WO2017119217A1 - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
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- WO2017119217A1 WO2017119217A1 PCT/JP2016/085289 JP2016085289W WO2017119217A1 WO 2017119217 A1 WO2017119217 A1 WO 2017119217A1 JP 2016085289 W JP2016085289 W JP 2016085289W WO 2017119217 A1 WO2017119217 A1 WO 2017119217A1
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- electronic component
- mounting apparatus
- pickup
- mounting
- component mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the present invention relates to a structure of an electronic component mounting apparatus for mounting an electronic component such as a semiconductor chip on a circuit board.
- a flip chip bonding method is often used as a method for mounting a semiconductor chip on a circuit board.
- bumps are formed on a semiconductor chip by solder or the like, the semiconductor chip is picked up from the wafer and inverted, the surface opposite to the bump of the semiconductor chip is adsorbed to the bonding tool, and the bump of the semiconductor chip is formed by the bonding tool.
- the bumps are bonded to the circuit board electrodes by thermocompression bonding to the electrodes of the circuit board (see, for example, Patent Document 1).
- a flip chip bonder (flip chip bonding apparatus) is used as an apparatus for mounting a semiconductor chip on a circuit board using such a flip chip bonding method (see, for example, Patent Document 2).
- a flip chip bonding apparatus 900 described in Patent Document 2 is shown in FIG.
- the flip chip bonding apparatus 900 includes a chip supply unit 901 that supplies a semiconductor chip 910 to be mounted on a circuit board 912, a pickup unit 902 that picks up the semiconductor chip 910 from the wafer 911, and an inversion mechanism that reverses the picked up semiconductor chip 910.
- the chip supply unit 901, the pickup unit 902, the reversing mechanism 903, and the bonding unit 904 are arranged in a line in the Y direction.
- the chip supply unit 901 includes a push-up unit 909 that pushes up a semiconductor chip 910 to be picked up.
- the pickup unit 902 includes a pickup tool 905 that sucks the semiconductor chip 910 and a pickup head 902a that drives the pickup tool 905 in the Z direction. And a bonding head 904a for driving 906 in the Z direction.
- the pickup head 902a and the bonding head 904a are moved in the Y direction by the Y direction driving mechanism 907.
- the present invention is to realize a space-saving installation space and a high-speed bonding in an electronic component mounting apparatus with a simple configuration.
- the electronic component mounting apparatus of the present invention is an electronic component mounting apparatus that mounts an electronic component on a substrate or another electronic component, and includes a plurality of mounting nozzles that move a plurality of mounting tools that vacuum-suck the electronic component in the vertical direction.
- Mounting heads mounted side by side in the Y direction and moving along the Y direction, and picked up so that the plurality of electronic components are aligned along the X direction by moving in the X direction perpendicular to the Y direction.
- an electronic component handling unit that changes the arrangement direction of the plurality of electronic components from the X direction to the Y direction at the same time.
- the electronic component handling unit includes a main body that moves linearly along the X direction, a rotating shaft that is attached to the main body at an angle of approximately 45 ° with respect to the X direction in which the main body moves, A flip head that is attached to a rotating shaft and has a plurality of pickup nozzles that adsorb and hold electronic components arranged linearly; a reversing drive mechanism that is attached to the main body and rotates the rotating shaft to reverse the flip head; It is also preferable that the plurality of pickup nozzles are arranged so as to be inclined at approximately 45 ° with respect to the direction in which the rotation axis extends.
- the arrangement pitch of the plurality of mounting tools and the arrangement pitch of the plurality of pickup nozzles are the same.
- the flip head includes a base connected to the rotation shaft, the rotation shaft is connected to the upper surface of the base, the pickup nozzle is attached to the lower surface of the base, and the upper surface of the base rotates It is also preferable that it is shifted from the center line of the shaft in the direction of the tip of the pickup nozzle.
- An electronic component mounting apparatus is an electronic component mounting apparatus that mounts an electronic component on a substrate or another electronic component, and a plurality of first mounting tools that move a plurality of first mounting tools that vacuum-suck the electronic component in a vertical direction.
- One mounting nozzle is mounted side by side in the Y direction, and a first mounting head that moves along the Y direction and a pickup that moves in the X direction perpendicular to the Y direction so that a plurality of electronic components are aligned along the X direction
- the first electronic component handling unit that reverses the plurality of electronic components and simultaneously changes the arrangement direction of the plurality of electronic components from the X direction to the Y direction and the plurality of second mounting tools that vacuum-suck the electronic components are moved in the vertical direction.
- a plurality of second mounting nozzles to be mounted are arranged side by side in the Y direction, facing the second mounting head disposed in parallel with the first mounting head, and the first electronic component handling unit. Arranged in a row, moved parallel to the first electronic component handling unit, picked up so that the plurality of electronic components are arranged in the X direction, and reversed the plurality of electronic components, and at the same time, the arrangement direction of the plurality of electronic components from the X direction And a second electronic component handling unit that changes in the Y direction.
- the first electronic component handling unit includes a first main body that linearly moves in a direction orthogonal to the arrangement direction, and a first main body that is inclined by approximately 45 ° with respect to the moving direction of the first main body.
- a first rotary shaft attached to the first main body, a first flip head attached to the first rotary shaft, and a plurality of first pickup nozzles for adsorbing and holding electronic components and arranged linearly, and attached to the first body.
- a first reversing drive mechanism for reversing the first flip head by rotating the first rotating shaft, and the first pickup nozzles are arranged so as to be inclined at approximately 45 ° with respect to the direction in which the first rotating shaft extends.
- the second electronic component handling unit is disposed to face the first main body, is linearly moved in parallel with the first main body, is attached to the second main body, and is parallel to the first rotation axis.
- a second rotating shaft that extends, a second flip head that is attached to the second rotating shaft and that has a plurality of second pickup nozzles that adsorb and hold electronic components, and is attached to the second body.
- a second reversing drive mechanism for reversing the second flip head by rotating the two rotation shafts, and the second pickup nozzles are arranged so as to be inclined at approximately 45 ° with respect to the direction in which the second rotation shaft extends. It is also suitable as being.
- the arrangement pitch of the plurality of first mounting tools is the same as the arrangement pitch of the plurality of first pickup nozzles or the plurality of second pickup nozzles, and the arrangement of the plurality of second mounting tools. It is also preferable that the pitch and the arrangement pitch of the plurality of first pickup nozzles or the plurality of second pickup nozzles are the same.
- the first flip head and the second flip head can move on a single straight line parallel to the moving direction of the first main body and the second main body without being reversed.
