SG11202109881XA - Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same - Google Patents

Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Info

Publication number
SG11202109881XA
SG11202109881XA SG11202109881XA SG11202109881XA SG 11202109881X A SG11202109881X A SG 11202109881XA SG 11202109881X A SG11202109881X A SG 11202109881XA SG 11202109881X A SG11202109881X A SG 11202109881XA
Authority
SG
Singapore
Prior art keywords
methods
same
operating
processing apparatus
workpieces
Prior art date
Application number
Inventor
Jan Kleinert
Zhibin Lin
Joel Schrauben
Mark Unrath
Honghua Hu
Ruolin Chen
Chuan Yang
Geoffrey Lott
Daragh Finn
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of SG11202109881XA publication Critical patent/SG11202109881XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/33—Acousto-optical deflection devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/11—Function characteristic involving infrared radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
SG11202109881X 2019-06-10 2020-05-29 Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same SG11202109881XA (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962859572P 2019-06-10 2019-06-10
US201962930287P 2019-11-04 2019-11-04
US202062970648P 2020-02-05 2020-02-05
US202063026564P 2020-05-18 2020-05-18
PCT/US2020/035152 WO2020251782A1 (en) 2019-06-10 2020-05-29 Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Publications (1)

Publication Number Publication Date
SG11202109881XA true SG11202109881XA (en) 2021-10-28

Family

ID=73781179

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202109881X SG11202109881XA (en) 2019-06-10 2020-05-29 Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Country Status (8)

Country Link
US (1) US20220168847A1 (en)
EP (1) EP3938138A4 (en)
JP (1) JP7543320B2 (en)
KR (1) KR20220016855A (en)
CN (1) CN113710407A (en)
SG (1) SG11202109881XA (en)
TW (1) TW202105863A (en)
WO (1) WO2020251782A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12070898B2 (en) * 2020-11-12 2024-08-27 Eagle Technology, Llc Additive manufacturing device with acousto-optic deflector and related methods
DE102021126360A1 (en) 2021-10-12 2023-04-13 Lpkf Laser & Electronics Aktiengesellschaft Method for processing a workpiece by laser radiation in the form of Lissajous figures and a scanner and a mirror element intended for this purpose
CN113795087B (en) * 2021-11-15 2022-05-03 深圳市大族数控科技股份有限公司 Windowing method and windowing equipment
TWI832186B (en) * 2022-03-28 2024-02-11 國立清華大學 Laser processing method and laser processing system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136270A (en) * 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd Laser beam machining device
JP2006026665A (en) 2004-07-13 2006-02-02 Sumitomo Heavy Ind Ltd Laser boring method
JP5030512B2 (en) 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 Laser processing method
TWI396840B (en) * 2008-07-04 2013-05-21 Hon Hai Prec Ind Co Ltd Vision measuring device and focusing method thereof
JP2010207881A (en) * 2009-03-11 2010-09-24 Panasonic Corp Laser beam machining method and laser beam machining apparatus
JP2015006674A (en) * 2013-06-24 2015-01-15 新光電気工業株式会社 Laser processing apparatus, laser irradiation point correction method, drilling processing method, and wiring substrate manufacturing method
US11077526B2 (en) 2015-09-09 2021-08-03 Electro Scientific Industries, Inc. Laser processing apparatus, methods of laser-processing workpieces and related arrangements
JP6997566B2 (en) * 2017-09-14 2022-01-17 株式会社ディスコ Laser processing equipment
WO2019146110A1 (en) 2018-01-29 2019-08-01 三菱電機株式会社 Laser processing method

Also Published As

Publication number Publication date
TW202105863A (en) 2021-02-01
EP3938138A1 (en) 2022-01-19
JP2022536649A (en) 2022-08-18
KR20220016855A (en) 2022-02-10
JP7543320B2 (en) 2024-09-02
EP3938138A4 (en) 2023-02-01
US20220168847A1 (en) 2022-06-02
CN113710407A (en) 2021-11-26
WO2020251782A1 (en) 2020-12-17

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