CN113661564B - 接合装置 - Google Patents

接合装置 Download PDF

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Publication number
CN113661564B
CN113661564B CN202080027169.XA CN202080027169A CN113661564B CN 113661564 B CN113661564 B CN 113661564B CN 202080027169 A CN202080027169 A CN 202080027169A CN 113661564 B CN113661564 B CN 113661564B
Authority
CN
China
Prior art keywords
die
electronic component
module
semiconductor die
conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080027169.XA
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English (en)
Chinese (zh)
Other versions
CN113661564A (zh
Inventor
関口繁之
永口悠二
瀬山耕平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Intelligent Machinery Co ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN113661564A publication Critical patent/CN113661564A/zh
Application granted granted Critical
Publication of CN113661564B publication Critical patent/CN113661564B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202080027169.XA 2019-04-11 2020-04-07 接合装置 Active CN113661564B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019075412 2019-04-11
JP2019-075412 2019-04-11
PCT/JP2020/015746 WO2020209269A1 (ja) 2019-04-11 2020-04-07 ボンディング装置

Publications (2)

Publication Number Publication Date
CN113661564A CN113661564A (zh) 2021-11-16
CN113661564B true CN113661564B (zh) 2024-03-01

Family

ID=72751115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080027169.XA Active CN113661564B (zh) 2019-04-11 2020-04-07 接合装置

Country Status (7)

Country Link
US (1) US11749541B2 (https=)
JP (1) JP7205941B2 (https=)
KR (1) KR102708943B1 (https=)
CN (1) CN113661564B (https=)
SG (1) SG11202111144YA (https=)
TW (1) TWI734434B (https=)
WO (1) WO2020209269A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
CN119174300A (zh) * 2022-07-26 2024-12-20 雅马哈发动机株式会社 表面安装机和表面安装方法
US20240375251A1 (en) * 2023-05-10 2024-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonding system and die bonding method using the same
CN121487542B (zh) * 2026-01-07 2026-04-07 大连佳峰自动化股份有限公司 一种半导体贴片上料装置及方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175256A (ja) * 1991-12-20 1993-07-13 Hitachi Ltd ペレットボンディング装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
KR19990034692A (ko) * 1997-10-30 1999-05-15 윤종용 리드 프레임의 다이 본딩장치
TW440990B (en) * 1997-04-30 2001-06-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate
TW200735233A (en) * 2005-05-20 2007-09-16 Shinkawa Kk Bonding device for chip
CN103681406A (zh) * 2012-08-29 2014-03-26 株式会社日立高新技术仪器 裸片接合装置、裸片拾取装置及裸片拾取方法
JP5507775B1 (ja) * 2013-11-25 2014-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
CN104704938A (zh) * 2012-09-28 2015-06-10 富士机械制造株式会社 对基板作业机
CN107180772A (zh) * 2016-03-11 2017-09-19 捷进科技有限公司 芯片贴装装置以及半导体器件的制造方法
CN109075105A (zh) * 2016-02-15 2018-12-21 务实印刷有限公司 用于制造多个电子电路的设备和方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR20190034858A (ko) * 2017-09-25 2019-04-03 세메스 주식회사 다이 본딩 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP2011035178A (ja) * 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) * 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
CN104604356B (zh) 2012-09-06 2017-05-17 富士机械制造株式会社 元件安装机的控制系统和控制方法
JP6343199B2 (ja) * 2014-07-28 2018-06-13 株式会社Ｆｕｊｉ 通信システム、実装機及び通信データ処理方法
US10199254B2 (en) * 2015-05-12 2019-02-05 Nexperia B.V. Method and system for transferring semiconductor devices from a wafer to a carrier structure
JP6622306B2 (ja) 2015-06-26 2019-12-18 株式会社Ｆｕｊｉ 部品実装機
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元
JP6573289B2 (ja) * 2016-01-06 2019-09-11 ヤマハモーターロボティクスホールディングス株式会社 電子部品実装装置
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175256A (ja) * 1991-12-20 1993-07-13 Hitachi Ltd ペレットボンディング装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
TW440990B (en) * 1997-04-30 2001-06-16 Esec Trading Sa Apparatus and method for mounting semiconductor chips on a substrate
KR19990034692A (ko) * 1997-10-30 1999-05-15 윤종용 리드 프레임의 다이 본딩장치
TW200735233A (en) * 2005-05-20 2007-09-16 Shinkawa Kk Bonding device for chip
CN103681406A (zh) * 2012-08-29 2014-03-26 株式会社日立高新技术仪器 裸片接合装置、裸片拾取装置及裸片拾取方法
CN104704938A (zh) * 2012-09-28 2015-06-10 富士机械制造株式会社 对基板作业机
JP5507775B1 (ja) * 2013-11-25 2014-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
CN109075105A (zh) * 2016-02-15 2018-12-21 务实印刷有限公司 用于制造多个电子电路的设备和方法
CN107180772A (zh) * 2016-03-11 2017-09-19 捷进科技有限公司 芯片贴装装置以及半导体器件的制造方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR20190034858A (ko) * 2017-09-25 2019-04-03 세메스 주식회사 다이 본딩 장치

Also Published As

Publication number Publication date
KR20210144881A (ko) 2021-11-30
JPWO2020209269A1 (https=) 2020-10-15
WO2020209269A1 (ja) 2020-10-15
US11749541B2 (en) 2023-09-05
TWI734434B (zh) 2021-07-21
TW202041138A (zh) 2020-11-01
SG11202111144YA (en) 2021-11-29
JP7205941B2 (ja) 2023-01-17
US20220165591A1 (en) 2022-05-26
CN113661564A (zh) 2021-11-16
KR102708943B1 (ko) 2024-09-25

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Effective date of registration: 20251219

Address after: Tokyo, Japan

Patentee after: Yamaha Intelligent Machinery Co.,Ltd.

Country or region after: Japan

Address before: Japan, Tokyo, Musashino City, Inahira 2-chome 51-banchi no 1 (Postal code: 208-8585)

Patentee before: SHINKAWA Ltd.

Country or region before: Japan