SG11202103563XA - Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same - Google Patents

Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Info

Publication number
SG11202103563XA
SG11202103563XA SG11202103563XA SG11202103563XA SG11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA
Authority
SG
Singapore
Prior art keywords
methods
same
laser
operating
processing
Prior art date
Application number
SG11202103563XA
Other languages
English (en)
Inventor
James Brookhyser
Jan Kleinert
Mark Kosmowski
Timothy Nuckolls
Jered Richter
Fumiyo Yoshino
Steve Meliza
Mehmet Alpay
Yuan Liu
Kurt Eaton
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of SG11202103563XA publication Critical patent/SG11202103563XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane in at least three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/704—Beam dispersers, e.g. beam wells

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Lenses (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
SG11202103563XA 2019-01-31 2020-01-03 Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same SG11202103563XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962799218P 2019-01-31 2019-01-31
US201962832064P 2019-04-10 2019-04-10
US201962854579P 2019-05-30 2019-05-30
PCT/US2020/012219 WO2020159666A1 (en) 2019-01-31 2020-01-03 Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Publications (1)

Publication Number Publication Date
SG11202103563XA true SG11202103563XA (en) 2021-05-28

Family

ID=71842451

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103563XA SG11202103563XA (en) 2019-01-31 2020-01-03 Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Country Status (8)

Country Link
US (1) US12576457B2 (https=)
EP (1) EP3917717A4 (https=)
JP (2) JP7573535B2 (https=)
KR (2) KR102795535B1 (https=)
CN (1) CN112867578A (https=)
SG (1) SG11202103563XA (https=)
TW (3) TWI892641B (https=)
WO (1) WO2020159666A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12103110B2 (en) * 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
KR20230048372A (ko) 2020-08-04 2023-04-11 유니버시티 오브 매릴랜드, 칼리지 파크 전체-필드 브릴루앙 현미경 시스템 및 방법
CN112059422A (zh) * 2020-09-12 2020-12-11 北京航空航天大学 用于半导体晶圆研磨的激光加工设备
US12070898B2 (en) * 2020-11-12 2024-08-27 Eagle Technology, Llc Additive manufacturing device with acousto-optic deflector and related methods
JP7538016B2 (ja) * 2020-11-30 2024-08-21 株式会社Ｓｃｒｅｅｎホールディングス 光学装置および３次元造形装置
US20220176495A1 (en) * 2020-12-04 2022-06-09 Lawrence Livermore National Security, Llc System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy
US12092581B2 (en) * 2020-12-17 2024-09-17 The Boeing Company Laser bond inspection system and method
TWI754553B (zh) * 2021-02-25 2022-02-01 東捷科技股份有限公司 焊接設備
JP7542198B2 (ja) * 2021-04-02 2024-08-30 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッド及びレーザ加工システム並びにレーザ加工システムの異常判定方法
CN117441225A (zh) * 2021-06-11 2024-01-23 株式会社日本显示器 层叠体及层叠体的制造方法
WO2022271483A1 (en) 2021-06-21 2022-12-29 Electro Scientific Industries, Inc. Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics
CN113478097B (zh) * 2021-07-05 2022-11-29 上海维宏智能技术有限公司 激光切割数控系统中实现圆孔环绕排序处理的方法、装置、处理器及其计算机可读存储介质
US12224547B2 (en) * 2021-11-16 2025-02-11 Taiwan Semiconductor Manufacturing Company, Ltd. Laser device and method of using the same
US11874163B2 (en) 2022-01-14 2024-01-16 Ophir Optronics Solutions, Ltd. Laser measurement apparatus having a removable and replaceable beam dump
WO2023146631A1 (en) * 2022-01-28 2023-08-03 Electro Scientific Industries, Inc. Germanium aod system with parallel and perpendicular orientations
US20230259001A1 (en) * 2022-02-16 2023-08-17 Quantinuum Llc Fast frequency-tunable optical relay and methods of use
TW202337606A (zh) * 2022-02-27 2023-10-01 美商伊雷克托科學工業股份有限公司 用於聲光偏轉器(aod)之熱穩定操作的方法和設備
US20250353108A1 (en) * 2022-06-02 2025-11-20 Electro Scientific Industries, Inc. Laser processing apparatus including laser sensor system and methods of measurement of beam characteristics
US12487312B2 (en) * 2022-07-15 2025-12-02 Apple Inc. Dynamic and intermittent localization
US20240152022A1 (en) * 2022-11-04 2024-05-09 Orbotech Ltd. Passive dispersion compensation for an acousto-optic deflector
CN120958375A (zh) * 2023-04-07 2025-11-14 伊雷克托科学工业股份有限公司 用于具有减少的声波智能的声光偏转器的热稳定操作的系统和方法
US20240399779A1 (en) * 2023-06-02 2024-12-05 Markem-Imaje Corporation Method and apparatus for high contrast printing
DE102024112132A1 (de) * 2024-04-30 2025-10-30 TRUMPF Laser SE Bearbeitungskopf für eine Laserbearbeitungsanlage mit gemeinsamer Fokussierung mehrerer Teilstrahlen, Laserbearbeitungsanlage damit und Verfahren zu Materialbearbeitung
US20250347978A1 (en) * 2024-05-10 2025-11-13 Perceptron, Inc. Liquid lens shutter synchronization for optical profilometry
CN120055909B (zh) * 2025-04-28 2025-07-22 中国科学院长春光学精密机械与物理研究所 磁流变抛光多面共体元件一体加工位姿计算方法
CN121559971B (zh) * 2026-01-23 2026-04-07 北京正时精控科技有限公司 基于高功率激光加工的振镜热变形精度补偿方法及系统

