SG11202103563XA - Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same - Google Patents
Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the sameInfo
- Publication number
- SG11202103563XA SG11202103563XA SG11202103563XA SG11202103563XA SG11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- same
- laser
- operating
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/704—Beam dispersers, e.g. beam wells
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962799218P | 2019-01-31 | 2019-01-31 | |
US201962832064P | 2019-04-10 | 2019-04-10 | |
US201962854579P | 2019-05-30 | 2019-05-30 | |
PCT/US2020/012219 WO2020159666A1 (en) | 2019-01-31 | 2020-01-03 | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202103563XA true SG11202103563XA (en) | 2021-05-28 |
Family
ID=71842451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202103563XA SG11202103563XA (en) | 2019-01-31 | 2020-01-03 | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220048135A1 (en) |
EP (1) | EP3917717A4 (en) |
JP (1) | JP2022518898A (en) |
KR (1) | KR20210111246A (en) |
CN (1) | CN112867578A (en) |
SG (1) | SG11202103563XA (en) |
TW (1) | TW202042946A (en) |
WO (1) | WO2020159666A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200298344A1 (en) * | 2019-03-22 | 2020-09-24 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
CN112059422A (en) * | 2020-09-12 | 2020-12-11 | 北京航空航天大学 | Laser processing equipment for grinding semiconductor wafer |
US20220143905A1 (en) * | 2020-11-12 | 2022-05-12 | Eagle Technology, Llc | Additive manufacturing device with acousto-optic deflector and related methods |
US20220176495A1 (en) * | 2020-12-04 | 2022-06-09 | Lawrence Livermore National Security, Llc | System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy |
US20220196563A1 (en) * | 2020-12-17 | 2022-06-23 | The Boeing Company | Laser bond inspection system and method |
CN117500629A (en) * | 2021-06-21 | 2024-02-02 | 伊雷克托科学工业股份有限公司 | Laser processing apparatus including beam analysis system and method of measuring and controlling beam characteristics |
CN113478097B (en) * | 2021-07-05 | 2022-11-29 | 上海维宏智能技术有限公司 | Method, device and processor for realizing circular hole surrounding sorting processing in laser cutting numerical control system and computer readable storage medium thereof |
US20230155341A1 (en) * | 2021-11-16 | 2023-05-18 | Taiwan Semiconductor Manufacturing Company Limited | Laser device and method of using the same |
US11874163B2 (en) | 2022-01-14 | 2024-01-16 | Ophir Optronics Solutions, Ltd. | Laser measurement apparatus having a removable and replaceable beam dump |
WO2023146631A1 (en) * | 2022-01-28 | 2023-08-03 | Electro Scientific Industries, Inc. | Germanium aod system with parallel and perpendicular orientations |
WO2023164390A1 (en) * | 2022-02-27 | 2023-08-31 | Electro Scientific Industries, Inc. | Method and apparatus for thermally stable operation of aods |
WO2023235066A1 (en) * | 2022-06-02 | 2023-12-07 | Electro Scientific Industries, Inc. | Laser processing apparatus including laser sensor system and methods of measurement of beam characteristics |
Family Cites Families (33)
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JP3925986B2 (en) * | 1996-12-16 | 2007-06-06 | 富士通株式会社 | Height measuring device and height measuring method |
JPH1147965A (en) * | 1997-05-28 | 1999-02-23 | Komatsu Ltd | Laser beam machine |
JP3945951B2 (en) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | Laser processing method and laser processing machine |
JP3642969B2 (en) * | 1999-02-09 | 2005-04-27 | 松下電器産業株式会社 | Laser processing apparatus and method |
US6700698B1 (en) * | 1999-07-06 | 2004-03-02 | Qinetiq Limited | Multi-pass optical amplifier |
US6421166B1 (en) * | 2000-05-09 | 2002-07-16 | The Regents Of The University Of California | Compact, flexible, frequency agile parametric wavelength converter |
US7336412B2 (en) * | 2001-06-12 | 2008-02-26 | California Institute Of Technology | PZT unimorph based, high stroke mems deformable mirror with continuous membrane and method of making the same |
