JP6165647B2 - Coating device and bonding system - Google Patents

Description

  The disclosed embodiments relate to a coating apparatus and a bonding system.

  Conventionally, a spin coating method is known as a method of applying a coating material to a substrate such as a semiconductor wafer or a glass substrate. The spin coating method is a method in which a coating material is discharged onto the surface of a rotating substrate and the coating material is spread on the substrate by centrifugal force.

  For example, Patent Document 1 discloses a coating apparatus that applies a resist material to the surface of a substrate using the spin coating method described above.

JP-A-5-109612

  However, the above-described conventional technology has room for further improvement in terms of preventing adhesion of the coating material to the back surface of the substrate.

  For example, the coating apparatus described in Patent Document 1 includes a rectifying ring provided in the cup so as to be close to the peripheral edge of the back surface of the substrate. Then, the coating device described in Patent Document 1 forcibly exhausts the inside of the cup and generates an air flow from the inside of the rectifying ring to the outside of the rectifying ring via a gap between the rectifying ring and the back surface peripheral edge of the substrate. This prevents resist mist from entering the inside of the rectifying ring and prevents adhesion of the resist mist to the back surface of the substrate.

  However, when the coating material has a high viscosity such as an adhesive, the coating material is not misted but may be threaded with rotation. When an attempt is made to prevent the thread-like coating material from adhering to the back surface of the substrate, it is not sufficient to simply generate an airflow as in the coating apparatus described in Patent Document 1.

  An object of one embodiment is to provide a coating apparatus and a bonding system capable of preventing adhesion of a coating material to the back surface of a substrate.

An application apparatus according to an aspect of the embodiment includes a holding unit, an application nozzle, a rotation mechanism, an outer cup, an inner cup, a peripheral edge discharge mechanism, and a back rinse nozzle . The holding unit holds the substrate horizontally. The coating nozzle discharges the coating material onto the surface of the substrate held by the holding unit. The rotation mechanism rotates the holding unit. The outer cup has an outer peripheral wall portion surrounding the outer side of the holding portion. The inner cup has an inner peripheral wall portion that is arranged with the upper end portion close to the peripheral edge portion of the back surface of the substrate. The peripheral discharge mechanism is disposed in the inner cup and discharges gas toward the rear peripheral portion of the substrate. The back rinse nozzle is disposed in a location farther from the peripheral edge of the back surface of the substrate than the peripheral discharge mechanism in the inner cup, and discharges liquid to the back surface of the substrate. The inner peripheral wall portion has an outer wall surface that increases in diameter from the upper end side toward the lower end side, and an inner wall surface that decreases in diameter from the upper end side toward the lower end side. The peripheral discharge mechanism is provided on the inner wall surface of the inner peripheral wall portion.

  According to one aspect of the embodiment, adhesion of the coating material to the back surface of the substrate can be prevented.

FIG. 1 is a schematic plan view showing the configuration of the joining system according to the first embodiment. FIG. 2 is a schematic side view of the substrate to be processed and the support substrate. FIG. 3 is a schematic side view showing the configuration of the coating apparatus. FIG. 4 is a schematic plan view illustrating an example of the configuration of the peripheral discharge mechanism. FIG. 5 is a schematic plan view showing another example of the configuration of the peripheral discharge mechanism. FIG. 6 is a chart diagram illustrating an example of a processing procedure of a coating process performed by the coating apparatus. FIG. 7 is an explanatory diagram of the discharge process. FIG. 8 is an explanatory diagram of the coating process. FIG. 9 is an explanatory diagram of the coating process. FIG. 10 is an explanatory diagram of the drying process. FIG. 11 is a chart showing a processing procedure of a coating process according to the second embodiment. FIG. 12 is a view showing a modification of the coating apparatus.

  Hereinafter, embodiments of a coating apparatus and a bonding system disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

(First embodiment)
<1. Structure of joining system>
First, the configuration of the joining system according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic plan view showing the configuration of the joining system according to the first embodiment. FIG. 2 is a schematic side view of the substrate to be processed and the support substrate. In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  A bonding system 1 according to the first embodiment shown in FIG. 1 forms a superposed substrate T by bonding a substrate W to be processed and a support substrate S (see FIG. 2) via an adhesive G.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is defined as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed (corresponding to an example of a first substrate) is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed Is the joint surface Wj. The substrate W to be processed is thinned by polishing the non-bonded surface Wn after bonding to the support substrate S.