Family Cites Families (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609009A (en) 1969-02-13 1971-09-28 Rca Corp Binary light beam deflector using acoustic waves
US4912487A (en) 1988-03-25 1990-03-27 Texas Instruments Incorporated Laser scanner using focusing acousto-optic device
US5638267A (en) 1994-06-15 1997-06-10 Convolve, Inc. Method and apparatus for minimizing unwanted dynamics in a physical system
US5633747A (en) 1994-12-21 1997-05-27 Tencor Instruments Variable spot-size scanning apparatus
GB9501412D0 (en) * 1995-01-25 1995-03-15 Lumonics Ltd Laser apparatus
JPH08212611A (ja) * 1995-02-01 1996-08-20 Asahi Optical Co Ltd 波面収差補正装置および光情報記録再生装置
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
JP3925986B2 (ja) * 1996-12-16 2007-06-06 富士通株式会社 高さ測定装置及び高さ測定方法
US5917300A (en) 1997-03-10 1999-06-29 Convolve, Inc. Method and apparatus for the control of gantry machines
US5963569A (en) 1997-03-28 1999-10-05 International Business Machines Corporation Multiple channel acousto-optic modulators
JPH1147965A (ja) * 1997-05-28 1999-02-23 Komatsu Ltd レーザ加工装置
US6314463B1 (en) 1998-05-29 2001-11-06 Webspective Software, Inc. Method and system for measuring queue length and delay
US6396561B1 (en) 1998-11-10 2002-05-28 Maniabarco N.V. Method and device for exposing both sides of a sheet
JP3945951B2 (ja) * 1999-01-14 2007-07-18 日立ビアメカニクス株式会社 レーザ加工方法およびレーザ加工機
US6052216A (en) 1999-01-29 2000-04-18 Agfa Corporation Laser and beam intensity modulation system for imagesetting device
JP3642969B2 (ja) * 1999-02-09 2005-04-27 松下電器産業株式会社 レーザー加工装置および方法
WO2001003260A1 (en) * 1999-07-06 2001-01-11 Qinetiq Limited Multi-pass optical amplifier
WO2001052004A1 (en) 2000-01-11 2001-07-19 Electro Scientific Industries, Inc. Abbe error correction system and method
US6421166B1 (en) * 2000-05-09 2002-07-16 The Regents Of The University Of California Compact, flexible, frequency agile parametric wavelength converter
JP3463281B2 (ja) 2000-06-28 2003-11-05 住友重機械工業株式会社 多軸レーザ加工装置及びレーザ加工方法
US6600600B2 (en) 2000-08-14 2003-07-29 Cid, Inc. Projection screen and projection method
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US7245412B2 (en) 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US6606999B2 (en) 2001-03-27 2003-08-19 R. J. Reynolds Tobacco Company Reduced ignition propensity smoking article
WO2002101442A1 (en) * 2001-06-12 2002-12-19 California Institute Of Technology A pzt unimrphed based, deformable mirror with continuous membran e
KR100938325B1 (ko) * 2001-06-13 2010-01-22 오르보테크 엘티디. 에너지 전달 시스템
US6674564B2 (en) 2001-06-15 2004-01-06 Maniabarco, Inc. System, method and article of manufacture for a beam splitting acousto-optical modulator
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
JP2003053576A (ja) 2001-08-16 2003-02-26 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
US6606998B1 (en) 2001-10-05 2003-08-19 Ely Gold Simple simulated cigarette
