SG11201505018QA - Carrier for use in double-side polishing apparatus and method of double-side polishing wafer - Google Patents

Carrier for use in double-side polishing apparatus and method of double-side polishing wafer

Info

Publication number
SG11201505018QA
SG11201505018QA SG11201505018QA SG11201505018QA SG11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA SG 11201505018Q A SG11201505018Q A SG 11201505018QA
Authority
SG
Singapore
Prior art keywords
double
side polishing
carrier
wafer
polishing apparatus
Prior art date
Application number
SG11201505018QA
Inventor
Masanao Sasaki
Isao Uchiyama
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201505018QA publication Critical patent/SG11201505018QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201505018QA 2013-01-29 2013-12-19 Carrier for use in double-side polishing apparatus and method of double-side polishing wafer SG11201505018QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013014172A JP5807648B2 (en) 2013-01-29 2013-01-29 Double-side polishing apparatus carrier and wafer double-side polishing method
PCT/JP2013/007464 WO2014118860A1 (en) 2013-01-29 2013-12-19 Carrier for double-side polishing apparatus and double-side polishing method for wafer

Publications (1)

Publication Number Publication Date
SG11201505018QA true SG11201505018QA (en) 2015-07-30

Family

ID=51261610

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201505018QA SG11201505018QA (en) 2013-01-29 2013-12-19 Carrier for use in double-side polishing apparatus and method of double-side polishing wafer

Country Status (8)

Country Link
US (1) US20150321311A1 (en)
JP (1) JP5807648B2 (en)
KR (1) KR102050750B1 (en)
CN (1) CN104903053B (en)
DE (1) DE112013006351T5 (en)
SG (1) SG11201505018QA (en)
TW (1) TWI600495B (en)
WO (1) WO2014118860A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101660900B1 (en) * 2015-01-16 2016-10-10 주식회사 엘지실트론 An apparatus of polishing a wafer and a method of polishing a wafer using the same
JP6447332B2 (en) * 2015-04-13 2019-01-09 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer
JP6281537B2 (en) * 2015-08-07 2018-02-21 信越半導体株式会社 Manufacturing method of semiconductor wafer
SG11201806747QA (en) * 2016-02-16 2018-09-27 Shin Etsu Handotai Co Ltd Double-side polishing method and double-side polishing apparatus
JP6443370B2 (en) * 2016-03-18 2018-12-26 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer
JP7159898B2 (en) * 2019-02-14 2022-10-25 株式会社Sumco Wafer recovery device, polishing system, and wafer recovery method
CN112435954B (en) * 2020-11-25 2024-01-26 西安奕斯伟材料科技股份有限公司 Wafer carrier processing method and wafer carrier
CN114310654A (en) * 2021-12-28 2022-04-12 海南钇坤智能科技有限公司 Thickness adjusting process for fluorescent ceramic wafer

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US2787541A (en) * 1952-01-29 1957-04-02 Rem Cru Titanium Inc Titanium-base alloys
US4600449A (en) * 1984-01-19 1986-07-15 Sundstrand Data Control, Inc. Titanium alloy (15V-3Cr-3Sn-3Al) for aircraft data recorder
US4729546A (en) * 1985-12-24 1988-03-08 Ford Motor Company Titanium engine valve and method of making
US4851055A (en) * 1988-05-06 1989-07-25 The United States Of America As Represented By The Secretary Of The Air Force Method of making titanium alloy articles having distinct microstructural regions corresponding to high creep and fatigue resistance
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JP2007528301A (en) * 2004-03-11 2007-10-11 メムリー コーポレーション Finishing treatment to improve the fatigue life of metal parts
JP4116983B2 (en) * 2004-03-31 2008-07-09 本田技研工業株式会社 Titanium valve spring retainer
US7837812B2 (en) * 2004-05-21 2010-11-23 Ati Properties, Inc. Metastable beta-titanium alloys and methods of processing the same by direct aging
JP4698178B2 (en) 2004-07-13 2011-06-08 スピードファム株式会社 Carrier for holding an object to be polished
JP4939740B2 (en) * 2004-10-15 2012-05-30 住友金属工業株式会社 β-type titanium alloy
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
JPWO2006090661A1 (en) * 2005-02-25 2008-07-24 信越半導体株式会社 Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same
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JP4605233B2 (en) * 2008-02-27 2011-01-05 信越半導体株式会社 Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same
JP4858507B2 (en) * 2008-07-31 2012-01-18 トーカロ株式会社 Carrier for holding an object to be polished
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Also Published As

Publication number Publication date
US20150321311A1 (en) 2015-11-12
JP2014144503A (en) 2014-08-14
TW201442822A (en) 2014-11-16
TWI600495B (en) 2017-10-01
DE112013006351T5 (en) 2015-09-17
CN104903053B (en) 2018-09-25
WO2014118860A1 (en) 2014-08-07
KR102050750B1 (en) 2019-12-02
KR20150111930A (en) 2015-10-06
CN104903053A (en) 2015-09-09
JP5807648B2 (en) 2015-11-10

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