KR102708943B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

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Publication number
KR102708943B1
KR102708943B1 KR1020217035721A KR20217035721A KR102708943B1 KR 102708943 B1 KR102708943 B1 KR 102708943B1 KR 1020217035721 A KR1020217035721 A KR 1020217035721A KR 20217035721 A KR20217035721 A KR 20217035721A KR 102708943 B1 KR102708943 B1 KR 102708943B1
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KR
South Korea
Prior art keywords
die
electronic component
return
bonding
module
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KR1020217035721A
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English (en)
Korean (ko)
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KR20210144881A (ko
Inventor
시게유키 세키구치
유지 에구치
코헤이 세야마
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가부시키가이샤 신가와
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H01L21/67144—
    • H01L21/67132—
    • H01L21/67721—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020217035721A 2019-04-11 2020-04-07 본딩 장치 Active KR102708943B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019075412 2019-04-11
JPJP-P-2019-075412 2019-04-11
PCT/JP2020/015746 WO2020209269A1 (ja) 2019-04-11 2020-04-07 ボンディング装置

Publications (2)

Publication Number Publication Date
KR20210144881A KR20210144881A (ko) 2021-11-30
KR102708943B1 true KR102708943B1 (ko) 2024-09-25

Family

ID=72751115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217035721A Active KR102708943B1 (ko) 2019-04-11 2020-04-07 본딩 장치

Country Status (7)

Country Link
US (1) US11749541B2 (https=)
JP (1) JP7205941B2 (https=)
KR (1) KR102708943B1 (https=)
CN (1) CN113661564B (https=)
SG (1) SG11202111144YA (https=)
TW (1) TWI734434B (https=)
WO (1) WO2020209269A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
CN119174300A (zh) * 2022-07-26 2024-12-20 雅马哈发动机株式会社 表面安装机和表面安装方法
US20240375251A1 (en) * 2023-05-10 2024-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonding system and die bonding method using the same
CN121487542B (zh) * 2026-01-07 2026-04-07 大连佳峰自动化股份有限公司 一种半导体贴片上料装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035178A (ja) 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
WO2014038053A1 (ja) 2012-09-06 2014-03-13 富士機械製造株式会社 部品実装機の制御システム及び制御方法
JP2016031975A (ja) 2014-07-28 2016-03-07 富士機械製造株式会社 通信システム、実装機及び通信データ処理方法

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JP3054480B2 (ja) * 1991-12-20 2000-06-19 株式会社日立製作所 ペレットボンディング装置
US5608638A (en) * 1995-02-06 1997-03-04 Advanced Micro Devices Device and method for automation of a build sheet to manufacture a packaged integrated circuit
CH693229A5 (de) * 1997-04-30 2003-04-30 Esec Tradingsa Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat.
KR100252317B1 (ko) * 1997-10-30 2000-04-15 윤종용 리드 프레임의 다이 본딩장치
US7353589B2 (en) * 2003-10-15 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP4397349B2 (ja) * 2005-05-20 2010-01-13 株式会社新川 チップボンディング装置
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
JP6105608B2 (ja) * 2012-09-28 2017-03-29 富士機械製造株式会社 対基板作業機
WO2015075832A1 (ja) * 2013-11-25 2015-05-28 キヤノンマシナリー株式会社 ボンディング装置およびボンディング方法
US10199254B2 (en) * 2015-05-12 2019-02-05 Nexperia B.V. Method and system for transferring semiconductor devices from a wafer to a carrier structure
JP6622306B2 (ja) 2015-06-26 2019-12-18 株式会社Ｆｕｊｉ 部品実装機
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
TWI632626B (zh) * 2016-01-06 2018-08-11 Shinkawa Ltd. 電子零件處理單元
JP6573289B2 (ja) * 2016-01-06 2019-09-11 ヤマハモーターロボティクスホールディングス株式会社 電子部品実装装置
GB2549250B (en) * 2016-02-15 2021-06-30 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR20190022159A (ko) * 2017-08-25 2019-03-06 세메스 주식회사 다이 본딩 장치
KR102047035B1 (ko) * 2017-09-25 2019-11-20 세메스 주식회사 다이 본딩 장치
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035178A (ja) 2009-08-03 2011-02-17 Hitachi High-Technologies Corp 電子部品実装装置
JP2012019189A (ja) 2010-06-11 2012-01-26 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2013004615A (ja) 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
WO2014038053A1 (ja) 2012-09-06 2014-03-13 富士機械製造株式会社 部品実装機の制御システム及び制御方法
JP2016031975A (ja) 2014-07-28 2016-03-07 富士機械製造株式会社 通信システム、実装機及び通信データ処理方法

Also Published As

Publication number Publication date
KR20210144881A (ko) 2021-11-30
CN113661564B (zh) 2024-03-01
JPWO2020209269A1 (https=) 2020-10-15
WO2020209269A1 (ja) 2020-10-15
US11749541B2 (en) 2023-09-05
TWI734434B (zh) 2021-07-21
TW202041138A (zh) 2020-11-01
SG11202111144YA (en) 2021-11-29
JP7205941B2 (ja) 2023-01-17
US20220165591A1 (en) 2022-05-26
CN113661564A (zh) 2021-11-16

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