US6750421B2 (en) * 2002-02-19 2004-06-15 Gsi Lumonics Ltd. Method and system for laser welding
JP4270891B2 (ja) 2003-01-21 2009-06-03 三洋電機株式会社 Ｅｌ表示装置のレーザーリペア方法
US20030184887A1 (en) 2002-03-28 2003-10-02 Greywall Dennis S. Method and apparatus for the correction of optical signal wave front distortion using fluid pressure adaptive optics
JP2004167545A (ja) 2002-11-20 2004-06-17 Sumitomo Heavy Ind Ltd 多軸レーザ加工装置及び加工方法
JP4014498B2 (ja) 2002-12-17 2007-11-28 日立ビアメカニクス株式会社 多軸のレーザ加工機
JP4662411B2 (ja) 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP2005021947A (ja) 2003-07-03 2005-01-27 Sumitomo Heavy Ind Ltd レーザ加工装置のエネルギモニタ方法及び装置
JP3876237B2 (ja) 2003-07-17 2007-01-31 住友重機械工業株式会社 レーザ加工装置
JP3872462B2 (ja) 2003-09-01 2007-01-24 住友重機械工業株式会社 レーザ加工装置、及びレーザ加工方法
US6931991B1 (en) * 2004-03-31 2005-08-23 Matsushita Electric Industrial Co., Ltd. System for and method of manufacturing gravure printing plates
TWI348408B (en) * 2004-04-28 2011-09-11 Olympus Corp Laser processing device
US7133186B2 (en) * 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing transducers to modulate different axes
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP2006281268A (ja) * 2005-03-31 2006-10-19 Hitachi Via Mechanics Ltd レーザ加工機
CN100353205C (zh) 2005-07-20 2007-12-05 华中科技大学 一种基于二维声光偏转器的激光扫描装置
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
JP4650837B2 (ja) * 2005-09-22 2011-03-16 住友電気工業株式会社 レーザ光学装置
JP2007095936A (ja) * 2005-09-28 2007-04-12 Mitsubishi Electric Corp 炭酸ガスレーザ加工機及び炭酸ガスレーザ加工方法
JP5030512B2 (ja) 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 レーザ加工方法
GB2436871A (en) 2006-04-04 2007-10-10 Pcme Ltd Optical beam dump for particle monitoring system
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
JP2008227164A (ja) * 2007-03-13 2008-09-25 Sharp Corp レーザ加工装置およびレーザ加工方法
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8598490B2 (en) * 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US8229304B1 (en) * 2009-04-30 2012-07-24 Hrl Laboratories, Llc Phase control of a fiber optic bundle
JP5743411B2 (ja) * 2009-05-08 2015-07-01 キヤノン株式会社 光画像撮像装置及びその方法
TWI594828B (zh) * 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
TWI430000B (zh) 2010-07-02 2014-03-11 Ind Tech Res Inst 平面顯示器之修補方法與系統
CN110039173B (zh) 2010-10-22 2021-03-23 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法
US8896909B2 (en) 2010-11-04 2014-11-25 Micronic Ab Method and device scanning a two-dimensional brush through an acousto-optic deflector (AOD) having an extended field in a scanning direction
GB2485985B (en) * 2010-11-30 2015-07-22 Powerphotonic Ltd Laser pulse generation method and apparatus
JP5511644B2 (ja) 2010-12-07 2014-06-04 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
DE112012002844T5 (de) * 2011-07-05 2014-04-24 Electronic Scientific Industries, Inc. Verfahren zur Laserbearbeitung mit einem thermisch stabilisierten akustooptischen Strahlablenker und thermisch stabilisiertes Hochgeschwindigkeits-Laserbearbeitungssystem
