SG11201501165XA - Em-shielding film and method for covering electronic component - Google Patents

Em-shielding film and method for covering electronic component

Info

Publication number
SG11201501165XA
SG11201501165XA SG11201501165XA SG11201501165XA SG11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA SG 11201501165X A SG11201501165X A SG 11201501165XA
Authority
SG
Singapore
Prior art keywords
electronic component
shielding film
covering electronic
covering
shielding
Prior art date
Application number
SG11201501165XA
Other languages
English (en)
Inventor
Taichi Yatsuzuka
Fumihiro Shiraishi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201501165XA publication Critical patent/SG11201501165XA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
SG11201501165XA 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component SG11201501165XA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012180537 2012-08-16
JP2013051099A JP6225437B2 (ja) 2012-08-16 2013-03-13 電磁波シールド用フィルム、および電子部品の被覆方法
JP2013051097A JP6225436B2 (ja) 2012-08-16 2013-03-13 電磁波シールド用フィルム、および電子部品の被覆方法
PCT/JP2013/071922 WO2014027672A1 (ja) 2012-08-16 2013-08-14 電磁波シールド用フィルム、および電子部品の被覆方法

Publications (1)

Publication Number Publication Date
SG11201501165XA true SG11201501165XA (en) 2015-05-28

Family

ID=50614085

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component
SG11201501165XA SG11201501165XA (en) 2012-08-16 2013-08-14 Em-shielding film and method for covering electronic component

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201501162UA SG11201501162UA (en) 2012-08-16 2013-08-14 Electromagnetic shielding film and method of covering electronic component

Country Status (6)

Country Link
JP (4) JP6225437B2 (ja)
KR (2) KR101799630B1 (ja)
CN (2) CN104584707A (ja)
SG (2) SG11201501162UA (ja)
TW (2) TW201419996A (ja)
WO (2) WO2014027673A1 (ja)

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JP6358405B2 (ja) * 2016-07-08 2018-07-18 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP2018060990A (ja) * 2016-07-08 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
CN106163247A (zh) * 2016-07-18 2016-11-23 福建星宏新材料科技有限公司 一种宽频域吸波材料
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JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP6865340B2 (ja) * 2017-03-31 2021-04-28 ナガセケムテックス株式会社 実装構造体の製造方法およびこれに用いられる積層シート
JP2019029549A (ja) * 2017-08-01 2019-02-21 住友ベークライト株式会社 フィルムセット
JP6516108B2 (ja) * 2017-08-10 2019-05-22 東洋インキＳｃホールディングス株式会社 真空成形用電磁波シールド積層体、およびこれを用いた電磁波シールド成形体
JP6451801B1 (ja) * 2017-08-10 2019-01-16 東洋インキＳｃホールディングス株式会社 電磁波シールド電子機器の製造方法、および前記電磁波シールド電子機器の製造方法に用いられる電磁波シールドフィルム
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Also Published As

Publication number Publication date
JP2014057040A (ja) 2014-03-27
TWI675617B (zh) 2019-10-21
JP2014057042A (ja) 2014-03-27
JP2014057041A (ja) 2014-03-27
WO2014027672A1 (ja) 2014-02-20
KR20150044853A (ko) 2015-04-27
JP6225436B2 (ja) 2017-11-08
KR101799631B1 (ko) 2017-11-20
KR20150042747A (ko) 2015-04-21
TW201419996A (zh) 2014-05-16
SG11201501162UA (en) 2015-04-29
CN104584708A (zh) 2015-04-29
JP6263847B2 (ja) 2018-01-24
CN104584707A (zh) 2015-04-29
JP6225437B2 (ja) 2017-11-08
TW201419997A (zh) 2014-05-16
JP6263846B2 (ja) 2018-01-24
JP2014057043A (ja) 2014-03-27
WO2014027673A1 (ja) 2014-02-20
KR101799630B1 (ko) 2017-11-20

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