- the first electronic component handling unit can pass in the moving direction with the second electronic component handling unit in which the second flip head is not reversed with the first flip head of the first electronic component handling unit reversed.
- the second electronic component handling unit can pass in the moving direction with the first electronic component handling unit in which the first flip head is not reversed in a state where the second flip head of the second electronic component handling unit is reversed. This is also preferable.
- the first flip head includes a first base connected to the first rotation shaft
- the second flip head includes a second base connected to the second rotation shaft
- the first rotation shaft is connected to the first upper surface of the first base
- the first pickup nozzle is attached to the first lower surface of the first base
- the second rotation shaft is connected to the second upper surface of the second base
- the second The pickup nozzle is attached to the second lower surface of the second base, and the first upper surface of the first base is shifted from the first center line of the first rotation shaft toward the tip of the first pickup nozzle, It is also preferable that the second upper surface is deviated from the second center line of the second rotating shaft in the tip direction of the second pickup nozzle.
- the first flip head is first shifted from the intersection of the first center line of the first rotation shaft and the one straight line to the base side of the first rotation shaft along the one straight line.
- the second flip head is attached to the rotating shaft, and is shifted from the intersection of the second center line of the second rotating shaft and the first straight line to the root side of the second rotating shaft along the first straight line to be moved to the second rotating shaft.
- the amount of displacement of the first flip head attached is larger than the amount of protrusion of the second flip head from the straight line to the first body when the second flip head is not reversed, and the displacement of the second flip head It is also preferable that the amount is larger than the amount of protrusion of the first flip head from the straight line to the second main body when the first flip head is not reversed.
- the electronic component mounting apparatus of the present invention includes a wafer holder that holds a diced wafer and a push-up unit that is disposed below the wafer holder and pushes up the wafer, and the wafer holder moves and pushes up only in the Y direction. It is also preferable that the unit moves only in the X direction.
- the present invention can realize a space saving of an installation area and a high-speed bonding in an electronic component mounting apparatus with a simple configuration.
- FIG. 1 is an elevation view illustrating a configuration of a flip chip bonding apparatus according to an embodiment of the present invention. It is a top view of the electronic component handling unit mounted in the flip chip bonding apparatus of embodiment of this invention. It is an elevation view of the electronic component handling unit mounted on the flip chip bonding apparatus of the embodiment of the present invention. It is explanatory drawing which shows the operation
- the flip chip bonding apparatus 100 includes a gantry 11, a mounting stage 15, a gantry frame 13 that extends in the Y direction across the mounting stage 15, and moves in the X direction.
- a mounting head 20 that is attached and moves in the Y direction, a mounting nozzle 26 that is attached to the mounting head 20 and moves the mounting tool 23 in the Z direction, a wafer holder 50, and an electronic device that picks up, reverses, and delivers the semiconductor chip 18
- a component handling unit 30 and a control unit 60 for controlling the operation of each unit are provided.
- the direction in which the gantry frame 13 extends will be described as the Y direction, the direction orthogonal thereto as the X direction, and the vertical direction perpendicular to the XY plane as the Z direction.
- the mounting stage 15 vacuum-sucks a circuit board 17 on which a semiconductor chip 18 as an electronic component is mounted on the surface, and heats the circuit board 17 adsorbed on the surface by a heater (not shown) provided inside.
- the mounting stage 15 is fixed to the gantry 11.
- the mounting stage 15 is connected to a transport rail 16 that transports the circuit board 17 from the board supply unit (not shown) onto the mounting stage 15 and sends the circuit board 17 on which the semiconductor chip 18 has been mounted to a product stock (not shown). ing.
- the gantry frame 13 is a portal frame, and its legs are fixed on a slider 14 that slides in the X direction on two guide rails 12 that are fixed on the frame 11 and extend in the X direction. Since the slider 14 is moved in the X direction by an X direction drive motor (not shown), the gantry frame 13 is moved in the X direction by the X direction drive motor.
- the mounting head 20 is attached to the gantry frame 13 and moved in the Y direction by a Y direction drive motor (not shown).
- a Y direction drive motor (not shown).
- the mounting head 20 is moved in the X direction together with the gantry frame 13, so that the mounting head 20 is moved in the horizontal direction (XY direction) by the X direction drive motor and the Y direction drive motor.
- Two mounting nozzles 26 are attached to the mounting head 20 side by side at a pitch P1 in the Y direction.
- the mounting nozzle 26 drives the base portion 22 in the Z direction according to the rotation of the motor 21, the base portion 22 attached to the mounting head 20 so as to be movable in the Z direction, and the motor 21 fixed to the mounting head 20.
- a ball screw 24 and a pulse heater 25 attached to the lower side of the base portion 22 are included.
- a mounting tool 23 for adsorbing the semiconductor chip 18 and thermocompression bonding the semiconductor chip 18 to the circuit board 17 is attached to the lower side of the pulse heater 25.
- a vacuum hole for vacuum-sucking the semiconductor chip 18 is provided in the center of the mounting tool 23.
- the pitch P1 of the two mounting nozzles 26 is the same as the pitch P2 of the two pickup nozzles 42 mounted on the electronic component handling unit 30 described later.
- the mounting head 20 is movable in the XY directions, in the following description, when the mounting head 20 moves in the Y direction, the center of the mounting tool 23 is above the one-dot chain line 48 shown in FIG. This will be described as a case of moving.
- the wafer holder 50 is an annular member that holds the diced wafer 51. As shown in FIG. 1, in the flip chip bonding apparatus 100 of this embodiment, the wafer holder 50 is disposed on the lateral side of the gantry 11 in the X direction. For this reason, unlike the flip-chip bonding apparatus 900 shown in the prior art, the length is not increased, and the installation area can be reduced. Further, as shown in FIG. 1, the wafer holder 50 is moved in the Y direction by a Y direction drive motor (not shown).
- a push-up unit 55 that pushes the semiconductor chip 18 of the wafer 51 upward is disposed below the wafer holder 50.
- the push-up unit 55 is moved in the X direction by an X direction drive motor (not shown). This is because the semiconductor component 18 is sequentially picked up while the electronic component handling unit 30 described later moves in the X direction, so that the push-up unit 55 only moves in the X direction as with the electronic component handling unit 30.
- the wafer holder 50 can pick up all the semiconductor chips 18 on the wafer 51 if it can move only in the Y direction orthogonal to the X direction, which is the moving direction of the electronic component handling unit 30.
