SG10201607132XA - Plating Apparatus, Plating Method, And Substrate Holder - Google Patents
Plating Apparatus, Plating Method, And Substrate HolderInfo
- Publication number
- SG10201607132XA SG10201607132XA SG10201607132XA SG10201607132XA SG10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA
- Authority
- SG
- Singapore
- Prior art keywords
- plating
- substrate holder
- plating method
- plating apparatus
- holder
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
- H01L2224/1146—Plating
- H01L2224/11462—Electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13147—Copper [Cu] as principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Robotics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015168969A JP6317299B2 (ja) | 2015-08-28 | 2015-08-28 | めっき装置、めっき方法、及び基板ホルダ |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201607132XA true SG10201607132XA (en) | 2017-03-30 |
Family
ID=58098210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201607132XA SG10201607132XA (en) | 2015-08-28 | 2016-08-26 | Plating Apparatus, Plating Method, And Substrate Holder |
Country Status (6)
Country | Link |
---|---|
US (2) | US10316426B2 (zh) |
JP (2) | JP6317299B2 (zh) |
KR (1) | KR102483669B1 (zh) |
CN (2) | CN111304715B (zh) |
SG (1) | SG10201607132XA (zh) |
TW (1) | TWI687555B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018161079A1 (en) | 2017-03-03 | 2018-09-07 | Harland Medical Systems, Inc. | Coating composition comprised of a hydrophilic crosslinker, a hydrophobic crosslinker and optionally a hydrogel and methods of making and using the same |
JP6859150B2 (ja) * | 2017-03-22 | 2021-04-14 | 株式会社荏原製作所 | めっき装置及びめっき槽構成の決定方法 |
WO2019003891A1 (ja) | 2017-06-28 | 2019-01-03 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP6891060B2 (ja) | 2017-07-11 | 2021-06-18 | 株式会社荏原製作所 | レギュレーションプレート、アノードホルダ、及び基板ホルダ |
US10875048B2 (en) * | 2017-09-05 | 2020-12-29 | Harland Medical Systems, Inc | Coating apparatus with an automatic fluid level system, and methods of using the same |
WO2019078064A1 (ja) * | 2017-10-20 | 2019-04-25 | アルメックスPe株式会社 | 表面処理装置 |
JP6975650B2 (ja) * | 2018-01-18 | 2021-12-01 | 株式会社荏原製作所 | 検査用基板を用いる電流測定モジュールおよび検査用基板 |
JP6942072B2 (ja) * | 2018-02-22 | 2021-09-29 | 株式会社荏原製作所 | めっき装置 |
JP6966958B2 (ja) * | 2018-03-01 | 2021-11-17 | 株式会社荏原製作所 | めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置 |
JP6993288B2 (ja) * | 2018-05-07 | 2022-01-13 | 株式会社荏原製作所 | めっき装置 |
JP7182911B2 (ja) * | 2018-06-21 | 2022-12-05 | 株式会社荏原製作所 | めっき装置、及びめっき方法 |
KR102111304B1 (ko) * | 2018-08-09 | 2020-05-18 | (주)선우하이테크 | 정전류 제어기능을 갖는 전기 도금 시스템 및 방법 |
CN108754590A (zh) * | 2018-08-22 | 2018-11-06 | 深圳市创智成功科技有限公司 | 导电环、基于其的供电装置及基于供电装置的电镀治具 |
TWI728668B (zh) * | 2019-01-31 | 2021-05-21 | 日商Almex Pe股份有限公司 | 工件保持治具及表面處理裝置 |
JP7079224B2 (ja) * | 2019-06-14 | 2022-06-01 | 株式会社荏原製作所 | めっき方法、めっき装置、プログラムを記憶する不揮発性の記憶媒体 |
JP7256708B2 (ja) | 2019-07-09 | 2023-04-12 | 株式会社荏原製作所 | めっき装置 |
JP7227875B2 (ja) * | 2019-08-22 | 2023-02-22 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
TWI722555B (zh) * | 2019-09-04 | 2021-03-21 | 日月光半導體製造股份有限公司 | 電鍍治具 |
JP7296832B2 (ja) * | 2019-09-10 | 2023-06-23 | 株式会社荏原製作所 | めっき装置 |
WO2022144988A1 (ja) * | 2020-12-28 | 2022-07-07 | 株式会社荏原製作所 | 基板の接液方法、およびめっき装置 |
CN115119515B (zh) * | 2021-01-20 | 2023-03-24 | 株式会社荏原制作所 | 镀覆装置以及基板的膜厚测定方法 |