  On the other hand, the support substrate S (corresponding to an example of a second substrate) is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. As the support substrate S, for example, a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer can be used in addition to a glass substrate. Further, as the adhesive G, for example, a thermoplastic resin is used.

  As shown in FIG. 1, the joining system 1 includes a carry-in / out station 2, a first transfer region 3, and a joining station 4. The carry-in / out station 2, the first transfer region 3, and the joining station 4 are integrally connected in this order in the positive direction of the X axis.

  The carry-in / out station 2 is a place where cassettes Cw, Cs, and Ct for storing a plurality of (for example, 25) substrates in a horizontal state are placed. For example, four cassette mounting tables 21 are placed in a line in the loading / unloading station 2. On each cassette mounting table 21, a cassette Cw that accommodates a substrate to be processed W, a cassette Cs that accommodates a support substrate S, and a cassette Ct that accommodates a superposed substrate T are respectively placed.

  Note that the number of cassette mounting tables 21 can be arbitrarily determined. Here, an example in which the cassette Ct is mounted on two of the four cassette mounting tables 21 has been shown, but one of these is a cassette for collecting, for example, a substrate having a defect. May be placed.

  In the first transport region 3, a transport path 31 extending in the Y-axis direction and a first transport device 32 that can move along the transport path 31 are arranged. The first transfer device 32 is also movable in the X-axis direction and can be swung around the Z-axis, and the cassette Cw, Cs, Ct mounted on the cassette mounting table 21 and the first receiving of the joining station 4 described later. The substrate W to be processed, the support substrate S, and the superposed substrate T are transferred to and from the transfer unit 41.

  The joining station 4 includes a first delivery unit 41 and a second transfer area 42. Further, the bonding station 4 includes a coating / heat treatment block G1 and a bonding processing block G2.

  The first delivery unit 41 is disposed between the first transport area 3 and the second transport area 42. In the first delivery unit 41, the substrate W, the support substrate S, and the superposed substrate T between the first transport device 32 in the first transport region 3 and the second transport device 420 in the second transport region 42 described later. Is delivered.

  A second transport device 420 is disposed in the second transport region 42. The second transfer device 420 can move in the X-axis direction and the Y-axis direction and can turn about the Z-axis, and the substrate W to be processed between the first delivery unit 41, the coating / heat treatment block G1, and the bonding processing block G2. Then, the support substrate S and the superposed substrate T are transported.

  The coating / heat treatment block G1 and the bonding processing block G2 are disposed to face each other with the second transfer region 42 interposed therebetween. That is, the second transfer region 42, the coating / heat treatment block G1, and the bonding processing block G2 are arranged in the order of the bonding processing block G2, the second transfer region 42, and the coating / heat treatment block G1 along the positive Y-axis direction. The

  In the coating / heat treatment block G1, two coating devices 43 and one heat treatment device 44 are arranged adjacent to the second transfer region 42, respectively. The coating device 43 is a device that applies the adhesive G to the bonding surface Wj of the substrate W to be processed. The heat treatment apparatus 44 is an apparatus that heats the substrate W to which the adhesive G is applied to a predetermined temperature.

  In the joining processing block G2, four joining devices 45 are arranged adjacent to the second transport region 42. The bonding device 45 is a device that bonds the target substrate W and the support substrate S together. A specific configuration of the bonding apparatus 45 will be described later.

  The joining system 1 includes a control device 5. The control device 5 controls the operation of the joining system 1. The control device 5 is a computer, for example, and includes a control unit 6 and a storage unit 7. The storage unit 7 stores a program for controlling various processes such as a joining process. The control unit 6 is, for example, a CPU (Central Processing Unit), and controls the operation of the bonding system 1 by reading and executing a program stored in the storage unit 7.

  The program may be recorded on a computer-readable recording medium and installed in the storage unit 7 of the control device 5 from the recording medium. Examples of the computer-readable recording medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card. Moreover, the control part 6 may be comprised only with hardware, without using a program.