IL159199A0 (en) * | 2001-06-13 | 2004-06-01 | Orbotech Ltd | Multi-beam micro-machining system and method |
US6804269B2 (en) * | 2001-06-19 | 2004-10-12 | Hitachi Via Mechanics, Ltd. | Laser beam delivery system with trepanning module |
US20030184887A1 (en) * | 2002-03-28 | 2003-10-02 | Greywall Dennis S. | Method and apparatus for the correction of optical signal wave front distortion using fluid pressure adaptive optics |
US6931991B1 (en) * | 2004-03-31 | 2005-08-23 | Matsushita Electric Industrial Co., Ltd. | System for and method of manufacturing gravure printing plates |
JP2006281268A (en) * | 2005-03-31 | 2006-10-19 | Hitachi Via Mechanics Ltd | Laser beam machine |
JP4650837B2 (en) * | 2005-09-22 | 2011-03-16 | 住友電気工業株式会社 | Laser optical device |
GB2436871A (en) * | 2006-04-04 | 2007-10-10 | Pcme Ltd | Optical beam dump for particle monitoring system |
US8598490B2 (en) * | 2008-03-31 | 2013-12-03 | Electro Scientific Industries, Inc. | Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes |
US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
US8229304B1 (en) * | 2009-04-30 | 2012-07-24 | Hrl Laboratories, Llc | Phase control of a fiber optic bundle |
JP5743411B2 (en) * | 2009-05-08 | 2015-07-01 | キヤノン株式会社 | Optical imaging apparatus and method |
TWI594828B (en) * | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
GB2485985B (en) * | 2010-11-30 | 2015-07-22 | Powerphotonic Ltd | Laser pulse generation method and apparatus |
US8593722B2 (en) * | 2011-07-05 | 2013-11-26 | Electro Scientific Industries, Inc. | Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use |
CN102735617B (en) * | 2012-06-29 | 2014-06-04 | 浙江大学 | Super-resolution microscopic method and super-resolution microscopic device |
US9304492B2 (en) * | 2013-10-31 | 2016-04-05 | Disney Enterprises, Inc. | Scalable and tileable holographic displays |
DE102014200633B3 (en) * | 2014-01-15 | 2015-05-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Machining apparatus and method for laser processing a surface |
JP2015135711A (en) * | 2014-01-17 | 2015-07-27 | 株式会社日立エルジーデータストレージ | Optical information reproduction device and optical information reproduction method |
DE102015001421B4 (en) * | 2015-02-06 | 2016-09-15 | Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung | Device and method for beam diagnosis on laser processing optics (PRl-2015-001) |
JP6785238B2 (en) * | 2015-02-27 | 2020-11-18 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | High-speed beam operation for cross-axis microfabrication |
US10401704B2 (en) * | 2016-11-11 | 2019-09-03 | Asml Netherlands B.V. | Compensating for a physical effect in an optical system |
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CN106773072A (en) * | 2016-12-13 | 2017-05-31 | 中国科学院光电研究院 | The detection means of laser shaping system and laser shaping system |
JP6826427B2 (en) * | 2016-12-22 | 2021-02-03 | 株式会社村田製作所 | Laser machining equipment and laser machining method |
WO2018126078A1 (en) * | 2016-12-30 | 2018-07-05 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
US11845143B2 (en) * | 2017-07-07 | 2023-12-19 | University Of Rochester | Optical design for a two-degree-of-freedom scanning system with a curved sample plane |
-
2019
- 2019-12-25 TW TW108147621A patent/TW202042946A/en unknown
-
2020
- 2020-01-03 WO PCT/US2020/012219 patent/WO2020159666A1/en unknown
- 2020-01-03 JP JP2021542372A patent/JP2022518898A/en active Pending
- 2020-01-03 CN CN202080005766.2A patent/CN112867578A/en active Pending
- 2020-01-03 US US17/276,736 patent/US20220048135A1/en active Pending
- 2020-01-03 SG SG11202103563XA patent/SG11202103563XA/en unknown
- 2020-01-03 KR KR1020217016628A patent/KR20210111246A/en not_active Application Discontinuation
- 2020-01-03 EP EP20748524.4A patent/EP3917717A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20210111246A (en) | 2021-09-10 |
EP3917717A4 (en) | 2022-11-30 |
TW202042946A (en) | 2020-12-01 |
JP2022518898A (en) | 2022-03-17 |
CN112867578A (en) | 2021-05-28 |
WO2020159666A1 (en) | 2020-08-06 |
US20220048135A1 (en) | 2022-02-17 |
EP3917717A1 (en) | 2021-12-08 |
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