JP5657139B2 (ja) * 2011-12-07 2015-01-21 三菱電機株式会社 Ｃｏ２レーザ装置およびｃｏ２レーザ加工装置
EP3054649B1 (en) 2012-02-14 2020-03-25 Intel Corporation Peer to peer networking and sharing systems and methods
JP5885173B2 (ja) * 2012-06-15 2016-03-15 三菱電機株式会社 レーザ加工装置
CN102735617B (zh) * 2012-06-29 2014-06-04 浙江大学 一种超分辨显微方法和装置
US9259802B2 (en) 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102013201968B4 (de) 2013-02-07 2014-08-28 BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung
JP2014172082A (ja) * 2013-03-12 2014-09-22 Advanced Materials Processing Institute Kinki Japan 高出力レーザ加工機
JP6516722B2 (ja) 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
WO2014152526A1 (en) 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction
JP2016516584A (ja) 2013-03-15 2016-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド テーパ制御のためのビーム角度とワークピース移動の連係方法
TWI632013B (zh) 2013-03-15 2018-08-11 美商伊雷克托科學工業股份有限公司 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法
US9304492B2 (en) * 2013-10-31 2016-04-05 Disney Enterprises, Inc. Scalable and tileable holographic displays
DE102014200633B3 (de) * 2014-01-15 2015-05-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche
JP2015135711A (ja) * 2014-01-17 2015-07-27 株式会社日立エルジーデータストレージ 光情報再生装置および光情報再生方法
DE102015001421B4 (de) * 2015-02-06 2016-09-15 Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung Vorrichtung und Verfahren zur Strahldiagnose an Laserbearbeitungs-Optiken (PRl-2015-001)
US10507544B2 (en) * 2015-02-27 2019-12-17 Electro Scientific Industries, Inc Fast beam manipulation for cross-axis miromaching
JP6449094B2 (ja) * 2015-04-23 2019-01-09 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US10471538B2 (en) 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
US9502854B1 (en) * 2015-08-26 2016-11-22 Raytheon Company Self-seeding high power laser
KR20250037607A (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
JP2017159317A (ja) 2016-03-09 2017-09-14 住友重機械工業株式会社 レーザ加工装置
CN108700661A (zh) * 2016-03-17 2018-10-23 伊雷克托科学工业股份有限公司 在镭射加工系统中的像平面的定位
JP2017196639A (ja) * 2016-04-27 2017-11-02 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US10401704B2 (en) * 2016-11-11 2019-09-03 Asml Netherlands B.V. Compensating for a physical effect in an optical system
US10371873B2 (en) 2016-12-07 2019-08-06 Bae Systems Information And Electronic Systems Integration Inc. High fidelity optical beam dump
CN106773072A (zh) * 2016-12-13 2017-05-31 中国科学院光电研究院 激光整形系统与激光整形系统的检测装置
JP6826427B2 (ja) * 2016-12-22 2021-02-03 株式会社村田製作所 レーザ加工装置およびレーザ加工方法
KR102401037B1 (ko) * 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
WO2019010345A1 (en) * 2017-07-07 2019-01-10 University Of Rochester OPTICAL DESIGN FOR TWO DEGREE FREQUENCY SCANNING SYSTEM WITH CURVED SAMPLE PLAN
US11705686B2 (en) 2017-09-22 2023-07-18 Electro Scientific Industries, Inc. Acousto-optic system having phase-shifting reflector

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