  In the bonding system 1 configured as described above, first, the first transfer device 32 in the first transfer region 3 takes out the substrate W to be processed from the cassette Cw placed on the cassette mounting table 21 and takes out the processed substrate. The substrate W is transferred to the first delivery unit 41. At this time, the substrate W to be processed is transported with the non-joint surface Wn facing downward.

  The to-be-processed substrate W conveyed to the 1st delivery part 41 is taken out from the 1st delivery part 41 by the 2nd conveyance apparatus 420, and is carried in into the coating device 43 of the application | coating and heat processing block G1. The coating device 43 includes, for example, a spin chuck, and sucks and holds the non-joint surface Wn of the substrate to be processed W with the spin chuck. Then, the coating device 43 supplies the liquid adhesive G to the bonding surface Wj of the substrate to be processed W while rotating the substrate to be processed W that is held by suction. Thereby, the adhesive G is spread on the bonding surface Wj of the substrate W to be processed.

  After the adhesive G is applied by the coating device 43, the substrate W to be processed is unloaded from the coating device 43 by the second transfer device 420 and loaded into the heat treatment device 44. The heat treatment apparatus 44, for example, heats the substrate W to be processed in an inert atmosphere, thereby volatilizing a solvent such as an organic solvent contained in the adhesive G so that the adhesive G is harder than when applied. . Thereafter, the temperature of the substrate to be processed W is adjusted to a predetermined temperature, for example, room temperature, by the heat treatment apparatus 44.

  After the heat treatment is performed by the heat treatment apparatus 44, the substrate to be processed W is unloaded from the heat treatment apparatus 44 by the second transfer apparatus 420 and loaded into the bonding apparatus 45.

  On the other hand, the support substrate S is taken out from the cassette Cs by the first transport device 32 and transported to the first delivery unit 41, and is further taken out from the first delivery unit 41 by the second transport device 420 and transported to the joining device 45. Is done.

  When the substrate to be processed W and the support substrate S are carried into the bonding apparatus 45, the bonding process of the substrate to be processed W and the support substrate S is performed by the bonding apparatus 45. Thereby, the superposition | polymerization board | substrate T is formed. Thereafter, the superposed substrate T is transported to the first delivery unit 41 by the second transport device 420 and transported to the cassette Ct by the first transport device 32. Thus, a series of processing ends.

<2. Configuration of coating device>
Next, the configuration of the above-described coating apparatus 43 will be described with reference to FIG. FIG. 3 is a schematic side view showing the configuration of the coating device 43.

  As shown in FIG. 3, the coating device 43 includes a chamber 10, an FFU (Fan Filter Unit) 20, a spin chuck 30, a coating nozzle 40, a cup 50, a back rinse nozzle 60, and a peripheral discharge mechanism 70. Is provided.

  The chamber 10 accommodates the spin chuck 30, the application nozzle 40, the cup 50, the back rinse nozzle 60, and the peripheral discharge mechanism 70. An FFU 20 is provided on the ceiling of the chamber 10. The FFU 20 is connected to the downflow gas supply source 202 via the valve 201, and supplies the downflow gas such as N 2 supplied from the downflow gas supply source 202 into the chamber 10, thereby bringing the FFU 20 into the chamber 10. Form a downflow.

  The spin chuck 30 includes a holding unit 301, a column unit 302, and a rotation mechanism 303. The holding unit 301 holds the target substrate W horizontally. The support portion 302 has a proximal end portion rotatably supported by the rotation mechanism 303 and supports the holding portion 301 at the distal end portion. The rotation mechanism 303 rotates the support column 302 around the vertical axis. The spin chuck 30 rotates the support section 302 by using the rotation mechanism 303 to rotate the holding section 301 supported by the support section 302, whereby the substrate W to be processed held by the holding section 301 is moved. Rotate.

  The coating nozzle 40 supplies an adhesive G that is a coating material to the substrate W to be processed. The application nozzle 40 is connected to an adhesive supply source 402 via a valve 401.

  The cup 50 includes an outer cup 51 and an inner cup 52. The outer cup 51 has an outer peripheral wall portion 510 that surrounds the outside of the holding portion 301, and collects the adhesive G that is scattered from the substrate W to be processed by the rotation of the spin chuck 30. An exhaust port 53 and a drain port 54 are formed at the bottom of the outer cup 51.

