CN112867578A - 激光加工设备、其操作方法及使用其加工工件的方法 - Google Patents
激光加工设备、其操作方法及使用其加工工件的方法 Download PDFInfo
- Publication number
- CN112867578A CN112867578A CN202080005766.2A CN202080005766A CN112867578A CN 112867578 A CN112867578 A CN 112867578A CN 202080005766 A CN202080005766 A CN 202080005766A CN 112867578 A CN112867578 A CN 112867578A
- Authority
- CN
- China
- Prior art keywords
- laser energy
- optical
- aod
- positioner
- beam path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane in at least three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/704—Beam dispersers, e.g. beam wells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Lenses (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962799218P | 2019-01-31 | 2019-01-31 | |
| US62/799,218 | 2019-01-31 | ||
| US201962832064P | 2019-04-10 | 2019-04-10 | |
| US62/832,064 | 2019-04-10 | ||
| US201962854579P | 2019-05-30 | 2019-05-30 | |
| US62/854,579 | 2019-05-30 | ||
| PCT/US2020/012219 WO2020159666A1 (en) | 2019-01-31 | 2020-01-03 | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112867578A true CN112867578A (zh) | 2021-05-28 |
Family
ID=71842451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080005766.2A Pending CN112867578A (zh) | 2019-01-31 | 2020-01-03 | 激光加工设备、其操作方法及使用其加工工件的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12576457B2 (https=) |
| EP (1) | EP3917717A4 (https=) |
| JP (2) | JP7573535B2 (https=) |
| KR (2) | KR102795535B1 (https=) |
| CN (1) | CN112867578A (https=) |
| SG (1) | SG11202103563XA (https=) |
| TW (3) | TWI892641B (https=) |
| WO (1) | WO2020159666A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113478097A (zh) * | 2021-07-05 | 2021-10-08 | 上海维宏智能技术有限公司 | 激光切割数控系统中实现圆孔环绕排序处理的方法、装置、处理器及其计算机可读存储介质 |
| WO2022271483A1 (en) | 2021-06-21 | 2022-12-29 | Electro Scientific Industries, Inc. | Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics |
| CN116614182A (zh) * | 2022-02-16 | 2023-08-18 | 量子计算有限责任公司 | 快速可调频光中继器及其使用方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12103110B2 (en) * | 2019-03-22 | 2024-10-01 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
| DE102020201207A1 (de) * | 2020-01-31 | 2021-08-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren |
| KR20230048372A (ko) | 2020-08-04 | 2023-04-11 | 유니버시티 오브 매릴랜드, 칼리지 파크 | 전체-필드 브릴루앙 현미경 시스템 및 방법 |
| CN112059422A (zh) * | 2020-09-12 | 2020-12-11 | 北京航空航天大学 | 用于半导体晶圆研磨的激光加工设备 |
| US12070898B2 (en) * | 2020-11-12 | 2024-08-27 | Eagle Technology, Llc | Additive manufacturing device with acousto-optic deflector and related methods |
| JP7538016B2 (ja) * | 2020-11-30 | 2024-08-21 | 株式会社Screenホールディングス | 光学装置および3次元造形装置 |
| US20220176495A1 (en) * | 2020-12-04 | 2022-06-09 | Lawrence Livermore National Security, Llc | System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy |
| US12092581B2 (en) * | 2020-12-17 | 2024-09-17 | The Boeing Company | Laser bond inspection system and method |
| TWI754553B (zh) * | 2021-02-25 | 2022-02-01 | 東捷科技股份有限公司 | 焊接設備 |
| JP7542198B2 (ja) * | 2021-04-02 | 2024-08-30 | パナソニックIpマネジメント株式会社 | レーザ加工ヘッド及びレーザ加工システム並びにレーザ加工システムの異常判定方法 |
| CN117441225A (zh) * | 2021-06-11 | 2024-01-23 | 株式会社日本显示器 | 层叠体及层叠体的制造方法 |
| US12224547B2 (en) * | 2021-11-16 | 2025-02-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Laser device and method of using the same |
