JP5507775B1 - ボンディング装置およびボンディング方法 - Google Patents
ボンディング装置およびボンディング方法 Download PDFInfo
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- JP5507775B1 JP5507775B1 JP2013553724A JP2013553724A JP5507775B1 JP 5507775 B1 JP5507775 B1 JP 5507775B1 JP 2013553724 A JP2013553724 A JP 2013553724A JP 2013553724 A JP2013553724 A JP 2013553724A JP 5507775 B1 JP5507775 B1 JP 5507775B1
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000001179 sorption measurement Methods 0.000 claims description 38
- 230000007246 mechanism Effects 0.000 description 27
- 239000000758 substrate Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000012790 confirmation Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Abstract
一対の吸着コレットを用いて、一つの供給部材配置位置に配設されたチップ供給部材からチップをピックアップし、一対の被ボンディング部材配置位置に配置された被ボンディング部材にチップをボンディングするものである。チップをピックアップする一対の吸着コレットと、第1の吸着コレットを供給部材配置位置に搬送した状態で、第2の吸着コレットを一方の被ボンディング部材配置位置に搬送した状態とし、第2の吸着コレットを供給部材配置位置に搬送した状態で、第1の吸着コレットを他方の被ボンディング部材配置位置に搬送した状態とする搬送手段と、吸着コレットを上下動させる上下動手段とを備える。
Description
12 チップ供給部材
15,16,35,36 吸着コレット
17 搬送手段
18 上下動手段
P 供給部材配置位置
Q1,Q2 被ボンディング部材配置位置
Claims (4)
- ピックアップされるチップを有するチップ供給部材が配置される一つの供給部材配置位置と、チップがボンディングされる被ボンディング部材が配置される一対の被ボンディング部材配置位置とが設けられたボンディング装置であって、
チップをピックアップする少なくも一対の吸着コレットと、
第1の吸着コレットを供給部材配置位置に搬送した状態で、第2の吸着コレットを一方の被ボンディング部材配置位置に搬送した状態とし、第2の吸着コレットを供給部材配置位置に搬送した状態で、第1の吸着コレットを他方の被ボンディング部材配置位置に搬送した状態とする搬送手段と、
吸着コレットを上下動させる上下動手段とを備え、搬送手段は、前記一対の吸着コレットを一つの水平方向軸に沿った往復動搬送を行うことを特徴とするボンディング装置。 - 第1の吸着コレットと第2の吸着コレットとを機械的に連結して、供給部材配置位置と被ボンディング部材配置位置との間の吸着コレットの移動を同一タイミング及び同一ストロークとしたことを特徴とする請求項1に記載のボンディング装置。
- 第1の吸着コレットの近傍に第3の吸着コレットが配設されるとともに、第2の吸着コレットの近傍に第4の吸着コレットが配設され、
第1及び第3の吸着コレットを供給部材配置位置に搬送した状態で、第2及び第4の吸着コレットを一方の被ボンディング部材配置位置に搬送した状態となり、第2及び第4の吸着コレットを供給部材配置位置に搬送した状態で、第1及び第3の吸着コレットを他方の被ボンディング部材配置位置に搬送した状態となることを特徴とする請求項1又は請求項2に記載のボンディング装置。 - 少なくとも一対の吸着コレットを用いて、一つの供給部材配置位置に配設されたチップ供給部材からチップをピックアップし、一対の被ボンディング部材配置位置に配置された被ボンディング部材にピックアップしたチップをボンディングするボンディング方法であって、
第1の吸着コレットを供給部材配置位置に搬送した状態で、第2の吸着コレットを一方の被ボンディング部材配置位置に搬送した状態とし、第2の吸着コレットを前記供給部材配置位置に搬送した状態で、第1の吸着コレットを他方の被ボンディング部材配置位置に搬送した状態とし、吸着コレットが供給部材配置位置に搬送された状態でピックアップ動作を行い、吸着コレットが被ボンディング部材配置位置に搬送された状態でボンディング動作を行うことを特徴とするボンディング方法。
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PCT/JP2013/081608 WO2015075832A1 (ja) | 2013-11-25 | 2013-11-25 | ボンディング装置およびボンディング方法 |
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JP2014015643A Division JP5781642B2 (ja) | 2014-01-30 | 2014-01-30 | ボンディング装置 |
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JP5507775B1 true JP5507775B1 (ja) | 2014-05-28 |
JPWO2015075832A1 JPWO2015075832A1 (ja) | 2017-03-16 |
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Cited By (2)
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KR20200143896A (ko) * | 2019-06-17 | 2020-12-28 | 세메스 주식회사 | 다이 본딩 방법 |
CN113661564A (zh) * | 2019-04-11 | 2021-11-16 | 株式会社新川 | 接合装置 |
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JP6573813B2 (ja) * | 2015-09-30 | 2019-09-11 | ファスフォードテクノロジ株式会社 | ダイボンダおよび半導体装置の製造方法 |
TWI696230B (zh) * | 2019-03-04 | 2020-06-11 | 智優科技股份有限公司 | 晶片取放設備 |
CN113644013B (zh) * | 2021-08-11 | 2022-04-01 | 江苏芯丰集成电路有限公司 | 一种用于集成电路芯片的固晶系统及其方法 |
Citations (1)
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JP2002198381A (ja) * | 2000-12-26 | 2002-07-12 | Nec Machinery Corp | ワーク移載装置 |
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JPS5935177B2 (ja) * | 1980-10-15 | 1984-08-27 | 株式会社新川 | ダイボンデイング装置 |
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JP2002198381A (ja) * | 2000-12-26 | 2002-07-12 | Nec Machinery Corp | ワーク移載装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113661564A (zh) * | 2019-04-11 | 2021-11-16 | 株式会社新川 | 接合装置 |
CN113661564B (zh) * | 2019-04-11 | 2024-03-01 | 株式会社新川 | 接合装置 |
KR20200143896A (ko) * | 2019-06-17 | 2020-12-28 | 세메스 주식회사 | 다이 본딩 방법 |
KR102267950B1 (ko) * | 2019-06-17 | 2021-06-22 | 세메스 주식회사 | 다이 본딩 방법 |
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JPWO2015075832A1 (ja) | 2017-03-16 |
WO2015075832A1 (ja) | 2015-05-28 |
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