  The inner cup 52 is disposed inside the outer cup 51. The inner cup 52 has an inner peripheral wall portion 520. The inner peripheral wall portion 520 is disposed with the upper end portion approaching the peripheral edge of the back surface of the substrate W to be processed held by the spin chuck 30. The inner peripheral wall portion 520 has an outer peripheral surface 521 that gradually increases in diameter from the upper end side toward the lower end side, and an inner peripheral surface 522 that gradually decreases in diameter from the upper end side toward the lower end side.

  The downflow gas supplied from the FFU 20 is discharged to the outside from the exhaust port 53 through a passage formed by the inner peripheral surface of the outer peripheral wall portion 510 and the outer peripheral surface 521 of the inner peripheral wall portion 520. In addition, the adhesive G scattered from the substrate W to be processed by the rotation of the spin chuck 30 passes through a passage formed by the inner peripheral surface of the outer peripheral wall portion 510 and the outer peripheral surface 521 of the inner peripheral wall portion 520, and the drain port 54. Is discharged to the outside.

  A plurality of back rinse nozzles 60 are arranged in the vicinity of the spin chuck 30 inside the inner cup 52. The back rinse nozzle 60 is provided with its tip inclined outward. Each back rinse nozzle 60 is connected to a chemical solution supply source 602 via a valve 601 and discharges the chemical solution supplied from the chemical solution supply source 602 toward the back surface of the substrate W to be processed. As the chemical solution, for example, an organic solvent such as thinner or pure water is used.

  The peripheral discharge mechanism 70 is provided inside the inner cup 52 at a location closer to the rear peripheral portion of the substrate W to be processed than the back rinse nozzle 60. Specifically, the peripheral discharge mechanism 70 is disposed inside the back surface peripheral portion of the substrate W to be processed and in the vicinity of the back surface peripheral portion. The peripheral discharge mechanism 70 is connected to a gas supply source 702 via a valve 701, and N2 supplied from the gas supply source 702 is used as a clearance between the back peripheral edge of the substrate W to be processed and the upper end of the inner cup 52. Discharge toward Note that the gas discharged from the peripheral discharge mechanism 70 is not limited to N2, and may be, for example, dry air.

  Here, the configuration of the peripheral discharge mechanism 70 will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic plan view illustrating an example of the configuration of the peripheral discharge mechanism 70. FIG. 5 is a schematic plan view showing another example of the configuration of the peripheral discharge mechanism 70.

  As shown in FIG. 4, the peripheral discharge mechanism 70 includes a plurality of discharge ports 71. The plurality of discharge ports 71 are arranged side by side in a plan view circumferential shape with respect to the inner peripheral surface 522 of the inner peripheral wall portion 520. The peripheral discharge mechanism 70 discharges N2 from each discharge port 71 to the gap between the back peripheral edge of the substrate W to be processed and the upper end of the inner cup 52.

  As shown in FIG. 5, the peripheral discharge mechanism 70 has a ring-shaped discharge port 72 as an inner peripheral surface of the inner peripheral wall portion 520 in a plan view, instead of the plurality of discharge ports 71 arranged in a circle. 522 may be provided.

  As described above, the coating apparatus 43 according to the first embodiment discharges N 2 toward the gap between the rear surface peripheral edge of the substrate W to be processed and the upper end of the inner cup 52 using the peripheral discharge mechanism 70. Thereby, in the coating apparatus 43 according to the first embodiment, the adhesive G formed into a thread by the rotation of the substrate to be processed W passes through the gap between the peripheral edge of the back surface of the substrate to be processed W and the upper end portion of the inner cup 52. Intrusion into the inside of the cup 52 can be prevented.

  Further, since the peripheral discharge mechanism 70 includes a plurality of discharge ports 71 arranged side by side in a plan view or a ring-shaped discharge port 72 in a plan view, the peripheral discharge mechanism 70 enters the inner cup 52 of the thread-like adhesive G. Can be prevented over the entire circumference of the substrate W to be processed.

<3. Specific operation of coating apparatus>
Next, a specific operation of the coating apparatus 43 according to the first embodiment will be described with reference to FIGS. FIG. 6 is a chart showing an example of the processing procedure of the coating process performed by the coating device 43. FIG. 7 is an explanatory diagram of the discharge process, FIGS. 8 and 9 are explanatory diagrams of the coating process, and FIG. 10 is an explanatory diagram of the drying process.

