SG11201500924PA - Polishing composition and method for producing substrate - Google Patents

Polishing composition and method for producing substrate

Info

Publication number
SG11201500924PA
SG11201500924PA SG11201500924PA SG11201500924PA SG11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA SG 11201500924P A SG11201500924P A SG 11201500924PA
Authority
SG
Singapore
Prior art keywords
polishing composition
producing substrate
producing
substrate
polishing
Prior art date
Application number
SG11201500924PA
Other languages
English (en)
Inventor
Kohsuke Tsuchiya
Shuhei Takahashi
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50183241&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201500924P(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201500924PA publication Critical patent/SG11201500924PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08B—POLYSACCHARIDES; DERIVATIVES THEREOF
    • C08B11/00—Preparation of cellulose ethers
    • C08B11/02—Alkyl or cycloalkyl ethers
    • C08B11/04—Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals
    • C08B11/08—Alkyl or cycloalkyl ethers with substituted hydrocarbon radicals with hydroxylated hydrocarbon radicals; Esters, ethers, or acetals thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/02—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F16/04—Acyclic compounds
    • C08F16/06—Polyvinyl alcohol ; Vinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F26/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F26/06—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C08F26/10—N-Vinyl-pyrrolidone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201500924PA 2012-08-31 2013-08-12 Polishing composition and method for producing substrate SG11201500924PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012191899 2012-08-31
PCT/JP2013/071813 WO2014034425A1 (ja) 2012-08-31 2013-08-12 研磨用組成物及び基板の製造方法

Publications (1)

Publication Number Publication Date
SG11201500924PA true SG11201500924PA (en) 2015-04-29

Family

ID=50183241

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500924PA SG11201500924PA (en) 2012-08-31 2013-08-12 Polishing composition and method for producing substrate

Country Status (8)

Country Link
US (1) US9505950B2 (zh)
JP (1) JP6184962B2 (zh)
KR (1) KR102155205B1 (zh)
CN (1) CN104603227B (zh)
DE (1) DE112013004295T5 (zh)
SG (1) SG11201500924PA (zh)
TW (1) TWI613283B (zh)
WO (1) WO2014034425A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306383B2 (ja) * 2014-03-17 2018-04-04 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
JP6389630B2 (ja) * 2014-03-31 2018-09-12 ニッタ・ハース株式会社 研磨用組成物
JP2015203081A (ja) * 2014-04-15 2015-11-16 株式会社フジミインコーポレーテッド 研磨用組成物
JP6185432B2 (ja) * 2014-06-24 2017-08-23 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
CN104327741B (zh) * 2014-09-28 2016-06-15 顾泉 用于研磨蓝宝石基板的研磨组合物及其应用
EP3258483A4 (en) * 2015-02-12 2018-02-28 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
US10748778B2 (en) 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
JP6489690B2 (ja) * 2015-06-25 2019-03-27 花王株式会社 シリコンウェーハ用研磨液組成物
JP6348927B2 (ja) * 2016-04-27 2018-06-27 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
JP6737124B2 (ja) * 2016-10-20 2020-08-05 Ａｇｃ株式会社 マスクブランク用基板の製造方法
CN109996853A (zh) 2016-11-22 2019-07-09 福吉米株式会社 研磨用组合物
CN110036086B (zh) * 2016-12-28 2022-04-26 霓达杜邦股份有限公司 研磨用组合物
CN107189695A (zh) * 2017-04-15 2017-09-22 浙江晶圣美纳米科技有限公司 一种可有效应用于不锈钢衬底化学机械抛光工艺的抛光液
JP7221479B2 (ja) 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
CN109096924B (zh) * 2018-09-17 2021-07-30 宁波日晟新材料有限公司 一种玻璃自由曲面表面抛光液及其制备方法和应用
CN109054656B (zh) * 2018-09-17 2021-07-06 宁波日晟新材料有限公司 一种金属自由曲面表面抛光液及其制备方法和应用
CN108822739A (zh) * 2018-09-17 2018-11-16 珠海琴晟新材料有限公司 一种抛光液及其制备方法
CN110551453A (zh) * 2018-12-25 2019-12-10 清华大学 一种抛光组合物
EP3950875A4 (en) * 2019-03-28 2022-11-02 Fujimi Incorporated POLISHING COMPOSITION
CN115662877B (zh) * 2022-09-08 2023-08-04 东海县太阳光新能源有限公司 一种单晶硅表面清洗方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050006299A (ko) 1998-12-25 2005-01-15 히다치 가세고교 가부시끼가이샤 Ｃｍｐ 연마제, ｃｍｐ 연마제용 첨가액 및 기판의 연마방법
JP4608925B2 (ja) * 1998-12-25 2011-01-12 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
JP4604727B2 (ja) 1998-12-25 2011-01-05 日立化成工業株式会社 Ｃｍｐ研磨剤用添加液
JP2001240850A (ja) 2000-02-29 2001-09-04 Sanyo Chem Ind Ltd 研磨用砥粒分散剤および研磨用スラリー
US6685757B2 (en) 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
JP2003303792A (ja) * 2002-04-10 2003-10-24 Nippon Shokubai Co Ltd 化学機械研磨用水系分散体と研磨方法
JP4076012B2 (ja) 2002-04-10 2008-04-16 株式会社日本触媒 化学機械研磨用水系分散体
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
US7435356B2 (en) 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
JP5121128B2 (ja) * 2005-06-20 2013-01-16 ニッタ・ハース株式会社 半導体研磨用組成物
US8157876B2 (en) * 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
US20090032006A1 (en) 2007-07-31 2009-02-05 Chul Woo Nam Wire saw process
CN103131330B (zh) 2008-02-01 2015-09-23 福吉米株式会社 研磨用组合物以及使用其的研磨方法
JP2011171689A (ja) * 2009-07-07 2011-09-01 Kao Corp シリコンウエハ用研磨液組成物
US20110073800A1 (en) 2009-09-25 2011-03-31 Hongyu Wang Abrasive-free chemical mechanical polishing compositions
JP2012079964A (ja) * 2010-10-04 2012-04-19 Nissan Chem Ind Ltd 半導体ウェーハ用研磨液組成物

Also Published As

Publication number Publication date
JP6184962B2 (ja) 2017-08-23
TWI613283B (zh) 2018-02-01
KR20150050572A (ko) 2015-05-08
US9505950B2 (en) 2016-11-29
CN104603227B (zh) 2017-03-08
TW201420738A (zh) 2014-06-01
CN104603227A (zh) 2015-05-06
KR102155205B1 (ko) 2020-09-11
WO2014034425A1 (ja) 2014-03-06
JPWO2014034425A1 (ja) 2016-08-08
DE112013004295T5 (de) 2015-05-13
US20150210892A1 (en) 2015-07-30

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