EP3490750A4 - Laser processing apparatus and methods of laser-processing workpieces - Google Patents

Laser processing apparatus and methods of laser-processing workpieces Download PDF

Info

Publication number
EP3490750A4
EP3490750A4 EP17835014.6A EP17835014A EP3490750A4 EP 3490750 A4 EP3490750 A4 EP 3490750A4 EP 17835014 A EP17835014 A EP 17835014A EP 3490750 A4 EP3490750 A4 EP 3490750A4
Authority
EP
European Patent Office
Prior art keywords
laser
methods
processing
processing apparatus
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17835014.6A
Other languages
German (de)
French (fr)
Other versions
EP3490750A1 (en
Inventor
Daragh Finn
Michael KYSLINGER
Jan Kleinert
Zhibin Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP3490750A1 publication Critical patent/EP3490750A1/en
Publication of EP3490750A4 publication Critical patent/EP3490750A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
EP17835014.6A 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces Withdrawn EP3490750A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
PCT/US2017/043229 WO2018022441A1 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Publications (2)

Publication Number Publication Date
EP3490750A1 EP3490750A1 (en) 2019-06-05
EP3490750A4 true EP3490750A4 (en) 2020-04-29

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17835014.6A Withdrawn EP3490750A4 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Country Status (6)

Country Link
EP (1) EP3490750A4 (en)
JP (1) JP2019532815A (en)
KR (1) KR20190025721A (en)
CN (1) CN109862991A (en)
TW (1) TW201803674A (en)
WO (1) WO2018022441A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230121932A (en) * 2018-03-22 2023-08-21 어플라이드 머티어리얼스, 인코포레이티드 Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices
CN112385029A (en) * 2018-05-08 2021-02-19 朗姆研究公司 Atomic layer etch and deposition processing system including lens circuit with telecentric lens, beam folding assembly, or polygon scanner
WO2019236616A1 (en) 2018-06-05 2019-12-12 Electro Scientific Industries, Inc. Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN113412453A (en) * 2019-02-19 2021-09-17 Asml控股股份有限公司 Laser rough machining: engineering roughness of burl tops
CN113977099B (en) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 Ultrafast laser milling method for fiber composite material
TWI826980B (en) * 2022-03-25 2023-12-21 國立陽明交通大學 Method for fabricating an liquid-crystal-aligning electrode and method for fabricating a liquid crystal cell using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116844A (en) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd Method for manufacturing semiconductor device
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (en) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd Laser beam machining method
US20120064695A1 (en) * 2008-04-30 2012-03-15 Electro Scientific Industries, Inc. Dicing a semiconductor wafer
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177L (en) * 2006-02-23 2007-08-24 Picodeon Ltd Oy The method produces good quality surfaces and a product with a good quality surface
EP2252426A4 (en) * 2008-03-21 2014-08-06 Imra America Inc Laser-based material processing methods and systems
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (en) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd Division method
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20160093593A (en) * 2013-12-05 2016-08-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Method and apparatus for internally marking a substrate having a rough surface
CN105108343B (en) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 A kind of process of surface treatment of container soldering joint
CN105468873B (en) * 2015-12-24 2018-08-14 中北大学 The surface-smoothing emulation mode of silicon substrate laser optical waveguide

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116844A (en) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd Method for manufacturing semiconductor device
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (en) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd Laser beam machining method
US20120064695A1 (en) * 2008-04-30 2012-03-15 Electro Scientific Industries, Inc. Dicing a semiconductor wafer
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018022441A1 *

Also Published As

Publication number Publication date
JP2019532815A (en) 2019-11-14
TW201803674A (en) 2018-02-01
EP3490750A1 (en) 2019-06-05
WO2018022441A1 (en) 2018-02-01
CN109862991A (en) 2019-06-07
KR20190025721A (en) 2019-03-11

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