  As shown in FIG. 6, the coating device 43 executes the discharge process (steps 1 to 5), the coating process (step 6), and the drying process (steps 7 and 8) in this order under the control of the control unit 6.

  Here, the discharging step is a step of discharging the adhesive G from the coating nozzle 40 onto the surface of the substrate to be processed W held by the spin chuck 30. The application process is a process of spreading the adhesive G on the surface of the substrate W to be processed by rotating the spin chuck 30. The drying process is a process for rotating the substrate W by rotating the spin chuck 30.

  First, the discharge process will be described. After holding the substrate to be processed W by the spin chuck 30, the coating device 43 discharges the adhesive G from the coating nozzle 40 onto the surface of the substrate to be processed W while rotating the spin chuck 30 at 100 rpm (Step 1 and FIG. 7). This processing time is 20 seconds.

  Subsequently, the coating device 43 rotates the spin chuck 30 at 200 rpm while discharging the adhesive G from the coating nozzle 40 onto the surface of the substrate W to be processed (step 2). This processing time is 10 seconds. Further, the coating apparatus 43 rotates the spin chuck 30 at 300 rpm while discharging the adhesive G from the coating nozzle 40 onto the surface of the substrate W to be processed (step 3), and then rotates the spin chuck 30 at 500 rpm. (Step 4). The processing time of steps 3 and 4 is 5 seconds each.

  As described above, when the coating device 43 discharges the adhesive G onto the surface of the substrate to be processed W, the high-viscosity adhesive G is applied to the substrate to be processed by increasing the number of rotations of the spin chuck 30 stepwise. It can be efficiently pushed to the outer peripheral side of W. Thereafter, the coating device 43 stops discharging the adhesive G from the coating nozzle 40, rotates the spin chuck 30 at 100 rpm for 5 seconds, and finishes the discharging process (step 5). Since the adhesive G has a high viscosity, the adhesive G is still in the central portion of the substrate W to be processed at the end of the discharge process.

  Next, the application process will be described. The coating device 43 rotates the spin chuck 30 at 1000 rpm while discharging the chemical solution from the back rinse nozzle 60 to the back surface of the substrate W to be processed (step 6). This processing time is 15 seconds. As shown in FIG. 8, the chemical solution discharged from the back rinse nozzle 60 hits the position closer to the center than the back surface peripheral edge of the substrate W to be processed, and then passes through the back surface of the substrate W to be processed. Spatters out of W.

  The adhesive G discharged on the surface of the substrate to be processed W reaches the peripheral edge of the substrate to be processed W during the process of step 6 and falls from the peripheral edge of the substrate to be processed W. At this time, since the chemical solution is discharged from the back rinse nozzle 60 to the back surface of the substrate W to be processed, the adhesive G that reaches the peripheral edge of the substrate W to be processed wraps around and adheres to the back surface of the substrate W to be processed. Can be prevented (see FIG. 9).

  It continues and demonstrates a drying process. After stopping the discharge of the chemical solution from the back rinse nozzle 60, the coating device 43 rotates the spin chuck 30 at 1500 rpm while discharging N 2 from the peripheral discharge mechanism 70 to dry the substrate W to be processed (Step 7). . This processing time is 5 seconds.

  Thus, the coating apparatus 43 starts discharging N2 from the peripheral discharge mechanism 70 after stopping the discharge of the chemical solution from the back rinse nozzle 60 in the drying process.

  That is, in the coating process, the adhesive G is prevented from entering the inner cup 52 by the chemical liquid discharged from the back rinse nozzle 60 as described above. However, in the drying process, since it is necessary to stop the discharge of the chemical solution from the back rinse nozzle 60 in order to dry the back surface of the substrate W to be processed, the thread-like adhesive G may enter the inner cup 52. There is. Therefore, in the coating apparatus 43 according to the first embodiment, after the back rinse nozzle 60 is stopped, the discharge of N2 from the peripheral discharge mechanism 70 is started, so that the amount of N2 used is suppressed and the thread-like bonding is performed. It is possible to continue to prevent the agent G from entering the gap (see FIG. 10).

