SG107599A1 - Adhesive sheet for dicing - Google Patents
Adhesive sheet for dicingInfo
- Publication number
- SG107599A1 SG107599A1 SG200203892A SG200203892A SG107599A1 SG 107599 A1 SG107599 A1 SG 107599A1 SG 200203892 A SG200203892 A SG 200203892A SG 200203892 A SG200203892 A SG 200203892A SG 107599 A1 SG107599 A1 SG 107599A1
- Authority
- SG
- Singapore
- Prior art keywords
- base film
- dicing
- during dicing
- adhesive sheet
- fibrous
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001194021A JP3443110B2 (ja) | 2001-06-27 | 2001-06-27 | ダイシング用粘着シート |
JP2002051682A JP3984075B2 (ja) | 2002-02-27 | 2002-02-27 | ダイシング用粘着シート |
JP2002051693A JP3984076B2 (ja) | 2002-02-27 | 2002-02-27 | ダイシング用粘着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
SG107599A1 true SG107599A1 (en) | 2004-12-29 |
Family
ID=27347026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200203892A SG107599A1 (en) | 2001-06-27 | 2002-06-26 | Adhesive sheet for dicing |
Country Status (8)
Country | Link |
---|---|
US (1) | US7141300B2 (zh) |
EP (1) | EP1270696B1 (zh) |
KR (1) | KR100871037B1 (zh) |
CN (2) | CN1304509C (zh) |
AT (1) | ATE321825T1 (zh) |
DE (1) | DE60210166T2 (zh) |
SG (1) | SG107599A1 (zh) |
TW (1) | TWI232235B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3838637B2 (ja) * | 2002-06-10 | 2006-10-25 | 日東電工株式会社 | ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法 |
CA2499951C (en) | 2002-10-15 | 2013-05-28 | Peijun Jiang | Multiple catalyst system for olefin polymerization and polymers produced therefrom |
US7700707B2 (en) | 2002-10-15 | 2010-04-20 | Exxonmobil Chemical Patents Inc. | Polyolefin adhesive compositions and articles made therefrom |
JP4554908B2 (ja) * | 2003-10-24 | 2010-09-29 | 日東電工株式会社 | ダイシング用粘着シート、ダイシング方法および半導体素子の製造方法 |
JP4565609B2 (ja) * | 2003-10-31 | 2010-10-20 | ニットウ ヨーロッパ エヌ. ブイ. | 粘着テープ |
JP4412463B2 (ja) * | 2003-12-11 | 2010-02-10 | 藤森工業株式会社 | 複室容器 |
JP4699076B2 (ja) * | 2005-04-20 | 2011-06-08 | 日東電工株式会社 | 防水気密用粘着テープ |
JP4699075B2 (ja) * | 2005-04-20 | 2011-06-08 | 日東電工株式会社 | 防水気密用両面粘着テープ |
JP4925173B2 (ja) * | 2006-06-02 | 2012-04-25 | 日東電工株式会社 | ダイシング用粘着シート、及びそれを用いた被切断体の加工方法 |
JP5027460B2 (ja) | 2006-07-28 | 2012-09-19 | 東京応化工業株式会社 | ウエハの接着方法、薄板化方法、及び剥離方法 |
US8207270B2 (en) | 2006-09-29 | 2012-06-26 | Exxonmobil Chemical Patents Inc. | Thermoplastic elastomer compositions, methods of making and articles made from the same |
JP4767144B2 (ja) * | 2006-10-04 | 2011-09-07 | 日東電工株式会社 | レーザ加工用粘着シート |
JP5863157B2 (ja) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | 粘着シート |
KR101019063B1 (ko) * | 2007-05-25 | 2011-03-07 | 주식회사 엘지화학 | 아크릴 점착제 조성물 및 이를 이용한 다이싱 테이프 |
JP5246583B2 (ja) * | 2008-02-29 | 2013-07-24 | 旭硝子株式会社 | ガラス基板吸着テーブル、及びガラス基板加工方法 |
US9315692B2 (en) * | 2010-03-31 | 2016-04-19 | Lintec Corporation | Base material film for dicing sheet and dicing sheet |
