SG11201907214VA - Curable resin film and sheet for forming a first protective film - Google Patents
Curable resin film and sheet for forming a first protective filmInfo
- Publication number
- SG11201907214VA SG11201907214VA SG11201907214VA SG11201907214VA SG11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA
- Authority
- SG
- Singapore
- Prior art keywords
- curable resin
- forming
- resin film
- sheet
- film
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 title abstract 5
- 230000001681 protective effect Effects 0.000 title abstract 3
- 238000002834 transmittance Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017022165 | 2017-02-09 | ||
PCT/JP2018/002484 WO2018147097A1 (ja) | 2017-02-09 | 2018-01-26 | 硬化性樹脂フィルム及び第1保護膜形成用シート |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907214VA true SG11201907214VA (en) | 2019-09-27 |
Family
ID=63108082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201907214VA SG11201907214VA (en) | 2017-02-09 | 2018-01-26 | Curable resin film and sheet for forming a first protective film |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6388752B1 (zh) |
KR (1) | KR102430167B1 (zh) |
CN (1) | CN110249414B (zh) |
MY (1) | MY192914A (zh) |
PH (1) | PH12019501814A1 (zh) |
SG (1) | SG11201907214VA (zh) |
TW (1) | TWI663642B (zh) |
WO (1) | WO2018147097A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112868095A (zh) * | 2019-02-26 | 2021-05-28 | 琳得科株式会社 | 热固性树脂膜及第一保护膜形成用片 |
TWI834820B (zh) * | 2019-02-26 | 2024-03-11 | 日商琳得科股份有限公司 | 熱硬化性樹脂膜以及第1保護膜形成用片 |
JP6803498B1 (ja) * | 2019-03-29 | 2020-12-23 | 三井化学東セロ株式会社 | 電子装置の製造方法 |
JP7326103B2 (ja) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | 保護膜形成用フィルム及び保護膜形成用複合シート |
JP7326101B2 (ja) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | 保護膜形成用フィルム及び保護膜形成用複合シート |
JP7256851B2 (ja) * | 2019-12-27 | 2023-04-12 | リンテック株式会社 | キット及び半導体チップの製造方法 |
WO2023136053A1 (ja) * | 2022-01-12 | 2023-07-20 | リンテック株式会社 | 第1保護膜形成用シート、半導体装置の製造方法、及びシートの使用 |
JP7260017B1 (ja) | 2022-01-31 | 2023-04-18 | 大日本印刷株式会社 | 半導体加工用粘着テープ |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5249290B2 (zh) | 1973-04-09 | 1977-12-16 | ||
JP3788652B2 (ja) * | 1997-01-13 | 2006-06-21 | 三菱化学株式会社 | 近赤外線吸収性樹脂成形品 |
JP4044543B2 (ja) * | 2000-05-12 | 2008-02-06 | 富士通株式会社 | 半導体チップの製造方法 |
JP2002226805A (ja) * | 2001-02-06 | 2002-08-14 | Dainippon Ink & Chem Inc | 両面粘着シート |
JP2002252245A (ja) * | 2001-02-22 | 2002-09-06 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JP2007035880A (ja) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | バンプ付きウエハの製造方法、バンプ付きウエハ、半導体装置 |
JP2009260229A (ja) * | 2008-03-21 | 2009-11-05 | Hitachi Chem Co Ltd | 半導体ウエハのダイシング方法及び半導体チップと基板との接続方法 |
JP2011231137A (ja) * | 2010-04-23 | 2011-11-17 | Hitachi Chem Co Ltd | 半導体封止充てん用エポキシ樹脂組成物及び半導体装置 |
JP2011253940A (ja) * | 2010-06-02 | 2011-12-15 | Sony Chemical & Information Device Corp | ウエハのダイシング方法、接続方法及び接続構造体 |
JP5830250B2 (ja) * | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | 半導体装置の製造方法 |
JP5996901B2 (ja) * | 2011-09-02 | 2016-09-21 | 株式会社日本触媒 | 光選択透過フィルター、樹脂シート及び固体撮像素子 |
JP6405556B2 (ja) * | 2013-07-31 | 2018-10-17 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シートおよび検査方法 |
JP6453773B2 (ja) * | 2014-01-22 | 2019-01-16 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法 |
WO2015111631A1 (ja) * | 2014-01-22 | 2015-07-30 | リンテック株式会社 | 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび加工物の製造方法 |
WO2016068042A1 (ja) * | 2014-10-29 | 2016-05-06 | リンテック株式会社 | 保護膜形成フィルムおよび保護膜形成用複合シート |
JP6558034B2 (ja) * | 2015-04-03 | 2019-08-14 | 大日本印刷株式会社 | Led素子用のフレキシブル多層回路基板及びそれを用いたledドットマトリックス表示装置 |
JP6415383B2 (ja) * | 2015-04-30 | 2018-10-31 | 日東電工株式会社 | 半導体素子の裏面を保護するための裏面保護フィルム、一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法 |
JP6517588B2 (ja) | 2015-05-27 | 2019-05-22 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
JP6506116B2 (ja) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用シート、及びワーク又は加工物の製造方法 |
JP6506117B2 (ja) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用シート、ワーク又は加工物の製造方法、検査方法、良品と判断されたワーク、及び良品と判断された加工物 |
JP6506118B2 (ja) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用シート、ワーク又は加工物の製造方法、検査方法、良品と判断されたワーク、及び良品と判断された加工物 |
-
2018
- 2018-01-26 TW TW107102923A patent/TWI663642B/zh active
- 2018-01-26 CN CN201880010303.8A patent/CN110249414B/zh active Active
- 2018-01-26 MY MYPI2019004447A patent/MY192914A/en unknown
- 2018-01-26 JP JP2018525618A patent/JP6388752B1/ja active Active
- 2018-01-26 WO PCT/JP2018/002484 patent/WO2018147097A1/ja active Application Filing
- 2018-01-26 SG SG11201907214VA patent/SG11201907214VA/en unknown
- 2018-01-26 KR KR1020197025912A patent/KR102430167B1/ko active IP Right Grant
-
2019
- 2019-08-06 PH PH12019501814A patent/PH12019501814A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102430167B1 (ko) | 2022-08-05 |
MY192914A (en) | 2022-09-15 |
JPWO2018147097A1 (ja) | 2019-02-14 |
TW201834044A (zh) | 2018-09-16 |
CN110249414A (zh) | 2019-09-17 |
TWI663642B (zh) | 2019-06-21 |
JP6388752B1 (ja) | 2018-09-12 |
PH12019501814A1 (en) | 2020-09-14 |
KR20190116352A (ko) | 2019-10-14 |
WO2018147097A1 (ja) | 2018-08-16 |
CN110249414B (zh) | 2023-04-04 |
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