  Further, in the coating apparatus 43 according to the first embodiment, the peripheral discharge mechanism 70 is arranged in the vicinity of the back surface peripheral portion of the substrate W to be processed, and the back surface peripheral portion of the substrate W to be processed and the upper end portion of the inner cup 52 are arranged. N2 is directly discharged into the gap. For this reason, according to the coating apparatus 43 which concerns on 1st Embodiment, the penetration | invasion to the said clearance gap of the thread-like adhesive G which cannot fully prevent only by producing an airflow like the past is prevented reliably. be able to.

  Thereafter, the coating device 43 stops the rotation of the spin chuck 30 (step 8), and then stops the discharge of N2 from the peripheral discharge mechanism 70, and then ends a series of processing procedures.

  As described above, the coating apparatus 43 according to the first embodiment includes the holding unit 301, the coating nozzle 40, the rotation mechanism 303, the outer cup 51, the inner cup 52, and the peripheral discharge mechanism 70. . The holding unit 301 holds the target substrate W horizontally. The application nozzle 40 discharges the adhesive G onto the surface of the substrate to be processed W held by the holding unit 301. The rotation mechanism 303 rotates the holding unit 301. The outer cup 51 has an outer peripheral wall portion 510 that surrounds the outside of the holding portion 301. The inner cup 52 has an inner peripheral wall portion 520 that is disposed with the upper end portion approaching the peripheral edge of the back surface of the substrate W to be processed. The peripheral discharge mechanism 70 is disposed in the inner cup 52 and discharges N2 toward the back peripheral edge of the substrate W to be processed. Therefore, according to the coating apparatus 43 which concerns on 1st Embodiment, adhesion of the adhesive agent G to the back surface of the to-be-processed substrate W can be prevented.

  In the first embodiment described above, after stopping the discharge of the chemical liquid from the back rinse nozzle 60 in Step 7, the discharge of N2 from the peripheral discharge mechanism 70 is started. Before stopping the back rinse nozzle 60, the discharge of N2 from the peripheral discharge mechanism 70 may be started. For example, the coating device 43 may start discharging N2 from the peripheral discharge mechanism 70 from step 6.

(Second Embodiment)
In the first embodiment described above, an example in which the peripheral discharge mechanism 70 discharges N 2 has been described. May be performed. Hereinafter, an example of such a case will be described with reference to FIG. FIG. 11 is a chart showing a processing procedure of a coating process according to the second embodiment. 11 is the same as the processing of Steps 1 to 5 and the processing of Steps 7 and 8 shown in FIG. 6, and the description thereof is omitted here. To do.

  As shown in FIG. 11, in this way, the coating process according to the second embodiment performs the latter half of the coating process (step 6) shown in FIG. 6 from the peripheral discharge mechanism 70 to the rear peripheral edge of the substrate W to be processed. The process is changed to a process for discharging a chemical solution.

  Specifically, the coating apparatus 43 rotates the spin chuck 30 at 1000 rpm while discharging the chemical solution from the back rinse nozzle 60 to the back surface of the substrate W to be processed in the coating process (step 6). This processing time is 10 seconds. Subsequently, after stopping the discharge of the chemical solution from the back rinse nozzle 60, the coating device 43 rotates the spin chuck 30 at 1000 rpm while discharging the chemical solution from the peripheral discharge mechanism 70 to the peripheral portion of the back surface of the substrate W to be processed. (Step 7). This processing time is 5 seconds. The peripheral discharge mechanism 70 according to the second embodiment is connected to, for example, a gas supply source 702 and a chemical supply source 602.

  Thereby, compared with the application | coating process which concerns on 1st Embodiment, since the time required for drying the back surface of the to-be-processed substrate W is shortened, the time of a drying process can be shortened. The amount of the thread-like adhesive G generated increases as the drying process time increases. Therefore, by shortening the time of the drying process, it is possible to more reliably prevent the adhesive G from adhering to the back surface of the substrate W to be processed.

