JP7205941B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

Info

Publication number
JP7205941B2
JP7205941B2 JP2021513654A JP2021513654A JP7205941B2 JP 7205941 B2 JP7205941 B2 JP 7205941B2 JP 2021513654 A JP2021513654 A JP 2021513654A JP 2021513654 A JP2021513654 A JP 2021513654A JP 7205941 B2 JP7205941 B2 JP 7205941B2
Authority
JP
Japan
Prior art keywords
die
electronic component
bonding
module
semiconductor die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021513654A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020209269A1 (https=
JPWO2020209269A5 (https=
Inventor
繁之 関口
悠二 永口
耕平 瀬山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of JPWO2020209269A1 publication Critical patent/JPWO2020209269A1/ja
Publication of JPWO2020209269A5 publication Critical patent/JPWO2020209269A5/ja
Application granted granted Critical
Publication of JP7205941B2 publication Critical patent/JP7205941B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021513654A 2019-04-11 2020-04-07 ボンディング装置 Active JP7205941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019075412 2019-04-11
JP2019075412 2019-04-11
PCT/JP2020/015746 WO2020209269A1 (ja) 2019-04-11 2020-04-07 ボンディング装置

Publications (3)

Publication Number Publication Date
JPWO2020209269A1 JPWO2020209269A1 (https=) 2020-10-15
JPWO2020209269A5 JPWO2020209269A5 (https=) 2022-06-09
JP7205941B2 true JP7205941B2 (ja) 2023-01-17

Family

ID=72751115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021513654A Active JP7205941B2 (ja) 2019-04-11 2020-04-07 ボンディング装置

Country Status (7)

Country Link
US (1) US11749541B2 (https=)
JP (1) JP7205941B2 (https=)
KR (1) KR102708943B1 (https=)
CN (1) CN113661564B (https=)
SG (1) SG11202111144YA (https=)
TW (1) TWI734434B (https=)
WO (1) WO2020209269A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
CN119174300A (zh) * 2022-07-26 2024-12-20 雅马哈发动机株式会社 表面安装机和表面安装方法
US20240375251A1 (en) * 2023-05-10 2024-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonding system and die bonding method using the same
CN121487542B (zh) * 2026-01-07 2026-04-07 大连佳峰自动化股份有限公司 一种半导体贴片上料装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035178A (ja) 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
WO2014049833A1 (ja) 2012-09-28 2014-04-03 富士機械製造株式会社 対基板作業機
JP2016031975A (ja) 2014-07-28 2016-03-07 富士機械製造株式会社 通信システム、実装機及び通信データ処理方法
WO2017119217A1 (ja) 2016-01-06 2017-07-13 株式会社新川 電子部品実装装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
CH693229A5 (de) * 1997-04-30 2003-04-30 Esec Tradingsa Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat.
KR100252317B1 (ko) * 1997-10-30 2000-04-15 윤종용 리드 프레임의 다이 본딩장치
US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
CN104604356B (zh) 2012-09-06 2017-05-17 富士机械制造株式会社 元件安装机的控制系统和控制方法
WO2015075832A1 (ja) * 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
US10199254B2 (en) * 2015-05-12 2019-02-05 Nexperia B.V. Method and system for transferring semiconductor devices from a wafer to a carrier structure
JP6622306B2 (ja) 2015-06-26 2019-12-18 株式会社Ｆｕｊｉ 部品実装機
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元
GB2549250B (en) * 2016-02-15 2021-06-30 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR102047035B1 (ko) * 2017-09-25 2019-11-20 세메스 주식회사 다이 본딩 장치
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035178A (ja) 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
WO2014049833A1 (ja) 2012-09-28 2014-04-03 富士機械製造株式会社 対基板作業機
JP2016031975A (ja) 2014-07-28 2016-03-07 富士機械製造株式会社 通信システム、実装機及び通信データ処理方法
WO2017119217A1 (ja) 2016-01-06 2017-07-13 株式会社新川 電子部品実装装置

Also Published As

Publication number Publication date
KR20210144881A (ko) 2021-11-30
CN113661564B (zh) 2024-03-01
JPWO2020209269A1 (https=) 2020-10-15
WO2020209269A1 (ja) 2020-10-15
US11749541B2 (en) 2023-09-05
TWI734434B (zh) 2021-07-21
TW202041138A (zh) 2020-11-01
SG11202111144YA (en) 2021-11-29
US20220165591A1 (en) 2022-05-26
CN113661564A (zh) 2021-11-16
KR102708943B1 (ko) 2024-09-25

Similar Documents

Publication Publication Date Title
JP7205941B2 (ja) ボンディング装置
JP6637397B2 (ja) 半導体製造装置および半導体装置の製造方法
KR101931127B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
CN107180772B (zh) 芯片贴装装置以及半导体器件的制造方法
JP6941513B2 (ja) 半導体製造装置および半導体装置の製造方法
JP4564235B2 (ja) 部品実装装置及び部品実装方法
CN108346585B (zh) 半导体制造装置及半导体器件的制造方法
KR20190042419A (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
JP4742526B2 (ja) Ｉｃチップ実装体の製造方法及び製造装置
TW202347582A (zh) 用於半導體裝置的多軸直接轉移的方法及設備
JP2010135574A (ja) 移載装置
WO2007072714A1 (ja) 電子部品の実装装置及び実装方法
JP7039675B2 (ja) 半導体製造装置および半導体装置の製造方法
EP2059112A1 (en) Electronic component taking out apparatus, surface mounting apparatus and method for taking out electronic component
JP4591484B2 (ja) 電子部品実装方法
JP4247023B2 (ja) 電子部品の実装装置
KR102206226B1 (ko) 보트 및 스트립 방식 겸용 솔더볼 플레이스먼트 시스템의 제어방법
JP4093854B2 (ja) 電子部品実装装置
JP4520316B2 (ja) 部品搬送装置及びこれを有する表面実装機
KR20160086505A (ko) 자동 포장 장치
TWI732284B (zh) 傳送發光二極體晶片之傳送裝置及傳送方法
TWI917822B (zh) 半導體製造裝置，工卡模具安裝方法及半導體裝置的製造方法
JPH0730292A (ja) 表面実装機
JP6942427B2 (ja) 部品実装機および部品実装方法
WO2025134780A1 (ja) 接合装置、接合システム、及び接合方法

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A5211

Effective date: 20210913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210913

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220913

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221122

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221222

R150 Certificate of patent or registration of utility model

Ref document number: 7205941

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250