- the electronic component handling unit 30 includes a guide rail 38 fixed to the groove 19 extending in the X direction of the gantry 11, a slider 37 that is guided by the guide rail 38 and moves in the X direction, A main body 31 fixed to the slider 37 and moving in the X direction together with the slider 37, a rotary shaft 32 attached to the main body 31, a rotary shaft 32 attached to the rotary shaft 32, and obliquely downward in the Z direction from the center line 35 of the rotary shaft 32.
- a mounting arm 33 that extends, a flip head 40 that is fixed to the tip of the mounting arm 33 with a bolt 34, and a stepping motor 36 that is a reverse driving mechanism that rotates the rotating shaft 32 to reverse the flip head 40 are provided.
- the guide rail 38 has a stator and the slider 37 has a mover
- the guide rail 38 and the slider 37 constitute an X-direction linear motor 39 that is a linear drive mechanism that drives the main body 31 in the X direction. To do.
- the flip head 40 includes a base 41 and two pickup nozzles 42 attached to the lower surface 41 b of the base 41 in the Z direction.
- the base 41 is a plate-like member fixed to the tip of the mounting arm 33 with a bolt 34, and the two pickup nozzles 42 are linearly spaced in the X direction with a pitch P2 with respect to the center line 49 in the Z direction of the flip head 40. It is being fixed to the lower surface 41b of the base 41 so that it may rank.
- the flip head 40 indicated by a solid line shows a case where the pickup nozzle 42 faces downward (a state in which the upper surface 41 a of the base 41 can be seen), and the flip head 40 indicated by an alternate long and short dash line is inverted.
- the lower surface 41b is upward in the Z direction and the pickup nozzle 42 is also upward.
- an alternate long and short dash line 47 indicates the direction in which the two pickup nozzles 42 are aligned when the pickup nozzle 42 faces downward.
- the arrangement direction of the pickup nozzles 42 (direction in which the one-dot chain line 47 extends) is inclined by approximately 45 ° from the center line 35 (direction in which the rotation shaft 32 extends) of the rotation shaft 32 toward the X-axis direction. ing.
- the two pickup nozzles 42 of the flip head 40 move in the X direction on the alternate long and short dash line 47.
- the direction in which the alternate long and short dash line 47 extends is the X direction and the main body 31 moves in the X direction
- the direction in which the rotating shaft 32 extends is also inclined by approximately 45 ° with respect to the moving direction of the main body 31.
- the mounting arm 33 extends in a direction oblique to the Z direction from the center line 35 of the rotating shaft 32, and the base 41 is fixed to the tip of the mounting arm 33 with a bolt 34.
- the upper surface 41a of the base 41 is positioned lower than the center (center line 35) of the rotation shaft 32 by a height H1.
- the pickup nozzle 42 includes a cylindrical casing 43 provided with a hole extending in the longitudinal direction in the center, and a pickup tool 44 that moves in the longitudinal direction in the hole provided in the casing 43.
- An electromagnetic coil 45 is provided in the casing 43, and the feeding amount of the pickup tool 44 from the end surface of the casing 43 can be changed by energizing the electromagnetic coil 45.
- the pickup tool 44 is provided with a vacuum hole in the center, and the semiconductor chip 18 can be vacuum-sucked to the tip surface.
- the direction in which the pickup nozzles 42 are arranged is inclined by 45 ° from the center line 35 of the rotating shaft 32 (the direction in which the rotating shaft 32 extends) toward the Y-axis direction.
- the direction is indicated by a dashed line 48 in the direction.
- the arrangement direction of the pickup tools 44 is rotated 90 ° from the X direction to the Y direction.
- the motor 21, the stepping motor 36, the X-direction drive motor, the Y-direction drive motor, and the like of the flip chip bonding apparatus 100 configured as described above are all controlled by the control unit 60.
- the control unit 60 is a computer including a CPU that performs arithmetic processing therein and a storage unit that stores operation programs and operation data.
- the operation of the flip chip bonding apparatus 100 will be described with reference to FIGS.
- the controller 60 moves the pickup tool 44 up to the top of the wafer holder 50 by the X-direction linear motor 39 with the flip head 40 not reversed and the pickup tool 44 facing downward. Move. Then, as shown in FIG. 5A, the control unit 60 adjusts the position so that the center position of one pickup nozzle 42 is directly above the semiconductor chip 18 to be picked up. Further, the control unit 60 adjusts the position so that the position of the push-up unit 55 is directly below the semiconductor chip 18 to be picked up.
- control unit 60 energizes the electromagnetic coil 45 of the pickup nozzle 42 to feed the tip surface of the pickup tool 44 downward, and at the same time, pushes up the semiconductor chip 18 from below the dicing sheet 52 by the push-up unit 55. Further, the control unit 60 connects a vacuum device (not shown) and the pickup tool 44 so that the vacuum hole of the pickup tool 44 is evacuated. Then, the semiconductor chip 18 pushed up by the push-up unit 55 and in contact with the front end surface of the pickup tool 44 is vacuum-sucked on the front end surface of the pickup tool 44. Once the semiconductor chip 18 is picked up by the pickup tool 44, the control unit 60 controls the energization current of the electromagnetic coil 45 until the semiconductor chip 18 comes close to the end face of the casing 43 as shown in FIG. Retract the tip of 44.
- the control unit 60 drives the X-direction linear motor 39 shown in FIG. 3 to move the flip head 40 in the X direction, and the position of another pickup tool 44 is moved.
- the position is adjusted so that it is directly above the semiconductor chip 18 to be picked up and the position of the push-up unit 55 is directly below the semiconductor chip 18 to be picked up next.
- the controller 60 energizes the electromagnetic coil 45 of the pickup nozzle 42 to cause the pickup tool 44 to protrude downward, and at the same time, the semiconductor chip 18 is pushed up from below the dicing sheet 52 by the push-up unit 55. Then, the next semiconductor chip 18 is vacuum-sucked to the front end surface of the pickup tool 44.
- control unit 60 controls the energization current of the electromagnetic coil 45 until the semiconductor chip 18 comes close to the end face of the casing 43 as shown in FIG. The front end surface of the pickup tool 44 is retracted.
- the control unit 60 When the control unit 60 picks up the two semiconductor chips 18 with the two pickup nozzles 42, the control unit 60 moves the electronic component handling unit 30 in the X direction by the X-direction linear motor 39 shown in FIG. Accordingly, as shown in FIGS. 5C and 6A, the two pickup nozzles 42 that vacuum-suck the semiconductor chip 18 also move in the X direction. At this time, the two pickup nozzles 42 of the flip head 40 move in the X direction on the alternate long and short dash line 47 as described with reference to FIG.