KR101393878B1 (ko) | 2010-09-30 | 2014-05-12 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 확장성 필름, 다이싱 필름, 및 반도체 장치의 제조 방법 |
KR20140020882A (ko) * | 2011-03-24 | 2014-02-19 | 스미또모 베이크라이트 가부시키가이샤 | 반도체 웨이퍼 등 가공용 점착 테이프 |
CN103121794B (zh) * | 2013-02-27 | 2017-06-13 | 京东方科技集团股份有限公司 | 单层阵列玻璃基板的切割方法及切割系统 |
US9442263B1 (en) * | 2014-08-08 | 2016-09-13 | Superior Essex International LP | Cable components formed with a thermoplastic elastomer as a nucleating agent |
JP2017108090A (ja) * | 2015-12-08 | 2017-06-15 | リンテック株式会社 | ダイシングシートおよびダイシングシートの製造方法 |
CN110872474A (zh) * | 2018-08-31 | 2020-03-10 | 翊圣企业股份有限公司 | 切割片胶膜用基膜及其制作方法 |
US20210277293A1 (en) * | 2020-03-06 | 2021-09-09 | Tredegar Surface Protection, Llc | Carrier film for semi-conductor wafer processing |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2545170B2 (ja) | 1991-12-05 | 1996-10-16 | リンテック株式会社 | ウェハ貼着用粘着シ―トおよびウェハダイシング方法 |
JPH05211234A (ja) | 1991-12-05 | 1993-08-20 | Lintec Corp | ウェハ貼着用粘着シートおよびウェハダイシング方法 |
JPH05335411A (ja) | 1992-06-02 | 1993-12-17 | Toshiba Corp | ペレットの製造方法 |
US5458845A (en) * | 1992-12-02 | 1995-10-17 | Chisso Corporation | Process for producing molding product |
JPH07156355A (ja) | 1993-12-06 | 1995-06-20 | Sekisui Chem Co Ltd | 表面保護シート |
JP3521099B2 (ja) * | 1994-11-29 | 2004-04-19 | リンテック株式会社 | ダイシング用リングフレームへの接着剤の付着防止用粘着シートおよび該粘着シートを備えたウェハ加工用シート |
KR100277378B1 (ko) * | 1995-11-24 | 2001-01-15 | 고또오 슈운기찌 | 프로필렌조성물및그제조방법과폴리프로필렌조성물및성형품 |
JPH1077375A (ja) | 1996-09-03 | 1998-03-24 | Heisei Polymer Co Ltd | 軟質樹脂組成物およびそれを用いた軟質フィルム、積層体 |
JPH1099426A (ja) * | 1996-09-27 | 1998-04-21 | Minoru Terano | 生体適合性材料、その製造方法、及び医療用器具 |
BR9813247A (pt) | 1998-01-09 | 2000-10-03 | Minnesota Mining & Mfg | Substrato de pelìcula adequado para uso com um adesivo como uma fita protetora isolante , e, fita adesiva adequada para uso como uma fita protetora isolante |
DE69914418T2 (de) * | 1998-08-10 | 2004-12-02 | Lintec Corp. | Dicing tape und Verfahren zum Zerteilen einer Halbleiterscheibe |
JP4510954B2 (ja) * | 1998-08-10 | 2010-07-28 | リンテック株式会社 | ダイシングテープ及びダイシング方法 |
JP4050397B2 (ja) * | 1998-08-26 | 2008-02-20 | 藤森工業株式会社 | 加工布 |
JP2000173951A (ja) | 1998-12-02 | 2000-06-23 | Okura Ind Co Ltd | ダイシング用基材フィルム |
DE19923780A1 (de) | 1999-05-22 | 2000-11-23 | Beiersdorf Ag | Unverstreckte Oberflächenschutzfolie aus Polypropylenblockcopolymer |
JP2001064602A (ja) * | 1999-08-26 | 2001-03-13 | Sekisui Chem Co Ltd | 粘着テープ用基材フィルム及び粘着テープ |
JP3340979B2 (ja) * | 1999-09-06 | 2002-11-05 | 日東電工株式会社 | ダイシング用粘着シート |
JP2001288421A (ja) * | 2000-04-06 | 2001-10-16 | Sekisui Chem Co Ltd | 粘着テープ用基材フィルム及び粘着テープ |
JP4780828B2 (ja) | 2000-11-22 | 2011-09-28 | 三井化学株式会社 | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
-
2002
- 2002-06-14 US US10/172,893 patent/US7141300B2/en not_active Expired - Lifetime
- 2002-06-18 EP EP20020013544 patent/EP1270696B1/en not_active Expired - Lifetime