| US11874163B2 (en) | 2022-01-14 | 2024-01-16 | Ophir Optronics Solutions, Ltd. | Laser measurement apparatus having a removable and replaceable beam dump |
| WO2023146631A1 (en) * | 2022-01-28 | 2023-08-03 | Electro Scientific Industries, Inc. | Germanium aod system with parallel and perpendicular orientations |
| TW202337606A (zh) * | 2022-02-27 | 2023-10-01 | 美商伊雷克托科學工業股份有限公司 | 用於聲光偏轉器(aod)之熱穩定操作的方法和設備 |
| US20250353108A1 (en) * | 2022-06-02 | 2025-11-20 | Electro Scientific Industries, Inc. | Laser processing apparatus including laser sensor system and methods of measurement of beam characteristics |
| US12487312B2 (en) * | 2022-07-15 | 2025-12-02 | Apple Inc. | Dynamic and intermittent localization |
| US20240152022A1 (en) * | 2022-11-04 | 2024-05-09 | Orbotech Ltd. | Passive dispersion compensation for an acousto-optic deflector |
| CN120958375A (zh) * | 2023-04-07 | 2025-11-14 | 伊雷克托科学工业股份有限公司 | 用于具有减少的声波智能的声光偏转器的热稳定操作的系统和方法 |
| US20240399779A1 (en) * | 2023-06-02 | 2024-12-05 | Markem-Imaje Corporation | Method and apparatus for high contrast printing |
| DE102024112132A1 (de) * | 2024-04-30 | 2025-10-30 | TRUMPF Laser SE | Bearbeitungskopf für eine Laserbearbeitungsanlage mit gemeinsamer Fokussierung mehrerer Teilstrahlen, Laserbearbeitungsanlage damit und Verfahren zu Materialbearbeitung |
| US20250347978A1 (en) * | 2024-05-10 | 2025-11-13 | Perceptron, Inc. | Liquid lens shutter synchronization for optical profilometry |
| CN120055909B (zh) * | 2025-04-28 | 2025-07-22 | 中国科学院长春光学精密机械与物理研究所 | 磁流变抛光多面共体元件一体加工位姿计算方法 |
| CN121559971B (zh) * | 2026-01-23 | 2026-04-07 | 北京正时精控科技有限公司 | 基于高功率激光加工的振镜热变形精度补偿方法及系统 |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6403920B1 (en) * | 1999-02-09 | 2002-06-11 | Matsushita Electric Industrial Co., Ltd. | Laser processing apparatus and method |
| US6421166B1 (en) * | 2000-05-09 | 2002-07-16 | The Regents Of The University Of California | Compact, flexible, frequency agile parametric wavelength converter |
| US20020196534A1 (en) * | 2001-06-19 | 2002-12-26 | Lizotte Todd E. | Laser beam delivery system with trepanning module |
| US20030184887A1 (en) * | 2002-03-28 | 2003-10-02 | Greywall Dennis S. | Method and apparatus for the correction of optical signal wave front distortion using fluid pressure adaptive optics |
| US20040150871A1 (en) * | 2001-06-12 | 2004-08-05 | Yang Eui Hyeok | Pzt unimrphed based, deformable mirror with continuous membrane |
| CN1538893A (zh) * | 2001-06-13 | 2004-10-20 | �²�̩������˾ | 多束微加工系统和方法 |
| CN1840278A (zh) * | 2005-03-31 | 2006-10-04 | 日立比亚机械股份有限公司 | 激光加工装置 |
| JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
| WO2007113567A1 (en) * | 2006-04-04 | 2007-10-11 | Pcme Ltd. | Optical beam dump |
| US20100140237A1 (en) * | 2008-12-08 | 2010-06-10 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100301023A1 (en) * | 2009-05-28 | 2010-12-02 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
| US20110298156A1 (en) * | 2008-03-31 | 2011-12-08 | Electro Scientific Industries, Inc. | Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes |
| US20120044455A1 (en) * | 2009-05-08 | 2012-02-23 | Canon Kabushiki Kaisha | Optical imaging apparatus and method for imaging an optical image |
| US20120298650A1 (en) * | 2010-11-30 | 2012-11-29 | Krzysztof Michal Nowak | Laser Pulse Generation Method and Apparatus |