- the control unit 60 moves the flip head 40 to the inversion position, as described above, the stepping motor 36 shown in FIGS. 3 and 4 rotates the rotary shaft 32 by 180 ° to invert the flip head 40. Then, as described above with reference to FIGS. 3 and 4, the base 41 is reversed and the two pickup nozzles 42 are directed upward. Further, as shown in FIG. 6B, the arrangement direction of the two pickup nozzles 42 is the Y direction rotated by 90 ° from the X direction before inversion.
- An alternate long and short dash line 48 in FIG. 6B is a line indicating the arrangement direction of the two pickup nozzles 42 after the flip head 40 is reversed, and the center of the two mounting tools 23 when the two mounting tools 23 move in the Y direction. It is also a line that moves in the Y direction.
- the control unit 60 operates the Y-direction drive motor as shown in FIG. 2 to move the mounting head 20 directly above the inverted flip head 40.
- the centers of the two mounting tools 23 move in the Y direction along the alternate long and short dash line 48 shown in FIGS.
- the pitch P1 of the two mounting nozzles 26 is the same as the pitch P2 of the two pickup nozzles 42, when the mounting head 20 comes directly above the inverted pickup nozzle 42, it is shown in FIG.
- the center positions of the two mounting tools 23 and the center positions of the two pickup tools 44 coincide with each other.
- the control unit 60 energizes each electromagnetic coil 45 of each pickup nozzle 42 to feed the tip end surface of the pickup tool 44 as shown in FIG.
- the semiconductor chip 18 adsorbed on the front end surface of the pickup tool 44 comes close to the surface of the mounting tool 23.
- the control part 60 cancels
- the semiconductor chip 18 is vacuum-sucked on the surface of each mounting tool 23 away from the tip surface of each pickup tool 44. In this way, the semiconductor chip 18 is delivered from the two pickup tools 44 to the two mounting tools 23.
- the control unit 60 delivers the semiconductor chip 18 from the two pickup tools 44 to the two mounting tools 23
- the current of the electromagnetic coil 45 of the pickup nozzle 42 is adjusted and the tip surface of the pickup tool 44 is pulled back to the original state to perform stepping.
- the motor 36 is rotated 180 ° in the opposite direction to that during reversal, and the flip head 40 is returned to the original state (the state where it is not reversed) with the pickup nozzle 42 facing downward.
- the control unit 60 moves the mounting head 20 over the circuit board 17 by a Y-direction drive motor (not shown) as shown in FIG. Moving. Then, the semiconductor chip 18 that is vacuum-sucked by the mounting tool 23 is heated by the pulse heater 25 of the mounting nozzle 26, the motor 21 is rotated, and the mounting tool 23 is lowered onto the circuit board 17 together with the base portion 22, so that mounting is performed.
- the semiconductor chip 18 is thermocompression bonded onto the circuit board 17 by the tool 23.
- the thermocompression bonding of the semiconductor chips 18 may be performed one by one or two semiconductor chips 18 may be simultaneously thermocompression bonded to the circuit board 17.
- the electronic component handling unit 30 of the flip chip bonding apparatus 100 of the present embodiment moves in the X direction perpendicular to the Y direction in which the mounting nozzles 26 are arranged, and a plurality of semiconductor chips 18 are arranged in the X direction. Since the plurality of semiconductor chips 18 are reversed and simultaneously the arrangement direction of the semiconductor chips 18 is changed to the Y direction which is the arrangement direction of the mounting nozzles 26, the plurality of picked-up semiconductor chip 18 rows are simultaneously connected to the mounting nozzles 26. It can be transferred to the mounting tool 23 at the tip, and the bonding speed can be increased.
- the flip chip bonding apparatus 100 of the present embodiment it is possible to employ an apparatus arrangement in which the direction in which the mounting nozzles 26 are arranged (Y direction) and the direction in which the pickup nozzles 42 are arranged (X direction) are orthogonal. By disposing the holder 50 on the lateral side of the gantry 11 in the X direction, the installation area can be reduced.
- FIGS. 1 to 7 Components similar to those described above with reference to FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof is omitted.
- the flip chip bonding apparatus 200 of the present embodiment is the same as the flip chip bonding apparatus 100 described with reference to FIG. 1, but the second gantry frame 113 and the second gantry frame 113 attached to the second gantry frame 113.
- tip, and the 2nd electronic component handling unit 130 is provided.
- the flip chip bonding apparatus 200 of the present embodiment picks up the four semiconductor chips 18 arranged in the X direction by the two electronic component handling units 30 and 130, and reverses the picked up four semiconductor chips 18 and simultaneously arranges them.
- the direction in which the gantry frame 13 and the second gantry frame 113 shown in FIG. 8 extend is defined as the Y direction
- the direction perpendicular thereto is defined as the X direction
- the vertical direction perpendicular to the XY plane is defined as the Z direction.
- the second gantry frame 113 of the flip chip bonding apparatus 200 is a gate-shaped frame arranged in parallel with the gantry frame 13, and is extended in the X direction fixed on the gantry 11.
- the leg portion is fixed on the second slider 114 that slides on the guide rail 12 in the X direction. Since the second slider 114 is moved in the X direction by a second X direction drive motor (not shown), the second gantry frame 113 is moved in the X direction by the second X direction drive motor.
- the second mounting head 120 is attached to the second gantry frame 113 disposed in parallel with the gantry frame 13, so that the second mounting head 120 is disposed in parallel with the mounting head 20. ing.
- the second mounting head 120 is moved in the Y direction by a second Y direction drive motor (not shown).
- the second gantry frame 113 is moved in the X direction by the second X direction drive motor
- the second mounting head 120 is moved in the X direction together with the second gantry frame 113. Therefore, the second mounting head 120 is connected to the second X direction drive motor. It moves in the horizontal direction (XY direction) by the second Y-direction drive motor.
- the second mounting nozzle 126 includes a second motor 121 fixed to the second mounting head 120, a second base portion 122 attached to the second mounting head 120 so as to be movable in the Z direction, and rotation of the second motor 121. Accordingly, a second ball screw 124 for driving the second base portion 122 in the Z direction and a second pulse heater 125 attached to the lower side of the second base portion 122 are included.
- a second mounting tool 123 for adsorbing the semiconductor chip 18 and thermocompression bonding the semiconductor chip 18 to the circuit board 17 is attached to the lower side of the second pulse heater 125.
- a vacuum hole for vacuum-sucking the semiconductor chip 18 is provided in the center of the second mounting tool 123.
- the pitch P1 of the two second mounting nozzles 126 is the same as the pitch P2 of the two second pickup nozzles 142 mounted on the second electronic component handling unit 130 described later, and the electronic component handling unit.