- 2002-06-18 AT AT02013544T patent/ATE321825T1/de not_active IP Right Cessation
- 2002-06-18 DE DE2002610166 patent/DE60210166T2/de not_active Expired - Lifetime
- 2002-06-20 TW TW91113528A patent/TWI232235B/zh not_active IP Right Cessation
- 2002-06-26 SG SG200203892A patent/SG107599A1/en unknown
- 2002-06-27 KR KR1020020036221A patent/KR100871037B1/ko active IP Right Grant
- 2002-06-27 CN CNB200510074090XA patent/CN1304509C/zh not_active Expired - Lifetime
- 2002-06-27 CN CNB021244154A patent/CN1225771C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1304509C (zh) | 2007-03-14 |
CN1395293A (zh) | 2003-02-05 |
KR100871037B1 (ko) | 2008-11-27 |
TWI232235B (en) | 2005-05-11 |
US7141300B2 (en) | 2006-11-28 |
CN1683463A (zh) | 2005-10-19 |
DE60210166D1 (de) | 2006-05-18 |
US20030031862A1 (en) | 2003-02-13 |
EP1270696B1 (en) | 2006-03-29 |
DE60210166T2 (de) | 2007-03-15 |
ATE321825T1 (de) | 2006-04-15 |
CN1225771C (zh) | 2005-11-02 |
EP1270696A2 (en) | 2003-01-02 |
EP1270696A3 (en) | 2003-06-25 |
KR20030004077A (ko) | 2003-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG107599A1 (en) | Adhesive sheet for dicing | |
AU6442996A (en) | In-mold label and container decorated therewith | |
CN1156808C (zh) | 软接触标签 | |
EP0872517A4 (en) | THERMOPLASTIC ELASTOMER COMPOSITION | |
ZA918223B (en) | Propylene polymers films and laminates | |
AU1286692A (en) | Process for the preparation of an ethylene copolymer and an olefin polymer, and catalysts for olefin polymerization | |
AU625309B2 (en) | Flexible medical solution tubing | |
EP1637559A4 (en) | OLEFIN POLYMER COMPOSITIONS AND EASILY SEPARATED SEALING MATERIALS MADE THEREFOR | |
EP1433830A4 (en) | RUBBER COMPOSITION FOR SEALING SEALING AGAINST TIRES, AIR TIRES WITH STICKY SEALING LAYER AND METHOD FOR THE PRODUCTION THEREOF | |
PL374119A1 (en) | Autoclavable, non-adherent, heat sealable polymer films for fabricating monolayer and multiple layered films and containers | |
EP1724126A3 (en) | Pneumatic tire, process for producing the same | |
KR20000070578A (ko) | 레올로지가 개질된 열가소성 탄성중합체 조성물 및 그로부터제조된 물품 | |
AU1038792A (en) | Shock-absorbing propylene polymer composite moldings | |
TW246653B (zh) | ||
WO2003082971A3 (en) | Thermoplastic vulcanizate composition and method of making same | |
CA2045723A1 (en) | Injection-molded article | |
DE69110115T2 (de) | Schlagzähe Polymerzusammensetzung. | |
KR880009055A (ko) | 고무조성물 | |
WO2002096986A3 (en) | Polypropylene resin composition | |
MY127020A (en) | Pressure-sensitive adhesive sheets for dicing | |
WO1999020681A1 (fr) | Elastomere thermoplastique | |
CA2152239A1 (en) | Polyethylene Molding Compositions | |
DE60011609D1 (de) | Ethylenpolymerisation | |
EP0791625A3 (en) | Polyolefin resin composition and oriented film therefrom | |
NZ338086A (en) | Biaxially stretched, heat shrinkable polymeric film comprising three copolymers, blends and process for foods |