| US20180156947A1 (en) * | 2016-12-07 | 2018-06-07 | Bae Systems Information And Electronic Systems Integration Inc. | High fidelity optical beam dump |
| CN108213743A (zh) * | 2016-12-22 | 2018-06-29 | 株式会社村田制作所 | 激光加工装置及激光加工方法 |
Family Cites Families (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3609009A (en) | 1969-02-13 | 1971-09-28 | Rca Corp | Binary light beam deflector using acoustic waves |
| US4912487A (en) | 1988-03-25 | 1990-03-27 | Texas Instruments Incorporated | Laser scanner using focusing acousto-optic device |
| US5638267A (en) | 1994-06-15 | 1997-06-10 | Convolve, Inc. | Method and apparatus for minimizing unwanted dynamics in a physical system |
| US5633747A (en) | 1994-12-21 | 1997-05-27 | Tencor Instruments | Variable spot-size scanning apparatus |
| GB9501412D0 (en) * | 1995-01-25 | 1995-03-15 | Lumonics Ltd | Laser apparatus |
| JPH08212611A (ja) * | 1995-02-01 | 1996-08-20 | Asahi Optical Co Ltd | 波面収差補正装置および光情報記録再生装置 |
| US5847960A (en) | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
| US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| JP3925986B2 (ja) * | 1996-12-16 | 2007-06-06 | 富士通株式会社 | 高さ測定装置及び高さ測定方法 |
| US5917300A (en) | 1997-03-10 | 1999-06-29 | Convolve, Inc. | Method and apparatus for the control of gantry machines |
| US5963569A (en) | 1997-03-28 | 1999-10-05 | International Business Machines Corporation | Multiple channel acousto-optic modulators |
| JPH1147965A (ja) * | 1997-05-28 | 1999-02-23 | Komatsu Ltd | レーザ加工装置 |
| US6314463B1 (en) | 1998-05-29 | 2001-11-06 | Webspective Software, Inc. | Method and system for measuring queue length and delay |
| US6396561B1 (en) | 1998-11-10 | 2002-05-28 | Maniabarco N.V. | Method and device for exposing both sides of a sheet |
| US6052216A (en) | 1999-01-29 | 2000-04-18 | Agfa Corporation | Laser and beam intensity modulation system for imagesetting device |
| WO2001003260A1 (en) * | 1999-07-06 | 2001-01-11 | Qinetiq Limited | Multi-pass optical amplifier |
| WO2001052004A1 (en) | 2000-01-11 | 2001-07-19 | Electro Scientific Industries, Inc. | Abbe error correction system and method |
| JP3463281B2 (ja) | 2000-06-28 | 2003-11-05 | 住友重機械工業株式会社 | 多軸レーザ加工装置及びレーザ加工方法 |
| US6600600B2 (en) | 2000-08-14 | 2003-07-29 | Cid, Inc. | Projection screen and projection method |
| US6816294B2 (en) | 2001-02-16 | 2004-11-09 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
| US7245412B2 (en) | 2001-02-16 | 2007-07-17 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
| US6606999B2 (en) | 2001-03-27 | 2003-08-19 | R. J. Reynolds Tobacco Company | Reduced ignition propensity smoking article |
| US6674564B2 (en) | 2001-06-15 | 2004-01-06 | Maniabarco, Inc. | System, method and article of manufacture for a beam splitting acousto-optical modulator |
| JP2003053576A (ja) | 2001-08-16 | 2003-02-26 | Sumitomo Heavy Ind Ltd | レーザ加工方法及び装置 |
| US6606998B1 (en) | 2001-10-05 | 2003-08-19 | Ely Gold | Simple simulated cigarette |
| US6750421B2 (en) * | 2002-02-19 | 2004-06-15 | Gsi Lumonics Ltd. | Method and system for laser welding |
| JP4270891B2 (ja) | 2003-01-21 | 2009-06-03 | 三洋電機株式会社 | El表示装置のレーザーリペア方法 |
| JP2004167545A (ja) | 2002-11-20 | 2004-06-17 | Sumitomo Heavy Ind Ltd | 多軸レーザ加工装置及び加工方法 |
| JP4014498B2 (ja) | 2002-12-17 | 2007-11-28 | 日立ビアメカニクス株式会社 | 多軸のレーザ加工機 |
| JP4662411B2 (ja) | 2003-03-14 | 2011-03-30 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
