EP3490750A4 - Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner - Google Patents

Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner Download PDF

Info

Publication number
EP3490750A4
EP3490750A4 EP17835014.6A EP17835014A EP3490750A4 EP 3490750 A4 EP3490750 A4 EP 3490750A4 EP 17835014 A EP17835014 A EP 17835014A EP 3490750 A4 EP3490750 A4 EP 3490750A4
Authority
EP
European Patent Office
Prior art keywords
laser
methods
processing
processing apparatus
workpieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17835014.6A
Other languages
German (de)
English (en)
Other versions
EP3490750A1 (fr
Inventor
Daragh Finn
Michael KYSLINGER
Jan Kleinert
Zhibin Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP3490750A1 publication Critical patent/EP3490750A1/fr
Publication of EP3490750A4 publication Critical patent/EP3490750A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
EP17835014.6A 2016-07-28 2017-07-21 Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner Withdrawn EP3490750A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
PCT/US2017/043229 WO2018022441A1 (fr) 2016-07-28 2017-07-21 Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner

Publications (2)

Publication Number Publication Date
EP3490750A1 EP3490750A1 (fr) 2019-06-05
EP3490750A4 true EP3490750A4 (fr) 2020-04-29

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17835014.6A Withdrawn EP3490750A4 (fr) 2016-07-28 2017-07-21 Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner

Country Status (6)

Country Link
EP (1) EP3490750A4 (fr)
JP (1) JP2019532815A (fr)
KR (1) KR20190025721A (fr)
CN (1) CN109862991A (fr)
TW (1) TW201803674A (fr)
WO (1) WO2018022441A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111902917A (zh) * 2018-03-22 2020-11-06 应用材料公司 对用于半导体器件制造的处理部件的陶瓷表面进行激光抛光
WO2019217180A1 (fr) * 2018-05-08 2019-11-14 Lam Research Corporation Systèmes de traitement de dépôt et de gravure de couche atomique comprenant un circuit de lentille avec une lentille télécentrique, un ensemble de pliage de faisceau optique, ou un scanner polygonal
EP3774166A4 (fr) * 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. Appareil de traitement au laser, procédés de fonctionnement dudit appareil, et procédés de traitement de pièces à l'aide dudit appareil
WO2020169326A1 (fr) * 2019-02-19 2020-08-27 Asml Holding N.V. Rugosification laser : concevoir la rugosité du sommet de burl
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US20120064695A1 (en) * 2008-04-30 2012-03-15 Electro Scientific Industries, Inc. Dicing a semiconductor wafer
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2009514C (fr) * 1990-02-07 1995-04-25 Mahmud U. Islam Methode d'usinage par laser
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
EP2252426A4 (fr) * 2008-03-21 2014-08-06 Imra America Inc Procédés et systèmes de traitement au laser de matériaux
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
CN105916626A (zh) * 2013-12-05 2016-08-31 伊雷克托科学工业股份有限公司 用于内部标记具有粗糙表面的基板的方法及设备
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US20120064695A1 (en) * 2008-04-30 2012-03-15 Electro Scientific Industries, Inc. Dicing a semiconductor wafer
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018022441A1 *

Also Published As

Publication number Publication date
JP2019532815A (ja) 2019-11-14
TW201803674A (zh) 2018-02-01
KR20190025721A (ko) 2019-03-11
CN109862991A (zh) 2019-06-07
EP3490750A1 (fr) 2019-06-05
WO2018022441A1 (fr) 2018-02-01

Similar Documents

Publication Publication Date Title
EP3551372A4 (fr) Appareil et procédé de traitement au laser
EP3285956A4 (fr) Appareil et procédé de traitement au laser
EP3463820A4 (fr) Procédé de fabrication d'objets tridimensionnels et appareil associé
EP3731991A4 (fr) Appareil et procédé de traitement au laser
EP3581321A4 (fr) Dispositif et procédé de traitement au laser
EP3235628A4 (fr) Appareil de soudage au laser et procédé de soudage au laser
EP3504024A4 (fr) Procédé et système d'usinage laser de pièces relativement grandes
EP3490750A4 (fr) Appareil de traitement au laser et procédés de traitement au laser de pièces à usiner
EP3563988A4 (fr) Robot d'usinage et procédé d'usinage
EP3437788A4 (fr) Dispositif d'usinage au laser et procédé d'usinage au laser
EP3466599A4 (fr) Dispositif et procédé de soudage au laser
EP3025820A4 (fr) Procédé de traitement au laser et appareil de traitement au laser
PL3308202T3 (pl) Sposób i urządzenie do obróbki laserowej oraz jego podzespół optyczny
EP3446750A4 (fr) Appareil et méthode d'irradiation par laser utilisant un bras de robot
EP3432157A4 (fr) Procédé et appareil de traitement de modes de jonction de tables de données
EP3236424B8 (fr) Appareil de traitement d'informations et son procédé de commande
PL3636379T3 (pl) Sposób i maszyna do obróbki poprzez cięcie przedmiotu obrabianego
EP3342533A4 (fr) Appareil de traitement combiné et procédé de traitement combiné
EP3308896A4 (fr) Appareil d'usinage au laser et procédé de découpe au laser
EP3441176A4 (fr) Procédé de soudage de suivi d'arc et appareil de soudage de suivi d'arc
EP3523083A4 (fr) Système et procédé laser de traitement de matériaux
EP3518089A4 (fr) Procédé et appareil de traitement d'objet d'opération
SG10201701084YA (en) Inspecting apparatus and laser processing apparatus
EP3588138A4 (fr) Appareil et procédé de positionnement par laser
EP3546109A4 (fr) Dispositif de traitement laser et procédé de traitement laser

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20190128

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20200331

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 26/352 20140101ALI20200325BHEP

Ipc: B23K 103/00 20060101ALN20200325BHEP

Ipc: B23K 101/36 20060101ALI20200325BHEP

Ipc: B23K 26/0622 20140101AFI20200325BHEP

Ipc: B23K 26/06 20140101ALI20200325BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20201103