- the pitch P2 of the 30 pickup nozzles 30 is also the same.
- the second mounting head 120 can move in the XY directions. However, in the following description, when the second mounting head 120 moves in the Y direction, the center of the second mounting tool 123 is the one-dot chain line 148 shown in FIG. A description will be given assuming that it moves in the Y direction.
- the second electronic component handling unit 130 is disposed in parallel to face the electronic component handling unit 30, and moves in the X direction in parallel with the electronic component handling unit 30, so that a plurality of semiconductor chips is provided.
- 18 are picked up so as to be arranged in the X direction orthogonal to the arrangement direction (Y direction) of the second mounting nozzle 126, the plurality of semiconductor chips 18 are reversed, and at the same time, the arrangement direction of the plurality of semiconductor chips 18 is changed to the second mounting nozzle 126.
- the direction is changed to the Y direction which is the arrangement direction.
- the second electronic component handling unit 130 includes a second guide rail 138, a second slider 137, a second main body 131, and a second rotating shaft 132 attached to the second main body 131. , A second mounting arm 133, a second flip head 140 fixed to the tip of the second mounting arm 133, and a second stepping motor 136.
- the second guide rail 138 is fixed to the groove 19 extending in the X direction of the gantry 11 and extends in the X direction so as to face the guide rail 38 and in parallel with the guide rail 38.
- the second slider 137 is guided by the second guide rail 138 and moves in the X direction. Since the stator is disposed on the second guide rail 138 and the mover is disposed on the second slider 137, the second guide rail 138 and the second slider 137 have the second X driving the second main body 131 in the X direction.
- a directional linear motor 139 is configured. As shown in FIG. 10, the second main body 131 that is fixed to the second slider 137 and moves together with the second slider 137 in the X direction in parallel with the main body 31 is arranged to face the main body 31.
- the second rotating shaft 132 attached to the second main body 131 extends in a direction parallel to the rotating shaft 32, and a second center line 135 is provided at the tip of the second rotating shaft 132.
- a second mounting arm 133 extending in a diagonally downward direction from the Z direction is attached, and a second flip head 140 is fixed to the tip of the second mounting arm 133 by a second bolt 134.
- the second mounting arm 133 also extends in a direction parallel to the mounting arm 33.
- a second stepping motor 136 that is a second reverse drive mechanism that rotates the second rotating shaft 132 and reverses the second flip head 140 is disposed inside the second main body 131.
- the second flip head 140 includes a second base 141 and two second pickup nozzles 142 attached to the second lower surface 141 b on the lower side in the Z direction of the second base 141.
- the second base 141 is a plate-like member that is fixed to the tip of the second mounting arm 133 with a second bolt 134, and the two second pickup nozzles 142 are located with respect to the center line 49 in the Z direction of the second flip head 140.
- the second base 141 is fixed to the second lower surface 141b so as to be linearly arranged in the X direction at a pitch P2.
- the pitch P2 of the two second pickup nozzles 142 is the same as the pitch P1 of the two second mounting nozzles 126, and is the same as the pitch P1 of the two mounting nozzles 26.
- the flip head 40 and the second flip head 140 indicated by solid lines indicate that the pickup nozzle 42 and the second pickup nozzle 142 face downward (the upper surface 41 a of the base 41 and the second upper surface 141 a of the second base 141.
- the flip head 40 and the second flip head 140 indicated by the alternate long and short dash line the flip head 40 and the second flip head 140 are reversed so that the lower surface 41b and the second lower surface 141b face upward in the Z direction.
- the case where the second pickup nozzle 142 is also directed upward is shown.
- the alternate long and short dash line 47 indicates the arrangement direction of the pickup nozzle 42 and the second pickup nozzle 142 when the pickup nozzle 42 and the second pickup nozzle 142 are directed downward.
- the arrangement direction of the pickup nozzle 42 and the second pickup nozzle 142 (the direction in which the alternate long and short dash line 47 extends) is the center line 35 of the rotation shaft 32 (the direction in which the rotation shaft 32 extends), and the second rotation shaft.
- the second center line 135 of 132 (the direction in which the second rotating shaft 132 extends) is inclined 45 ° toward the X-axis direction.
- the pick-up nozzle 42 and the second pick-up nozzle 142 of the flip head 40 and the second flip head 140 are 47 moves in the X direction.
- the direction in which the alternate long and short dash line 47 extends is the X direction and the main body 31 and the second main body 131 move in the X direction
- the direction in which the rotary shaft 32 and the second rotary shaft 132 extend is the same as that of the main body 31 and the second main body 131. It is inclined 45 ° with respect to the moving direction.
- the second mounting arm 133 also extends in the Z-direction obliquely downward from the second center line 135 of the second rotating shaft 132, and the second base 141 is fixed to the tip of the second mounting arm 133 with the second bolt 134. Therefore, when the second pickup nozzle 142 faces downward, the second upper surface 141a of the second base 141 is at a position lower by the height H1 from the center (second center line 135) of the second rotation shaft 132. Yes.
- the second pickup nozzle 142 is cylindrical and has a second casing 143 provided with a hole extending in the longitudinal direction at the center, and the second pickup nozzle 142 moves in the longitudinal direction through the hole provided in the second casing 143.
- a second pick-up tool 144 is provided in the second casing 143, and the amount of the second pickup tool 144 to be fed from the end surface of the second casing 143 can be adjusted by energizing the second electromagnetic coil 145. it can.
- the second pick-up tool 144 is provided with a vacuum hole in the center, and the semiconductor chip 18 can be vacuum-sucked to the tip surface.
- the second pick-up tool 144 when the second pick-up tool 144 is rotated 180 ° by the second stepping motor 136 from the state where the second pick-up tool 144 is in the downward direction, the second pick-up tool 144 connected to the second rotary shaft 132 is obtained.
- the base 141 rotates 180 ° around the second rotation shaft 132 so that the second upper surface 141a is on the lower side in the Z direction, and the second lower surface 141b is inverted on the upper side in the Z direction.
- the second pickup tool 144 is also directed upward in the Z direction, as indicated by the alternate long and short dash line in FIGS.
- the direction in which the second pickup nozzles 142 are arranged from the second center line 135 of the second rotating shaft 132 is opposite to the case described above. This is the direction indicated by the alternate long and short dash line 148 in a direction inclined 45 ° toward the Y-axis direction.
- the arrangement direction of the second pickup tools 144 is rotated 90 ° from the X direction to the Y direction.