| US6947454B2 (en) | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| JP2005021947A (ja) | 2003-07-03 | 2005-01-27 | Sumitomo Heavy Ind Ltd | レーザ加工装置のエネルギモニタ方法及び装置 |
| JP3876237B2 (ja) | 2003-07-17 | 2007-01-31 | 住友重機械工業株式会社 | レーザ加工装置 |
| JP3872462B2 (ja) | 2003-09-01 | 2007-01-24 | 住友重機械工業株式会社 | レーザ加工装置、及びレーザ加工方法 |
| US6931991B1 (en) * | 2004-03-31 | 2005-08-23 | Matsushita Electric Industrial Co., Ltd. | System for and method of manufacturing gravure printing plates |
| TWI348408B (en) * | 2004-04-28 | 2011-09-11 | Olympus Corp | Laser processing device |
| US7133186B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing transducers to modulate different axes |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| CN100353205C (zh) | 2005-07-20 | 2007-12-05 | 华中科技大学 | 一种基于二维声光偏转器的激光扫描装置 |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| JP4650837B2 (ja) * | 2005-09-22 | 2011-03-16 | 住友電気工業株式会社 | レーザ光学装置 |
| JP2007095936A (ja) * | 2005-09-28 | 2007-04-12 | Mitsubishi Electric Corp | 炭酸ガスレーザ加工機及び炭酸ガスレーザ加工方法 |
| JP5030512B2 (ja) | 2005-09-30 | 2012-09-19 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
| US7834293B2 (en) | 2006-05-02 | 2010-11-16 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing |
| US7605343B2 (en) | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
| JP2008227164A (ja) * | 2007-03-13 | 2008-09-25 | Sharp Corp | レーザ加工装置およびレーザ加工方法 |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| US8076605B2 (en) | 2007-06-25 | 2011-12-13 | Electro Scientific Industries, Inc. | Systems and methods for adapting parameters to increase throughput during laser-based wafer processing |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8229304B1 (en) * | 2009-04-30 | 2012-07-24 | Hrl Laboratories, Llc | Phase control of a fiber optic bundle |
| TWI430000B (zh) | 2010-07-02 | 2014-03-11 | Ind Tech Res Inst | 平面顯示器之修補方法與系統 |
| CN110039173B (zh) | 2010-10-22 | 2021-03-23 | 伊雷克托科学工业股份有限公司 | 用于光束抖动和刮削的镭射加工系统和方法 |
| US8896909B2 (en) | 2010-11-04 | 2014-11-25 | Micronic Ab | Method and device scanning a two-dimensional brush through an acousto-optic deflector (AOD) having an extended field in a scanning direction |
| JP5511644B2 (ja) | 2010-12-07 | 2014-06-04 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| US8648277B2 (en) | 2011-03-31 | 2014-02-11 | Electro Scientific Industries, Inc. | Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies |
| DE112012002844T5 (de) * | 2011-07-05 | 2014-04-24 | Electronic Scientific Industries, Inc. | Verfahren zur Laserbearbeitung mit einem thermisch stabilisierten akustooptischen Strahlablenker und thermisch stabilisiertes Hochgeschwindigkeits-Laserbearbeitungssystem |
| JP5657139B2 (ja) * | 2011-12-07 | 2015-01-21 | 三菱電機株式会社 | Co2レーザ装置およびco2レーザ加工装置 |
| EP3054649B1 (en) | 2012-02-14 | 2020-03-25 | Intel Corporation | Peer to peer networking and sharing systems and methods |
| JP5885173B2 (ja) * | 2012-06-15 | 2016-03-15 | 三菱電機株式会社 | レーザ加工装置 |
| CN102735617B (zh) * | 2012-06-29 | 2014-06-04 | 浙江大学 | 一种超分辨显微方法和装置 |
| US9259802B2 (en) | 2012-07-26 | 2016-02-16 | Electro Scientific Industries, Inc. | Method and apparatus for collecting material produced by processing workpieces |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| DE102013201968B4 (de) | 2013-02-07 | 2014-08-28 | BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH | Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung |
