SG11201505018QA - Carrier for use in double-side polishing apparatus and method of double-side polishing wafer - Google Patents

Carrier for use in double-side polishing apparatus and method of double-side polishing wafer

Info

Publication number
SG11201505018QA
SG11201505018QA SG11201505018QA SG11201505018QA SG11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA
Authority
SG
Singapore
Prior art keywords
double
side polishing
carrier
wafer
polishing apparatus
Prior art date
Application number
SG11201505018QA
Other languages
English (en)
Inventor
Masanao Sasaki
Isao Uchiyama
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201505018QA publication Critical patent/SG11201505018QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201505018QA 2013-01-29 2013-12-19 Carrier for use in double-side polishing apparatus and method of double-side polishing wafer SG11201505018QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013014172A JP5807648B2 (ja) 2013-01-29 2013-01-29 両面研磨装置用キャリア及びウェーハの両面研磨方法
PCT/JP2013/007464 WO2014118860A1 (ja) 2013-01-29 2013-12-19 両面研磨装置用キャリア及びウェーハの両面研磨方法

Publications (1)

Publication Number Publication Date
SG11201505018QA true SG11201505018QA (en) 2015-07-30

Family

ID=51261610

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201505018QA SG11201505018QA (en) 2013-01-29 2013-12-19 Carrier for use in double-side polishing apparatus and method of double-side polishing wafer

Country Status (8)

Country Link
US (1) US20150321311A1 (ja)
JP (1) JP5807648B2 (ja)
KR (1) KR102050750B1 (ja)
CN (1) CN104903053B (ja)
DE (1) DE112013006351T5 (ja)
SG (1) SG11201505018QA (ja)
TW (1) TWI600495B (ja)
WO (1) WO2014118860A1 (ja)

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KR101660900B1 (ko) * 2015-01-16 2016-10-10 주식회사 엘지실트론 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법
JP6447332B2 (ja) * 2015-04-13 2019-01-09 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6281537B2 (ja) * 2015-08-07 2018-02-21 信越半導体株式会社 半導体ウェーハの製造方法
KR102577033B1 (ko) * 2016-02-16 2023-09-12 신에쯔 한도타이 가부시키가이샤 양면연마방법 및 양면연마장치
JP6443370B2 (ja) * 2016-03-18 2018-12-26 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP7159898B2 (ja) * 2019-02-14 2022-10-25 株式会社Sumco ウェーハ回収装置、研磨システム、および、ウェーハ回収方法
CN112435954B (zh) * 2020-11-25 2024-01-26 西安奕斯伟材料科技股份有限公司 一种晶圆载体的处理方法和晶圆载体
CN114310654A (zh) * 2021-12-28 2022-04-12 海南钇坤智能科技有限公司 荧光陶瓷片厚度调整工艺

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US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
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Also Published As

Publication number Publication date
DE112013006351T5 (de) 2015-09-17
JP2014144503A (ja) 2014-08-14
KR102050750B1 (ko) 2019-12-02
TWI600495B (zh) 2017-10-01
WO2014118860A1 (ja) 2014-08-07
CN104903053A (zh) 2015-09-09
JP5807648B2 (ja) 2015-11-10
TW201442822A (zh) 2014-11-16
US20150321311A1 (en) 2015-11-12
KR20150111930A (ko) 2015-10-06
CN104903053B (zh) 2018-09-25

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