(Other embodiments)
Next, a modified example of the coating device 43 will be described with reference to FIG. FIG. 12 is a view showing a modified example of the coating device 43. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  As shown in FIG. 12, the coating device 43 may include a plurality of fins 80 on the outer periphery of the holding unit 301 of the spin chuck 30. The fin 80 rotates with the rotation of the spin chuck 30, and passes from the inner side of the inner cup 52 to the outside of the inner cup 52 via a gap between the rear surface peripheral edge of the substrate W to be processed and the upper end portion of the inner cup 52. Creates an airflow that heads.

  Thus, for example, in step 7 of FIG. 6, even if there is a time lag between the discharge of the chemical solution from the back rinse nozzle 60 and the start of N2 discharge from the peripheral discharge mechanism 70, the fin 80 Due to the airflow formed, the penetration of the thread-like adhesive G in the time lag can be suppressed.

  As described above, by providing the fin 80 in the holding portion 301 of the spin chuck 30, it is possible to more reliably prevent the thread-like adhesive G from entering the inner cup 52.

  Further, in each of the embodiments described above, an example in which the peripheral discharge mechanism 70 discharges N2 toward the gap between the back peripheral portion of the substrate W to be processed and the upper end portion of the inner cup 52 has been described. The discharge mechanism 70 may discharge N2 toward the peripheral edge of the back surface of the substrate W to be processed.

  In each of the embodiments described above, an example in which the coating apparatus 43 applies the adhesive G to the substrate W to be processed has been described. However, the coating apparatus 43 is not applied to the substrate W to be processed but the support substrate S. On the other hand, an adhesive G may be applied.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

W Substrate S Support substrate G Adhesive T Polymerized substrate 5 Control device 6 Control unit 30 Spin chuck 40 Application nozzle 43 Application device 51 Outer cup 52 Inner cup 60 Back rinse nozzle 70 Peripheral discharge mechanism 71, 72 Discharge port 301 Holding unit 303 Rotating mechanism 510 Outer peripheral wall 520 Inner peripheral wall 521 Outer peripheral surface 522 Inner peripheral surface

Claims (11)

