SG11201801845WA - Assembly and semiconductor device - Google Patents
Assembly and semiconductor deviceInfo
- Publication number
- SG11201801845WA SG11201801845WA SG11201801845WA SG11201801845WA SG11201801845WA SG 11201801845W A SG11201801845W A SG 11201801845WA SG 11201801845W A SG11201801845W A SG 11201801845WA SG 11201801845W A SG11201801845W A SG 11201801845WA SG 11201801845W A SG11201801845W A SG 11201801845WA
- Authority
- SG
- Singapore
- Prior art keywords
- assembly
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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JP6677231B2 (ja) * | 2017-09-22 | 2020-04-08 | 日亜化学工業株式会社 | 電子部品の接合方法および接合体の製造方法 |
JP7057488B2 (ja) * | 2017-09-27 | 2022-04-20 | 日亜化学工業株式会社 | 半導体装置及び半導体装置の製造方法 |
JP7127269B2 (ja) * | 2017-10-23 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 部材接続方法 |
JP6881238B2 (ja) * | 2017-10-31 | 2021-06-02 | 三菱電機株式会社 | 半導体モジュール、その製造方法及び電力変換装置 |
JP7140143B2 (ja) * | 2018-01-30 | 2022-09-21 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法、及びフィルム状接着剤 |
CN111033703A (zh) * | 2018-04-12 | 2020-04-17 | 松下知识产权经营株式会社 | 安装结构体以及纳米粒子安装材料 |
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DE102008039828A1 (de) | 2008-08-27 | 2010-03-04 | W.C. Heraeus Gmbh | Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess |
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DE102011109226A1 (de) * | 2011-08-02 | 2013-02-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Verbindungsschicht mit einem Sintermaterial, Verwendung einer Mischung zur Herstellung einer Verbindungsschicht, Verbindungsschicht mit einem Sintermaterial und Bauelement mit einer Verbindungsschicht |
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US20130256894A1 (en) | 2012-03-29 | 2013-10-03 | International Rectifier Corporation | Porous Metallic Film as Die Attach and Interconnect |
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JP5980574B2 (ja) * | 2012-05-29 | 2016-08-31 | ハリマ化成株式会社 | 導電性金属厚膜形成用材料および導電性金属厚膜の形成方法 |
JP6199048B2 (ja) * | 2013-02-28 | 2017-09-20 | 国立大学法人大阪大学 | 接合材 |
JP6130209B2 (ja) * | 2013-05-14 | 2017-05-17 | Dowaエレクトロニクス株式会社 | 導電膜 |
JP6303392B2 (ja) * | 2013-10-22 | 2018-04-04 | 日立化成株式会社 | 銀ペースト及びそれを用いた半導体装置、並びに銀ペーストの製造方法 |
WO2015098658A1 (ja) * | 2013-12-24 | 2015-07-02 | Dic株式会社 | 金属ナノ粒子を含有する接合用材料 |
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2016
- 2016-09-07 SG SG10201913445WA patent/SG10201913445WA/en unknown
- 2016-09-07 EP EP20162716.3A patent/EP3689511A1/de active Pending
- 2016-09-07 EP EP16844401.6A patent/EP3348336B1/de active Active
- 2016-09-07 JP JP2017539198A patent/JP6819597B2/ja active Active
- 2016-09-07 KR KR1020187009671A patent/KR102545990B1/ko active IP Right Grant
- 2016-09-07 SG SG11201801845WA patent/SG11201801845WA/en unknown
- 2016-09-07 US US15/757,852 patent/US10566304B2/en active Active
- 2016-09-07 CN CN201680051537.8A patent/CN107921541B/zh active Active
- 2016-09-07 TW TW105129002A patent/TWI694558B/zh active
- 2016-09-07 WO PCT/JP2016/076330 patent/WO2017043540A1/ja active Application Filing
- 2016-09-07 CN CN202010311153.3A patent/CN111360270A/zh active Pending
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Also Published As
Publication number | Publication date |
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SG10201913445WA (en) | 2020-02-27 |
KR102545990B1 (ko) | 2023-06-20 |
JPWO2017043540A1 (ja) | 2018-08-09 |
EP3348336A4 (de) | 2019-06-19 |
JP2021063300A (ja) | 2021-04-22 |
JP7056724B2 (ja) | 2022-04-19 |
US10566304B2 (en) | 2020-02-18 |
CN107921541B (zh) | 2020-04-28 |
WO2017043540A1 (ja) | 2017-03-16 |
US20180342478A1 (en) | 2018-11-29 |
CN111360270A (zh) | 2020-07-03 |
JP6819597B2 (ja) | 2021-01-27 |
TW201714256A (zh) | 2017-04-16 |
KR20180050713A (ko) | 2018-05-15 |
MY184905A (en) | 2021-04-30 |
CN107921541A (zh) | 2018-04-17 |
EP3689511A1 (de) | 2020-08-05 |
EP3348336A1 (de) | 2018-07-18 |
TWI694558B (zh) | 2020-05-21 |
EP3348336B1 (de) | 2020-05-13 |
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