| JP2014172082A (ja) * | 2013-03-12 | 2014-09-22 | Advanced Materials Processing Institute Kinki Japan | 高出力レーザ加工機 |
| JP6516722B2 (ja) | 2013-03-15 | 2019-05-22 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | ビームポジショナのレーザ出射に基づく制御 |
| WO2014152526A1 (en) | 2013-03-15 | 2014-09-25 | Electro Scientific Industries, Inc. | Laser systems and methods for aod tool settling for aod travel reduction |
| JP2016516584A (ja) | 2013-03-15 | 2016-06-09 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | テーパ制御のためのビーム角度とワークピース移動の連係方法 |
| TWI632013B (zh) | 2013-03-15 | 2018-08-11 | 美商伊雷克托科學工業股份有限公司 | 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法 |
| US9304492B2 (en) * | 2013-10-31 | 2016-04-05 | Disney Enterprises, Inc. | Scalable and tileable holographic displays |
| DE102014200633B3 (de) * | 2014-01-15 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche |
| JP2015135711A (ja) * | 2014-01-17 | 2015-07-27 | 株式会社日立エルジーデータストレージ | 光情報再生装置および光情報再生方法 |
| DE102015001421B4 (de) * | 2015-02-06 | 2016-09-15 | Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung | Vorrichtung und Verfahren zur Strahldiagnose an Laserbearbeitungs-Optiken (PRl-2015-001) |
| US10507544B2 (en) * | 2015-02-27 | 2019-12-17 | Electro Scientific Industries, Inc | Fast beam manipulation for cross-axis miromaching |
| JP6449094B2 (ja) * | 2015-04-23 | 2019-01-09 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| US10471538B2 (en) | 2015-07-09 | 2019-11-12 | Orbotech Ltd. | Control of lift ejection angle |
| US9502854B1 (en) * | 2015-08-26 | 2016-11-22 | Raytheon Company | Self-seeding high power laser |
| KR20250037607A (ko) * | 2015-09-09 | 2025-03-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들 |
| JP2017159317A (ja) | 2016-03-09 | 2017-09-14 | 住友重機械工業株式会社 | レーザ加工装置 |
| CN108700661A (zh) * | 2016-03-17 | 2018-10-23 | 伊雷克托科学工业股份有限公司 | 在镭射加工系统中的像平面的定位 |
| JP2017196639A (ja) * | 2016-04-27 | 2017-11-02 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| US10401704B2 (en) * | 2016-11-11 | 2019-09-03 | Asml Netherlands B.V. | Compensating for a physical effect in an optical system |
| CN106773072A (zh) * | 2016-12-13 | 2017-05-31 | 中国科学院光电研究院 | 激光整形系统与激光整形系统的检测装置 |
| KR102401037B1 (ko) * | 2016-12-30 | 2022-05-24 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템 |
| WO2019010345A1 (en) * | 2017-07-07 | 2019-01-10 | University Of Rochester | OPTICAL DESIGN FOR TWO DEGREE FREQUENCY SCANNING SYSTEM WITH CURVED SAMPLE PLAN |
| US11705686B2 (en) | 2017-09-22 | 2023-07-18 | Electro Scientific Industries, Inc. | Acousto-optic system having phase-shifting reflector |
-
2019
- 2019-12-25 TW TW113117781A patent/TWI892641B/zh active
- 2019-12-25 TW TW114124528A patent/TW202539839A/zh unknown
- 2019-12-25 TW TW108147621A patent/TWI843784B/zh active
-
2020
- 2020-01-03 US US17/276,736 patent/US12576457B2/en active Active
- 2020-01-03 JP JP2021542372A patent/JP7573535B2/ja active Active
- 2020-01-03 EP EP20748524.4A patent/EP3917717A4/en active Pending
- 2020-01-03 WO PCT/US2020/012219 patent/WO2020159666A1/en not_active Ceased
- 2020-01-03 KR KR1020217016628A patent/KR102795535B1/ko active Active
- 2020-01-03 SG SG11202103563XA patent/SG11202103563XA/en unknown
- 2020-01-03 CN CN202080005766.2A patent/CN112867578A/zh active Pending