A holding unit for holding the substrate horizontally;
An application nozzle that discharges an application material onto the surface of the substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with its upper end close to the peripheral edge of the back surface of the substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges gas toward the peripheral edge of the back surface of the substrate ;
A back rinse nozzle that is disposed in a location farther from the peripheral edge of the back surface of the substrate than the peripheral discharge mechanism in the inner cup, and discharges liquid to the back surface of the substrate ;
The inner peripheral wall portion is
An outer wall that expands from the upper end to the lower end,
An inner wall that decreases in diameter from the upper end side toward the lower end side;
Have
The peripheral discharge mechanism is
An applicator provided on the inner wall surface of the inner peripheral wall portion . A holding unit for holding the substrate horizontally;
An application nozzle that discharges an application material onto the surface of the substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with its upper end close to the peripheral edge of the back surface of the substrate;
A back rinse nozzle disposed in the inner cup and for discharging liquid to the back surface of the substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges the gas and the liquid toward the rear peripheral edge of the substrate ;
A discharging step of discharging a coating material from the coating nozzle to the surface of the substrate held by the holding unit; and the application by rotating the holding unit while discharging the liquid to the back surface of the substrate. An application step of spreading a material on the surface of the substrate, and a control unit that performs a drying step of rotating the holding unit and drying the substrate after stopping the discharge of the liquid ,
The controller is
In the coating step, after the liquid is discharged from the back rinse nozzle to the back surface of the substrate, the discharge of the liquid from the back rinse nozzle is stopped, and then the peripheral edge of the back surface of the substrate is stopped from the peripheral discharge mechanism. The liquid is discharged onto the part, and then, in the drying step, gas is discharged from the peripheral discharge mechanism toward the back peripheral part of the substrate . A holding portion having a smaller diameter than the substrate for holding the substrate horizontally;
An application nozzle that discharges an application material onto the surface of the substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with its upper end close to the peripheral edge of the back surface of the substrate;
A back rinse nozzle disposed in the inner cup and for discharging liquid to the back surface of the substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges gas toward the peripheral edge of the back surface of the substrate ;
A coating apparatus comprising: a plurality of fins provided on an outer periphery of the holding unit . The peripheral discharge mechanism is
The coating apparatus according to any one of claims 1 to 3, wherein the coating apparatus is disposed inside the back surface peripheral portion of the substrate and in the vicinity of the back surface peripheral portion in the inner cup. The peripheral discharge mechanism is
According to any one of claims 1-4, which toward the gap, characterized in that discharging the gas between the upper end of the inner cup and the peripheral portion of the back surface of the back side rim portion or the substrate of the substrate Coating device. The peripheral discharge mechanism is
The coating apparatus according to any one of claims 1 to 5 , further comprising a plurality of discharge ports arranged in a circle in a plan view. The peripheral discharge mechanism is
The coating apparatus according to any one of claims 1 to 5 , further comprising a ring-shaped discharge port in plan view. The coating apparatus according to any one of claims 1 to 7, wherein the coating material is an adhesive. A loading / unloading station on which the first substrate and the second substrate are placed;
A substrate transfer device for transferring the first substrate and the second substrate;
A coating device that applies an adhesive to the first substrate transported by the substrate transport device;
A bonding apparatus for bonding the first substrate to which the adhesive is applied and the second substrate;
The coating device includes:
A holding unit for holding the first substrate horizontally;
An application nozzle for discharging an adhesive onto the surface of the first substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with the upper end portion approaching the rear surface peripheral edge portion of the first substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges gas toward the peripheral edge of the back surface of the first substrate ;
A back rinse nozzle disposed in a place farther from the peripheral edge of the back surface of the first substrate than the peripheral edge discharge mechanism in the inner cup, and for discharging liquid to the back surface of the first substrate ;
The inner peripheral wall portion is
An outer wall that expands from the upper end to the lower end,
An inner wall that decreases in diameter from the upper end side toward the lower end side;
Have
The peripheral discharge mechanism is
The joining system is provided on the inner wall surface of the inner peripheral wall portion . A loading / unloading station on which the first substrate and the second substrate are placed;
A substrate transfer device for transferring the first substrate and the second substrate;
A coating device that applies an adhesive to the first substrate transported by the substrate transport device;
A bonding apparatus for bonding the first substrate to which the adhesive is applied and the second substrate;
The coating device includes:
A holding unit for holding the first substrate horizontally;
An application nozzle for discharging an adhesive onto the surface of the first substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with the upper end portion approaching the rear surface peripheral edge portion of the first substrate;
A back rinse nozzle disposed in the inner cup and for discharging liquid to the back surface of the first substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges the gas and the liquid toward the back peripheral edge of the first substrate ;
A discharge step of discharging a coating material from the coating nozzle to the surface of the first substrate held by the holding unit; and rotating the holding unit while discharging the liquid to the back surface of the first substrate. And a control unit that performs a coating process of spreading the coating material on the surface of the first substrate, and a drying process of rotating the holding unit and drying the first substrate after stopping the discharge of the liquid It equipped with a door,
The controller is
In the application step, after the liquid is discharged from the back rinse nozzle to the back surface of the first substrate, the discharge of the liquid from the back rinse nozzle is stopped, and then the first discharge from the peripheral discharge mechanism. The bonding system according to claim 1, wherein the liquid is discharged to a back surface peripheral portion of the substrate, and then, in the drying step, gas is discharged from the peripheral discharge mechanism toward the back surface peripheral portion of the first substrate . A loading / unloading station on which the first substrate and the second substrate are placed;
A substrate transfer device for transferring the first substrate and the second substrate;
A coating device that applies an adhesive to the first substrate transported by the substrate transport device;
A bonding apparatus for bonding the first substrate to which the adhesive is applied and the second substrate;
The coating device includes:
A holding portion having a smaller diameter than the first substrate for holding the first substrate horizontally;
An application nozzle for discharging an adhesive onto the surface of the first substrate held by the holding unit;
A rotation mechanism for rotating the holding portion;
An outer cup having an outer peripheral wall portion surrounding the outside of the holding portion;
An inner cup having an inner peripheral wall portion disposed with the upper end portion approaching the rear surface peripheral edge portion of the first substrate;
A back rinse nozzle disposed in the inner cup and for discharging liquid to the back surface of the first substrate;
A peripheral discharge mechanism that is disposed in the inner cup and discharges gas toward the peripheral edge of the back surface of the first substrate ;
A joining system comprising a plurality of fins provided on an outer periphery of the holding portion .

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