- the second base 141 when the second base 141 is reversed, as in the case where the base 41 is reversed, the second upper surface 141a of the second base 141 to which the second mounting arm 133 is fixed is The second rotation shaft 132 is higher than the second center line 135 by a height H1. Therefore, the flip head 40 is reversed and the upper surface 41a of the base 41 becomes higher than the center line 35 of the rotating shaft 32 by the height H1, as indicated by a broken line in FIG. 9, and the second flip head 140 is reversed. As shown by a solid line in FIG. 9, when the second pickup nozzle 142 is in the downward direction, the flip head 40, the mounting arm 33, the rotating shaft 32, and the main body 31 are the second flip head 140 and the second mounting arm.
- the electronic component handling unit 30 can move in the X direction.
- the second motor 121, the second stepping motor 136, the X-direction drive motor, the Y-direction drive motor, and the like of the flip chip bonding apparatus 200 configured as described above are all controlled by the control unit 60.
- the control unit 60 is a computer including a CPU that performs arithmetic processing therein and a storage unit that stores operation programs and operation data.
- the operation of the flip chip bonding apparatus 200 will be described with reference to FIGS. 5 to 7 and FIG. 12.
- the controller 60 picks up the two semiconductor chips 18 by the two pickup nozzles 42 in the same process as described above with reference to FIGS. 5A to 5C, and uses the two second pickups. Two semiconductor chips 18 are picked up by the nozzle 142.
- the controller 60 picks up a total of four semiconductor chips 18 with two pickup nozzles 42 and two second pickup nozzles 142, the X direction linear motor 39 and the second X direction linear motor 139 shown in FIG.
- the electronic component handling unit 30 and the second electronic component handling unit 130 are moved in the X direction. Accordingly, as shown in FIG. 12A, the two pickup nozzles 42 and the two second pickup nozzles 142 that have vacuum-sucked the semiconductor chip 18 also move in the X direction. At this time, the two pickup nozzles 42 of the flip head 40 and the two second pickup nozzles 142 of the second flip head 140 move in the X direction on the alternate long and short dash line 47 as described with reference to FIG. Go.
- the controller 60 reverses the flip head 40 after moving the flip head 40 to the reverse position. Then, as described above with reference to FIGS. 10 and 11, the base 41 is reversed and the two pickup nozzles 42 are directed upward. As shown in FIG. 12B, the arrangement direction of the two pickup nozzles 42 is the Y direction rotated 90 ° from the X direction before the reversal.
- An alternate long and short dash line 48 in FIG. 12B is a line indicating the arrangement direction of the two pickup nozzles 42 after the flip head 40 is reversed, and the center of the two mounting tools 23 when the two mounting tools 23 move in the Y direction. It is also a line that moves in the Y direction.
- the control unit 60 operates the Y direction drive motor and the second Y direction drive motor as shown in FIG. Then, the second mounting head 120 is moved immediately above the inverted flip head 40 and the second flip head 140. At this time, the centers of the two mounting tools 23 move in the Y direction along the one-dot chain line 48 shown in FIG. 12, and the centers of the two second mounting tools 123 in the Y direction along the one-dot chain line 148 shown in FIG. Moving.
- the pitch P1 of the two mounting nozzles 26 is the same as the pitch P2 of the two pickup nozzles 42
- the pitch P1 of the two second mounting nozzles 126 is the same as that of the two second pickup nozzles 142. Since the pitch P2 is the same as the pitch P2, when the mounting head 20, the second mounting head 120 are directly above the inverted pickup nozzle 42 and the second pickup nozzle 142, the center positions of the two mounting tools 23 and the two pickup tools 44 are provided. The center positions of the two second mounting tools 123 coincide with the center positions of the two second pickup tools 144, respectively.
- the control unit 60 energizes each pickup nozzle 42, each electromagnetic coil 45 of each second pickup nozzle 142, and each second electromagnetic coil 145 as described above with reference to FIG.
- the tip surfaces of the tool 44 and each second pickup tool 144 are fed out, and the semiconductor chip 18 adsorbed on each tip surface of each pickup tool 44 and each second pickup tool 144 is brought close to the surface of the mounting tool 23.
- the semiconductor chip 18 is vacuum-sucked on the surfaces of the mounting tools 23 and the second mounting tools 123 away from the tip surfaces of the pickup tools 44 and the second pickup tools 144. In this way, the semiconductor chip 18 is delivered from the two pickup tools 44 to the two mounting tools 23.
- the control unit 60 uses the flip head 40 and the second flip head 140 as the original. Return to the state (not reversed).
- the controller 60 uses the Y-direction drive motor (not shown) to mount the mounting head 20, as described above with reference to FIG.
- the second mounting head 120 is moved onto the circuit board 17.
- the mounting nozzle 26, the pulse heater 25 of the second mounting nozzle 126, and the second pulse heater 125 heat the semiconductor chip 18 that is vacuum-adsorbed to the mounting tool 23 and the second mounting tool 123, and the motor 21 and the second motor.
- 121 is rotated to lower the mounting tool 23 and the second mounting tool 123 together with the base portion 22 and the second base portion 122 onto the circuit board 17, and the semiconductor chip 18 is mounted on the circuit board by the mounting tool 23 and the second mounting tool 123.
- the thermocompression bonding of the semiconductor chips 18 may be performed one by one in sequence, or may be performed two at a time by combining the mounting tool 23 and the second mounting tool 123, or four semiconductor chips 18 may be simultaneously connected to the circuit.
- the substrate 17 may be thermocompression bonded.
- the electronic component handling unit 30 and the second electronic component handling unit 130 of the flip chip bonding apparatus 200 of this embodiment are orthogonal to the arrangement direction (Y direction) of the mounting nozzle 26 and the second mounting nozzle 126.
- the plurality of semiconductor chips 18 are picked up so as to be aligned in the X direction, and the plurality of semiconductor chips 18 are reversed.
- the alignment direction of the semiconductor chips 18 is changed to the alignment direction of the mounting nozzle 26 and the second mounting nozzle 126. Therefore, the plurality of picked-up semiconductor chip 18 rows can be simultaneously transferred to the mounting nozzle 26, the mounting tool 23 at the tip of the second mounting nozzle 126, and the second mounting tool 123, so that high-speed bonding is possible. Can be achieved.
- the arrangement direction (Y direction) of the mounting nozzle 26 and the second mounting nozzle 126 is orthogonal to the arrangement direction (X direction) of the pickup nozzle 42 and the second pickup nozzle 142. Since arrangement
- the electronic component handling unit 30 and the second electronic component handling unit 130 of the present embodiment are configured so that either one of the flip head 40 or the second flip head 140 is in the reverse position as shown in FIG. You can move in different directions. Therefore, for example, after the semiconductor chip 18 is delivered by the second electronic component handling unit 130 while the semiconductor chip 18 is picked up by the electronic component handling unit 30, the electronic component handling unit 30 is used. And the second electronic component handling unit 130 are moved so as to pass each other in the X direction, and the second electronic component handling unit 130 transfers the next semiconductor chip 18 while the electronic component handling unit 30 transfers the semiconductor chip 18. Can be picked up.
