SG11201708564WA - Film for manufacturing semiconductor parts - Google Patents

Film for manufacturing semiconductor parts

Info

Publication number
SG11201708564WA
SG11201708564WA SG11201708564WA SG11201708564WA SG11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA
Authority
SG
Singapore
Prior art keywords
film
manufacturing semiconductor
semiconductor parts
parts
manufacturing
Prior art date
Application number
SG11201708564WA
Other languages
English (en)
Inventor
Eiji Hayashishita
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of SG11201708564WA publication Critical patent/SG11201708564WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/02—Presence of polyamine or polyimide polyamine
    • C09J2479/026—Presence of polyamine or polyimide polyamine in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201708564WA 2015-06-29 2016-06-14 Film for manufacturing semiconductor parts SG11201708564WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015130403 2015-06-29
PCT/JP2016/067705 WO2017002610A1 (ja) 2015-06-29 2016-06-14 半導体部品製造用フィルム

Publications (1)

Publication Number Publication Date
SG11201708564WA true SG11201708564WA (en) 2017-11-29

Family

ID=57608103

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708564WA SG11201708564WA (en) 2015-06-29 2016-06-14 Film for manufacturing semiconductor parts

Country Status (8)

Country Link
US (2) US10858547B2 (ja)
EP (1) EP3316280B1 (ja)
JP (1) JP6129446B1 (ja)
KR (1) KR102034972B1 (ja)
CN (1) CN107851602B (ja)
SG (1) SG11201708564WA (ja)
TW (1) TWI680517B (ja)
WO (1) WO2017002610A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102034972B1 (ko) 2015-06-29 2019-10-21 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 부품 제조용 필름
JP6196751B1 (ja) 2016-03-31 2017-09-13 三井化学東セロ株式会社 部品製造用フィルム及び部品の製造方法
WO2018139612A1 (ja) * 2017-01-30 2018-08-02 三井化学東セロ株式会社 部品製造用フィルム、部品製造用具及び部品製造方法
TW201901847A (zh) * 2017-05-11 2019-01-01 日商三井化學東賽璐股份有限公司 零件製造用具以及零件製造方法
WO2019167702A1 (ja) 2018-02-28 2019-09-06 三井化学東セロ株式会社 部品製造方法、保持フィルム及び保持具形成装置
JP7139048B2 (ja) * 2018-07-06 2022-09-20 株式会社ディスコ ウェーハの加工方法
US20200075386A1 (en) * 2018-08-30 2020-03-05 Texas Instruments Incorporated Subring for semiconductor dies
JP7166718B2 (ja) * 2018-10-17 2022-11-08 株式会社ディスコ ウェーハの加工方法
JP7171134B2 (ja) * 2018-10-17 2022-11-15 株式会社ディスコ ウェーハの加工方法
JP7258421B2 (ja) * 2019-02-15 2023-04-17 株式会社ディスコ ウェーハの加工方法
DE102019203438A1 (de) * 2019-03-13 2020-09-17 Tesa Se Oberflächenschutzfolie zum Schutz der Kanten von Rotorblättern an Windrädern
JP7330616B2 (ja) * 2019-05-10 2023-08-22 株式会社ディスコ ウェーハの加工方法
JP2021015840A (ja) * 2019-07-10 2021-02-12 株式会社ディスコ ウェーハの加工方法
JP7546363B2 (ja) * 2020-02-18 2024-09-06 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
KR102635493B1 (ko) * 2020-11-04 2024-02-07 세메스 주식회사 본딩 설비에서 다이를 이송하기 위한 장치 및 방법
US20240312848A1 (en) 2021-02-10 2024-09-19 Mitsui Chemicals Tohcello, Inc. Electronic component manufacturing method, manufacturing film, and manufacturing tool

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KR970001499B1 (ko) * 1988-11-17 1997-02-11 니또 덴꼬 가부시기가이샤 피부용 감압성 접착 시이트 재료
JP4054219B2 (ja) * 2002-05-22 2008-02-27 三井化学株式会社 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
WO2006038438A2 (ja) * 2004-09-14 2006-04-13 Oji Paper Co 可逆性感熱記録体及び、表示層を有する通信媒体及び記録体
US7326592B2 (en) 2005-04-04 2008-02-05 Infineon Technologies Ag Stacked die package
JP4549239B2 (ja) 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
JP5063262B2 (ja) * 2006-08-30 2012-10-31 Ｄｉｃ株式会社 再剥離用粘着シート
JP2011082480A (ja) * 2009-03-13 2011-04-21 Sekisui Chem Co Ltd ダイアタッチフィルム及びダイシングダイアタッチフィルム
JP5324319B2 (ja) 2009-05-26 2013-10-23 日東電工株式会社 ウエハマウント方法とウエハマウント装置
JP5718005B2 (ja) * 2010-09-14 2015-05-13 日東電工株式会社 半導体装置製造用耐熱性粘着テープ及びそのテープを用いた半導体装置の製造方法。
CN102986007B (zh) * 2010-09-30 2015-06-10 三井化学东赛璐株式会社 扩张性膜、切割膜以及半导体装置的制造方法
JP6148430B2 (ja) 2011-07-26 2017-06-14 日東電工株式会社 接着シート及びその用途
CN103748664B (zh) * 2011-08-09 2016-04-20 三井化学东赛璐株式会社 半导体装置的制造方法及该方法中所使用的半导体晶片表面保护用膜
KR20140142273A (ko) * 2012-03-08 2014-12-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 말끔하게 이형되는 연신 이형가능한 테이프
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
JP6024382B2 (ja) * 2012-10-23 2016-11-16 大日本印刷株式会社 粘着剤組成物、粘着シート及び画像表示装置
JP2015053408A (ja) 2013-09-09 2015-03-19 日東電工株式会社 半導体装置の製造方法
KR102034972B1 (ko) 2015-06-29 2019-10-21 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 부품 제조용 필름

Also Published As

Publication number Publication date
CN107851602A (zh) 2018-03-27
KR20180015229A (ko) 2018-02-12
EP3316280A4 (en) 2019-03-13
CN107851602B (zh) 2021-08-06
US20180142130A1 (en) 2018-05-24
EP3316280B1 (en) 2024-02-28
KR102034972B1 (ko) 2019-10-21
US20210047543A1 (en) 2021-02-18
TW201701375A (zh) 2017-01-01
JP6129446B1 (ja) 2017-05-17
TWI680517B (zh) 2019-12-21
WO2017002610A1 (ja) 2017-01-05
JPWO2017002610A1 (ja) 2017-07-06
EP3316280A1 (en) 2018-05-02
US11535776B2 (en) 2022-12-27
US10858547B2 (en) 2020-12-08

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