SG11201704981YA - Method and device for coating substrates - Google Patents

Method and device for coating substrates

Info

Publication number
SG11201704981YA
SG11201704981YA SG11201704981YA SG11201704981YA SG11201704981YA SG 11201704981Y A SG11201704981Y A SG 11201704981YA SG 11201704981Y A SG11201704981Y A SG 11201704981YA SG 11201704981Y A SG11201704981Y A SG 11201704981YA SG 11201704981Y A SG11201704981Y A SG 11201704981YA
Authority
SG
Singapore
Prior art keywords
coating substrates
substrates
coating
Prior art date
Application number
SG11201704981YA
Inventor
Andreas Fehkührer
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201704981YA publication Critical patent/SG11201704981YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Laminated Bodies (AREA)
SG11201704981YA 2015-01-15 2015-10-22 Method and device for coating substrates SG11201704981YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015100579.4A DE102015100579A1 (en) 2015-01-15 2015-01-15 Method and device for coating substrates
PCT/EP2015/074517 WO2016113008A1 (en) 2015-01-15 2015-10-22 Method and device for coating substrates

Publications (1)

Publication Number Publication Date
SG11201704981YA true SG11201704981YA (en) 2017-07-28

Family

ID=54541019

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201704981YA SG11201704981YA (en) 2015-01-15 2015-10-22 Method and device for coating substrates

Country Status (8)

Country Link
US (1) US20180174832A1 (en)
EP (1) EP3245669A1 (en)
JP (1) JP2018505043A (en)
KR (1) KR20170101939A (en)
CN (1) CN107210246A (en)
DE (1) DE102015100579A1 (en)
SG (1) SG11201704981YA (en)
WO (1) WO2016113008A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7191458B2 (en) * 2018-08-06 2022-12-19 株式会社ディスコ Wafer processing method
JP2023517414A (en) 2019-12-19 2023-04-26 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Encapsulated individualized components and methods of manufacturing encapsulated individualized components

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177224A (en) * 1985-02-01 1986-08-08 Showa Denko Kk Manufacture of thermoplastic resin film with release sheet
JPH0734890B2 (en) * 1991-10-29 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション Spin coating method
JPH05136042A (en) * 1991-11-08 1993-06-01 Seiko Epson Corp Manufacture of semiconductor device
JPH05258359A (en) * 1992-03-13 1993-10-08 Nippon Columbia Co Ltd Coating device for optical information recording medium
US5378511A (en) * 1993-03-22 1995-01-03 International Business Machines Corporation Material-saving resist spinner and process
JP2002177874A (en) * 1994-11-29 2002-06-25 Tokyo Ohka Kogyo Co Ltd Coating method
JPH08293460A (en) * 1995-04-21 1996-11-05 Ricoh Co Ltd Chemicals coater
JP3521716B2 (en) * 1997-11-25 2004-04-19 凸版印刷株式会社 Coating liquid supply device for spin coating device
US6013315A (en) * 1998-01-22 2000-01-11 Applied Materials, Inc. Dispense nozzle design and dispense method
JP3453073B2 (en) * 1998-10-14 2003-10-06 東京エレクトロン株式会社 Coating equipment
DE19933100A1 (en) * 1999-07-15 2001-01-18 Hymmen Theodor Gmbh Method for powder-coating wood panels etc has heating and pressure means to press coating at predetermined pressure onto workpiece
JP4077292B2 (en) * 2002-10-02 2008-04-16 株式会社日本製鋼所 Method and apparatus for applying thermoplastic molten resin
JP2004259985A (en) * 2003-02-26 2004-09-16 Sony Corp Resist pattern forming device, method for forming resist pattern and method for manufacturing semiconductor device using the forming method
JP2005322791A (en) * 2004-05-10 2005-11-17 Toshiba Corp Manufacturing method of semiconductor device, and coating applicator
JP2006015288A (en) * 2004-07-05 2006-01-19 Matsushita Electric Ind Co Ltd Applicator and coating liquid applying method
JP4832201B2 (en) * 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 Substrate processing equipment
JP4929901B2 (en) * 2006-07-26 2012-05-09 凸版印刷株式会社 Hologram sheet manufacturing method and hologram sheet
JP4805758B2 (en) * 2006-09-01 2011-11-02 東京エレクトロン株式会社 Coating processing method, program, computer-readable recording medium, and coating processing apparatus
JP4975790B2 (en) * 2009-08-20 2012-07-11 東京エレクトロン株式会社 Resist solution supply apparatus, resist solution supply method, program, and computer storage medium
JP5306300B2 (en) * 2010-09-15 2013-10-02 株式会社東芝 Film forming apparatus and film forming method
TWI607809B (en) * 2011-10-12 2017-12-11 1366科技公司 Apparatus and process for depositing a thin layer of resist on a substrate
JP5868702B2 (en) * 2011-12-28 2016-02-24 リンテック株式会社 Laminating equipment
JP2014124626A (en) * 2012-12-27 2014-07-07 3M Innovative Properties Co Coating film formation method, coating film formation device and method for manufacturing semiconductor chip
JP5900370B2 (en) * 2013-02-06 2016-04-06 東京エレクトロン株式会社 Coating film forming method, coating film forming apparatus, and storage medium
JP6165647B2 (en) * 2014-01-31 2017-07-19 東京エレクトロン株式会社 Coating device and bonding system

Also Published As

Publication number Publication date
EP3245669A1 (en) 2017-11-22
CN107210246A (en) 2017-09-26
US20180174832A1 (en) 2018-06-21
WO2016113008A1 (en) 2016-07-21
JP2018505043A (en) 2018-02-22
DE102015100579A1 (en) 2016-07-21
KR20170101939A (en) 2017-09-06

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