- the pitch P2 of the two mounting nozzles 26, the pitch P1 of the two second mounting nozzles 126, the pitch P2 of the two pickup nozzles 42 of the electronic component handling unit 30, and 2 mounted on the second electronic component handling unit 130. Since the pitches P2 of the two second pickup nozzles 142 are all the same, the electronic component handling unit 30 can deliver the semiconductor chip 18 to either the two mounting tools 23 or the two second mounting tools 123, and The semiconductor chip 18 can be delivered to both the two mounting tools 23 and the two second mounting tools 123 also by the second electronic component handling unit 130.
- the flip chip bonding apparatus 200 can efficiently combine the operations of picking up, inverting, transferring, and bonding of the semiconductor chip 18.
- Bonding speed can be further increased as compared with the flip-chip bonding apparatus 100 of the described embodiment.
- the electronic component handling unit 30 and the second electronic component handling unit 130 shown in FIG. 13 are connected to the tip of the rotating shaft 32 and the second rotating shaft 132 via the adapter 71 and the second adapter 171, respectively, and the flip head 40 and the second flip head 140.
- the base 41 and the second base 141 are attached.
- the adapter 71 causes the Y-direction end surface 41 d of the base 41 facing the second electronic component handling unit 130 to be separated from the one-dot chain line 47 toward the second electronic component handling unit 130. It protrudes by d2.
- the adapter 71 causes the X-direction end surface 41 c of the base 41 to extend along an alternate long and short dash line 47 from an intersection 72 of an alternate long and short dash line 47 indicating the alignment direction of the rotation axis 32 of the electronic component handling unit 30 and the pickup nozzle 42. It is shifted to the base side of the rotating shaft 32 by a distance d1 that is larger than the distance d2. That is, the flip head 40 is shifted from the intersection 72 along the alternate long and short dash line 47 to the base side of the rotary shaft 32 by a distance d1 that is larger than the distance d2.
- the second adapter 171 causes the Y-direction end surface 141d of the second base 141 facing the electronic component handling unit 30 to extend from the one-dot chain line 47 to the electronic component handling unit 30. It protrudes by a distance d2 to the side.
- the end surface 140 c in the X direction of the second base 141 is a point indicating the arrangement direction of the second center line 135 of the second rotating shaft 132 of the second electronic component handling unit 130 and the second pickup nozzle 142.
- a distance d1 larger than the distance d2 is shifted from the second intersection point 172 of the chain line 47 along the one-dot chain line 47 to the root side of the second rotation shaft 132. That is, the second flip head 140 is shifted from the second intersection point 172 along the one-dot chain line 47 to the base side of the second rotation shaft 132 by a distance d1 that is larger than the distance d2.
- the X-direction end surface 41c of the base 41 rotates in the horizontal direction by 90 ° and becomes an end surface toward the Y-direction. .
- the X-direction end face 41c facing in the Y direction is located at a distance d1 from the alternate long and short dash line 47 toward the main body 31. Since the second electronic component handling unit 130 is not inverted, the amount of protrusion from the one-dot chain line 47 of the Y-direction end surface 141d of the second base 141 toward the electronic component handling unit 30 becomes a distance d2 smaller than the distance d1. Yes. For this reason, as shown in FIG.
- the flip head 40 of the electronic component handling unit 30 is reversed and the second flip head 140 of the second electronic component handling unit 130 is not reversed.
- a gap of (d1-d2) is formed between the X-direction end surface 41c and the Y-direction end surface 141d of the second base 141. For this reason, the electronic component handling unit 30 and the second electronic component handling unit 130 can move in the X direction.
- the second flip head 140 of the second electronic component handling unit 130 is reversed and the flip head 40 of the electronic component handling unit 30 is not reversed, the X direction rotated in the Y direction of the second base 141.
- a gap (d1-d2) is formed between the end surface 141c and the Y-direction end surface 41d of the base 41, and the electronic component handling unit 30 and the second electronic component handling unit 130 can be moved in the X direction. .
- the flip chip bonding described with reference to FIG. 8 to FIG. 12 also applies to the flip chip bonding apparatus 200 described above in the modification of the electronic component handling unit 30 and the second electronic component handling unit 130 described above. It can operate with the apparatus 200, and can achieve higher bonding speed than the flip chip bonding apparatus 100 of the embodiment described above with reference to FIGS.
- the two pickup nozzles 42 and the second pickup nozzle 142 have been described as being attached to the flip head 40 and the second flip head 140, respectively. 40.
- the three or more pickup nozzles 42 and the second pickup nozzles 142 may be attached to the second flip head 140.
- the number may be three or more instead of two.
- the number of arrangements of the pickup nozzles 42 and the second pickup nozzles 142 may be larger than the number of arrangements of the mounting nozzles 26 and the second mounting nozzles 126.
