TWI734434B - 接合裝置 - Google Patents

接合裝置 Download PDF

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Publication number
TWI734434B
TWI734434B TW109111338A TW109111338A TWI734434B TW I734434 B TWI734434 B TW I734434B TW 109111338 A TW109111338 A TW 109111338A TW 109111338 A TW109111338 A TW 109111338A TW I734434 B TWI734434 B TW I734434B
Authority
TW
Taiwan
Prior art keywords
die
electronic component
module
bonding
semiconductor die
Prior art date
Application number
TW109111338A
Other languages
English (en)
Chinese (zh)
Other versions
TW202041138A (zh
Inventor
関口繁之
永口悠二
瀬山耕平
Original Assignee
日商新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新川股份有限公司 filed Critical 日商新川股份有限公司
Publication of TW202041138A publication Critical patent/TW202041138A/zh
Application granted granted Critical
Publication of TWI734434B publication Critical patent/TWI734434B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW109111338A 2019-04-11 2020-04-01 接合裝置 TWI734434B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019075412 2019-04-11
JP2019-075412 2019-04-11

Publications (2)

Publication Number Publication Date
TW202041138A TW202041138A (zh) 2020-11-01
TWI734434B true TWI734434B (zh) 2021-07-21

Family

ID=72751115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109111338A TWI734434B (zh) 2019-04-11 2020-04-01 接合裝置

Country Status (7)

Country Link
US (1) US11749541B2 (https=)
JP (1) JP7205941B2 (https=)
KR (1) KR102708943B1 (https=)
CN (1) CN113661564B (https=)
SG (1) SG11202111144YA (https=)
TW (1) TWI734434B (https=)
WO (1) WO2020209269A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822377B (zh) * 2022-07-26 2023-11-11 日商山葉發動機股份有限公司 表面安裝機及表面安裝方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
US20240375251A1 (en) * 2023-05-10 2024-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonding system and die bonding method using the same
CN121487542B (zh) * 2026-01-07 2026-04-07 大连佳峰自动化股份有限公司 一种半导体贴片上料装置及方法

Citations (3)

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WO2014049833A1 (ja) * 2012-09-28 2014-04-03 富士機械製造株式会社 対基板作業機
US10028400B2 (en) * 2015-08-07 2018-07-17 Fuji Electric Co., Ltd. Semiconductor device
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元

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US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
CH693229A5 (de) * 1997-04-30 2003-04-30 Esec Tradingsa Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat.
KR100252317B1 (ko) * 1997-10-30 2000-04-15 윤종용 리드 프레임의 다이 본딩장치
US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP2011035178A (ja) * 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) * 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
CN104604356B (zh) 2012-09-06 2017-05-17 富士机械制造株式会社 元件安装机的控制系统和控制方法
WO2015075832A1 (ja) * 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
JP6343199B2 (ja) * 2014-07-28 2018-06-13 株式会社Ｆｕｊｉ 通信システム、実装機及び通信データ処理方法
US10199254B2 (en) * 2015-05-12 2019-02-05 Nexperia B.V. Method and system for transferring semiconductor devices from a wafer to a carrier structure
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JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR102047035B1 (ko) * 2017-09-25 2019-11-20 세메스 주식회사 다이 본딩 장치
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

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Publication number Priority date Publication date Assignee Title
WO2014049833A1 (ja) * 2012-09-28 2014-04-03 富士機械製造株式会社 対基板作業機
US10028400B2 (en) * 2015-08-07 2018-07-17 Fuji Electric Co., Ltd. Semiconductor device
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822377B (zh) * 2022-07-26 2023-11-11 日商山葉發動機股份有限公司 表面安裝機及表面安裝方法

Also Published As

Publication number Publication date
KR20210144881A (ko) 2021-11-30
CN113661564B (zh) 2024-03-01
JPWO2020209269A1 (https=) 2020-10-15
WO2020209269A1 (ja) 2020-10-15
US11749541B2 (en) 2023-09-05
TW202041138A (zh) 2020-11-01
SG11202111144YA (en) 2021-11-29
JP7205941B2 (ja) 2023-01-17
US20220165591A1 (en) 2022-05-26
CN113661564A (zh) 2021-11-16
KR102708943B1 (ko) 2024-09-25

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