示，通过未图示的Y方向驱动马达来使安装头20移动至电路基板17之上为止。然后，通过安装吸嘴26的脉冲加热器25，对被真空吸附于安装工具23的半导体芯片18进行加热，使马达21旋转，以使安装工具23与基体部22一同下降至电路基板17之上，通过安装工具23，将半导体芯片18热压接至电路基板17上。半导体芯片18的热压接既可逐个地按顺序进行，也可将2个半导体芯片18同时热压接至电路基板17。
如以上所说明的那样，本实施方式的电子零件处理单元30中，将多个拾取吸嘴42以相对于旋转轴32的延伸方向倾斜45°的方式而排列，因此，通过使旋转轴32旋转180°，能够同时进行所拾取的半导体芯片18的反转与半导体芯片18的排列方向的90°变更。因此，通过使用本实施方式的电子零件处理单元30，能够实现利用简便的结构来使倒装芯片接合装置100的安装工具23的排列方向与拾取吸嘴42的排列方向偏移90°而设置面积少的倒装芯片接合装置100。
以上所说明的实施方式中，对在翻转头40上分别安装2个拾取吸嘴42的情况进行了说明，但只要呈直线状排列，则也可在翻转头40上安装3个以上的拾取吸嘴42。而且，同样，只要配置于安装头20的安装吸嘴26也并列配置，则也可设为3个以上而非2个。进而，也可使拾取吸嘴42的排列数多于安装吸嘴26的排列数。
另外，本发明并不限定于以上说明的实施方式，涵盖不脱离由权利要求所规定的本发明的技术范围或本质的所有变更及修正。

Claims (2)

1.一种电子零件处理单元，其特征在于包括：
本体；
旋转轴，安装于所述本体；
安装臂，被安装于所述旋转轴；
翻转头，固定于所述安装臂，呈直线状地配置有吸附保持半导体管芯的多个拾取吸嘴，所述翻转头包含底座，所述多个拾取吸嘴安装于所述底座；以及
反转驱动机构，使所述旋转轴旋转而使所述翻转头反转，
所述多个拾取吸嘴是以相对于所述旋转轴的延伸方向倾斜45°的方式而排列。
2.根据权利要求1所述的电子零件处理单元，其特征在于包括：
直线驱动机构，使所述本体沿直线方向移动，
所述旋转轴是以所述旋转轴的延伸方向相对于所述本体的移动方向倾斜45°的方式而安装于所述本体。
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