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Abstract
Description
Claims (16)
- 電子部品を基板または他の電子部品に実装する電子部品実装装置であって、
前記電子部品を真空吸着する複数の実装ツールを上下方向に移動させる複数の実装ノズルがY方向に並べて取り付けられ、前記Y方向に沿って移動する実装ヘッドと、
前記Y方向と直交するX方向に移動して複数の前記電子部品が前記X方向に沿って並ぶようにピックアップし、複数の前記電子部品を反転すると同時に複数の前記電子部品の並び方向を前記X方向から前記Y方向に変更する電子部品ハンドリングユニットと、
を備えることを特徴とする電子部品実装装置。 - 請求項1に記載の電子部品実装装置であって、
前記電子部品ハンドリングユニットは、前記X方向に沿って直線移動する本体と、前記本体が移動する前記X方向に対して略45°傾斜して前記本体に取り付けられた回転軸と、前記回転軸に取り付けられ、前記電子部品を吸着して保持する複数のピックアップノズルが直線状に配置されたフリップヘッドと、前記本体に取り付けられ、前記回転軸を回転させて前記フリップヘッドを反転させる反転駆動機構と、を含み、
複数の前記ピックアップノズルが、前記回転軸が伸びる方向に対して略45°傾斜するように配列されていること、
を特徴とする電子部品実装装置。 - 請求項2に記載の電子部品実装装置であって、
複数の前記実装ツールの配列ピッチと複数の前記ピックアップノズルの配列ピッチとが同一であること、
を特徴とする電子部品実装装置。 - 請求項2または3に記載の電子部品実装装置であって、
前記フリップヘッドは、前記回転軸に接続されるベースを含み、
前記回転軸は前記ベースの上面に接続され、前記ピックアップノズルは、前記ベースの下面に取り付けられ、
前記ベースの前記上面は、前記回転軸の中心線から前記ピックアップノズルの先端方向にずれていること、
を特徴とする電子部品実装装置。 - 電子部品を基板または他の電子部品に実装する電子部品実装装置であって、
前記電子部品を真空吸着する複数の第1実装ツールを上下方向に移動させる複数の第1実装ノズルがY方向に並べて取り付けられ、前記Y方向に沿って移動する第1実装ヘッドと、
前記Y方向と直交するX方向に移動して複数の前記電子部品が前記X方向に沿って並ぶようにピックアップし、複数の前記電子部品を反転すると同時に複数の前記電子部品の並び方向を前記X方向から前記Y方向に変更する第1電子部品ハンドリングユニットと、
前記電子部品を真空吸着する複数の第2実装ツールを上下方向に移動させる複数の第2実装ノズルが前記Y方向に並べて取り付けられ、前記第1実装ヘッドと平行に配置される第2実装ヘッドと、
前記第1電子部品ハンドリングユニットと対向して平行に配置され、前記第1電子部品ハンドリングユニットと平行に移動して複数の前記電子部品が前記X方向に並ぶようにピックアップし、複数の前記電子部品を反転すると同時に複数の前記電子部品の並び方向を前記X方向から前記Y方向に変更する第2電子部品ハンドリングユニットと、
を備えることを特徴とする電子部品実装装置。 - 請求項5に記載の電子部品実装装置であって、
前記第1電子部品ハンドリングユニットは、前記X方向に直線移動する第1本体と、前記第1本体の移動方向に対して略45°傾斜して前記第1本体に取り付けられた第1回転軸と、前記第1回転軸に取り付けられ、前記電子部品を吸着して保持する複数の第1ピックアップノズルが直線状に配置された第1フリップヘッドと、前記第1本体に取り付けられ、前記第1回転軸を回転させて前記第1フリップヘッドを反転させる第1反転駆動機構と、を含み、
前記第1ピックアップノズルは、前記第1回転軸の伸びる方向に対して略45°傾斜するように配列されており、
前記第2電子部品ハンドリングユニットは、前記第1本体と対向して配置され、前記第1本体と並行に直線移動する第2本体と、前記第2本体に取り付けられ、前記第1回転軸と平行な方向に伸びる第2回転軸と、前記第2回転軸に取り付けられ、前記電子部品を吸着して保持する複数の第2ピックアップノズルが直線状に配置された第2フリップヘッドと、前記第2本体に取り付けられ、前記第2回転軸を回転させて前記第2フリップヘッドを反転させる第2反転駆動機構と、を含み、
前記第2ピックアップノズルは、前記第2回転軸の伸びる方向に対して略45°傾斜するように配列されていること、
を特徴とする電子部品実装装置。 - 請求項6に記載の電子部品実装装置であって、
複数の前記第1実装ツールの配列ピッチと、複数の前記第1ピックアップノズルあるいは複数の前記第2ピックアップノズルの配列ピッチとが同一であり、
複数の前記第2実装ツールの配列ピッチと、複数の前記第1ピックアップノズルあるいは複数の前記第2ピックアップノズルの配列ピッチとが同一であること、
を特徴とする電子部品実装装置。 - 請求項6または7に記載の電子部品実装装置であって、
前記第1フリップヘッドと、前記第2フリップヘッドとは、反転していない状態で、前記第1本体及び前記第2本体の移動方向と平行な一の直線上を移動可能で、
前記第1電子部品ハンドリングユニットは、前記第1電子部品ハンドリングユニットの前記第1フリップヘッドを反転させた状態で、前記第2フリップヘッドを反転させていない前記第2電子部品ハンドリングユニットと移動方向にすれ違い可能であり、
前記第2電子部品ハンドリングユニットは、前記第2電子部品ハンドリングユニットの前記第2フリップヘッドを反転させた状態で、前記第1フリップヘッドを反転させていない前記第1電子部品ハンドリングユニットと移動方向にすれ違い可能であること、
を特徴とする電子部品実装装置。 - 請求項8に記載の電子部品実装装置であって、
前記第1フリップヘッドは、前記第1回転軸に接続される第1ベースを含み、
前記第2フリップヘッドは、前記第2回転軸に接続される第2ベースを含み、
前記第1回転軸は第1ベースの第1上面に接続され、前記第1ピックアップノズルは、前記第1ベースの第1下面に取り付けられ、
前記第2回転軸は第2ベースの第2上面に接続され、前記第2ピックアップノズルは、前記第2ベースの第2下面に取り付けられ、
前記第1ベースの前記第1上面は、前記第1回転軸の第1中心線から前記第1ピックアップノズルの先端方向にずれており、
前記第2ベースの第2上面は、前記第2回転軸の第2中心線から前記第2ピックアップノズルの先端方向にずれていること、
を特徴とする電子部品実装装置。 - 請求項8に記載の電子部品実装装置であって、
前記第1フリップヘッドは、前記第1回転軸の第1中心線と前記一の直線との交点から前記一の直線に沿って前記第1回転軸の根元側にずらして前記第1回転軸に取り付けられ、
前記第2フリップヘッドは、前記第2回転軸の第2中心線と前記一の直線との交点から前記一の直線に沿って前記第2回転軸の根元側にずらして前記第2回転軸に取り付けられ、
前記第1フリップヘッドのずれ量は、前記第2フリップヘッドが反転していない場合の前記第2フリップヘッドの前記一の直線から第1本体側への突出量よりも大きく、
前記第2フリップヘッドのずれ量は、前記第1フリップヘッドが反転していない場合の前記第1フリップヘッドの前記一の直線から第2本体側への突出量よりも大きいこと、
を特徴とする電子部品実装装置。 - 請求項1から3のいずれか1項に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。 - 請求項4に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。 - 請求項5から7のいずれか1項に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。 - 請求項8に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。 - 請求項9に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。 - 請求項10に記載の電子部品実装装置であって、
ダイシングしたウェーハを保持するウェーハホルダと、
前記ウェーハホルダの下側に配置され、前記ウェーハを突き上げる突き上げユニットと、を含み、
前記ウェーハホルダは、前記Y方向にのみ移動し、
前記突き上げユニットは、前記X方向にのみ移動すること、
を特徴とする電子部品実装装置。
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