- 2020-01-03 KR KR1020257011599A patent/KR20250052497A/ko active Pending
-
2024
- 2024-08-23 JP JP2024143263A patent/JP7819261B2/ja active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
| US6403920B1 (en) * | 1999-02-09 | 2002-06-11 | Matsushita Electric Industrial Co., Ltd. | Laser processing apparatus and method |
| US6421166B1 (en) * | 2000-05-09 | 2002-07-16 | The Regents Of The University Of California | Compact, flexible, frequency agile parametric wavelength converter |
| US20040150871A1 (en) * | 2001-06-12 | 2004-08-05 | Yang Eui Hyeok | Pzt unimrphed based, deformable mirror with continuous membrane |
| CN1538893A (zh) * | 2001-06-13 | 2004-10-20 | �²�̩������˾ | 多束微加工系统和方法 |
| US20020196534A1 (en) * | 2001-06-19 | 2002-12-26 | Lizotte Todd E. | Laser beam delivery system with trepanning module |
| US20030184887A1 (en) * | 2002-03-28 | 2003-10-02 | Greywall Dennis S. | Method and apparatus for the correction of optical signal wave front distortion using fluid pressure adaptive optics |
| CN1840278A (zh) * | 2005-03-31 | 2006-10-04 | 日立比亚机械股份有限公司 | 激光加工装置 |
| WO2007113567A1 (en) * | 2006-04-04 | 2007-10-11 | Pcme Ltd. | Optical beam dump |
| US20110298156A1 (en) * | 2008-03-31 | 2011-12-08 | Electro Scientific Industries, Inc. | Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes |
| US20100140237A1 (en) * | 2008-12-08 | 2010-06-10 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20120044455A1 (en) * | 2009-05-08 | 2012-02-23 | Canon Kabushiki Kaisha | Optical imaging apparatus and method for imaging an optical image |
| US20100301023A1 (en) * | 2009-05-28 | 2010-12-02 | Electro Scientific Industries, Inc. | Acousto-optic deflector applications in laser processing of dielectric or other materials |
| US20120298650A1 (en) * | 2010-11-30 | 2012-11-29 | Krzysztof Michal Nowak | Laser Pulse Generation Method and Apparatus |
| US20180156947A1 (en) * | 2016-12-07 | 2018-06-07 | Bae Systems Information And Electronic Systems Integration Inc. | High fidelity optical beam dump |
| CN108213743A (zh) * | 2016-12-22 | 2018-06-29 | 株式会社村田制作所 | 激光加工装置及激光加工方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022271483A1 (en) | 2021-06-21 | 2022-12-29 | Electro Scientific Industries, Inc. | Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics |
| CN117500629A (zh) * | 2021-06-21 | 2024-02-02 | 伊雷克托科学工业股份有限公司 | 包括射束分析系统的激光加工设备以及射束特性的测量和控制方法 |
| CN113478097A (zh) * | 2021-07-05 | 2021-10-08 | 上海维宏智能技术有限公司 | 激光切割数控系统中实现圆孔环绕排序处理的方法、装置、处理器及其计算机可读存储介质 |
| CN116614182A (zh) * | 2022-02-16 | 2023-08-18 | 量子计算有限责任公司 | 快速可调频光中继器及其使用方法 |
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| WO2020159666A1 (en) | 2020-08-06 |
| JP7573535B2 (ja) | 2024-10-25 |
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| TWI892641B (zh) | 2025-08-01 |
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| US12576457B2 (en) | 2026-03-17 |
| KR20210111246A (ko) | 2021-09-10 |
| TW202042946A (zh) | 2020-12-01 |
| TW202434378A (zh) | 2024-09-01 |
| JP2022518898A (ja) | 2022-03-17 |
| KR20250052497A (ko) | 2025-04-18 |
| JP2025000607A (ja) | 2025-01-07 |
| US20220048135A1 (en) | 2022-02-17 |
| TWI843784B (zh) | 2024-06-01 |
| KR102795535B1 (ko) | 2025-04-16 |
| TW202539839A (zh) | 2025-10-16 |
| EP3917717A4 (en) | 2022-11-30 |
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