CN114959842B (zh) * | 2021-02-18 | 2024-06-07 | 日月光半导体制造股份有限公司 | 电镀装置及制造封装结构的方法 |
US20230383431A1 (en) * | 2021-03-03 | 2023-11-30 | Ebara Corporation | Substrate holder, apparatus for plating, and method of manufacturing apparatus for plating |
JP7027622B1 (ja) * | 2021-06-17 | 2022-03-01 | 株式会社荏原製作所 | 抵抗体、及び、めっき装置 |
WO2022264402A1 (ja) * | 2021-06-18 | 2022-12-22 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
KR102493634B1 (ko) * | 2021-10-18 | 2023-02-06 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 방법 및 도금 장치 |
WO2024003975A1 (ja) * | 2022-06-27 | 2024-01-04 | 株式会社荏原製作所 | めっき装置、および、めっき方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101189A (ja) * | 1988-10-05 | 1990-04-12 | L Daburu Ii:Kk | 精密電気めっき方法及びその装置 |
JPH0329876A (ja) | 1989-06-28 | 1991-02-07 | Nec Corp | 電波監視装置 |
JPH05239698A (ja) * | 1992-02-28 | 1993-09-17 | Nec Corp | 電気めっき方法 |
JPH09125294A (ja) | 1995-11-02 | 1997-05-13 | Mitsubishi Electric Corp | 表面処理装置 |
US6517689B1 (en) * | 1998-07-10 | 2003-02-11 | Ebara Corporation | Plating device |
JP4179707B2 (ja) * | 1999-06-15 | 2008-11-12 | 荏原ユージライト株式会社 | プリント基板保持用治具及びめっき装置 |
JP2001234397A (ja) * | 2000-02-24 | 2001-08-31 | Matsushita Electric Works Ltd | 電気メッキ用冶具 |
JP4136830B2 (ja) | 2003-07-10 | 2008-08-20 | 株式会社荏原製作所 | めっき装置 |
JP5184308B2 (ja) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
JP2010209440A (ja) * | 2009-03-12 | 2010-09-24 | Sumitomo Bakelite Co Ltd | メッキ用治具 |
JP2011127172A (ja) * | 2009-12-17 | 2011-06-30 | Nitto Denko Corp | めっき装置および配線回路基板の製造方法 |
US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
DE102012012990B4 (de) * | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Oberflächenbehandlungssystem und Werkstückhaltestütze |
JP5898540B2 (ja) * | 2012-03-22 | 2016-04-06 | アルメックスPe株式会社 | ワーク保持治具及び表面処理装置 |
US9228270B2 (en) * | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
CN102560586A (zh) * | 2012-02-08 | 2012-07-11 | 南通富士通微电子股份有限公司 | 电镀方法 |
JP6247557B2 (ja) * | 2014-02-14 | 2017-12-13 | 株式会社Jcu | 基板めっき治具 |
-
2015
- 2015-08-28 JP JP2015168969A patent/JP6317299B2/ja active Active
-
2016
- 2016-06-24 TW TW105119892A patent/TWI687555B/zh active
- 2016-07-05 KR KR1020160084669A patent/KR102483669B1/ko active IP Right Grant
- 2016-08-23 CN CN202010257887.8A patent/CN111304715B/zh active Active
- 2016-08-23 CN CN201610710826.6A patent/CN106480480B/zh active Active
- 2016-08-26 US US15/248,248 patent/US10316426B2/en active Active
- 2016-08-26 SG SG10201607132XA patent/SG10201607132XA/en unknown
-
2018
- 2018-03-26 JP JP2018057786A patent/JP6488041B2/ja active Active
-
2019
- 2019-04-26 US US16/396,384 patent/US10513795B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20170026112A (ko) | 2017-03-08 |
KR102483669B1 (ko) | 2023-01-02 |
US20170058423A1 (en) | 2017-03-02 |
US10316426B2 (en) | 2019-06-11 |
CN111304715A (zh) | 2020-06-19 |
US10513795B2 (en) | 2019-12-24 |
JP2018090911A (ja) | 2018-06-14 |
JP6317299B2 (ja) | 2018-04-25 |
CN106480480B (zh) | 2020-05-05 |
TWI687555B (zh) | 2020-03-11 |
CN111304715B (zh) | 2021-01-26 |
TW201708623A (zh) | 2017-03-01 |
US20190249326A1 (en) | 2019-08-15 |
JP6488041B2 (ja) | 2019-03-20 |
CN106480480A (zh) | 2017-03-08 |
JP2017043815A (ja) | 2017-03-02 |
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