SG10201607132XA - Plating Apparatus, Plating Method, And Substrate Holder - Google Patents

Plating Apparatus, Plating Method, And Substrate Holder

Info

Publication number
SG10201607132XA
SG10201607132XA SG10201607132XA SG10201607132XA SG10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA SG 10201607132X A SG10201607132X A SG 10201607132XA
Authority
SG
Singapore
Prior art keywords
plating
substrate holder
plating method
plating apparatus
holder
Prior art date
Application number
SG10201607132XA
Other languages
English (en)
Inventor
Junko Mine
Tsutomu Nakada
Mitsutoshi Yahagi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201607132XA publication Critical patent/SG10201607132XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
    • H01L2224/1146—Plating
    • H01L2224/11462—Electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Robotics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG10201607132XA 2015-08-28 2016-08-26 Plating Apparatus, Plating Method, And Substrate Holder SG10201607132XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015168969A JP6317299B2 (ja) 2015-08-28 2015-08-28 めっき装置、めっき方法、及び基板ホルダ

Publications (1)

Publication Number Publication Date
SG10201607132XA true SG10201607132XA (en) 2017-03-30

Family

ID=58098210

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201607132XA SG10201607132XA (en) 2015-08-28 2016-08-26 Plating Apparatus, Plating Method, And Substrate Holder

Country Status (6)

Country Link
US (2) US10316426B2 (es)
JP (2) JP6317299B2 (es)
KR (1) KR102483669B1 (es)
CN (2) CN111304715B (es)
SG (1) SG10201607132XA (es)
TW (1) TWI687555B (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3589704A4 (en) 2017-03-03 2020-12-16 Harland Medical Systems, Inc. COATING COMPOSITION WITH A HYDROPHILIC CROSSLINKER, A HYDROPHOBIC CROSSLINKER AND, IF APPLICABLE, A HYDROGEL AND A METHOD FOR MANUFACTURING AND USING THEREOF
JP6859150B2 (ja) * 2017-03-22 2021-04-14 株式会社荏原製作所 めっき装置及びめっき槽構成の決定方法
WO2019003891A1 (ja) 2017-06-28 2019-01-03 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6891060B2 (ja) 2017-07-11 2021-06-18 株式会社荏原製作所 レギュレーションプレート、アノードホルダ、及び基板ホルダ
WO2019050962A1 (en) * 2017-09-05 2019-03-14 Harland Medical Systems, Inc. COATING APPARATUS WITH AUTOMATIC FLUID LEVEL SYSTEM, AND METHODS OF USING THE SAME
KR20200075843A (ko) * 2017-10-20 2020-06-26 아루멕쿠스 피이 가부시키가이샤 표면처리 장치
JP6975650B2 (ja) * 2018-01-18 2021-12-01 株式会社荏原製作所 検査用基板を用いる電流測定モジュールおよび検査用基板
JP6942072B2 (ja) * 2018-02-22 2021-09-29 株式会社荏原製作所 めっき装置
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
JP7182911B2 (ja) * 2018-06-21 2022-12-05 株式会社荏原製作所 めっき装置、及びめっき方法
KR102111304B1 (ko) * 2018-08-09 2020-05-18 (주)선우하이테크 정전류 제어기능을 갖는 전기 도금 시스템 및 방법
CN108754590A (zh) * 2018-08-22 2018-11-06 深圳市创智成功科技有限公司 导电环、基于其的供电装置及基于供电装置的电镀治具
TWI728668B (zh) * 2019-01-31 2021-05-21 日商Ａｌｍｅｘ Ｐｅ股份有限公司 工件保持治具及表面處理裝置
JP7256708B2 (ja) 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
TWI722555B (zh) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 電鍍治具
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
WO2022144988A1 (ja) * 2020-12-28 2022-07-07 株式会社荏原製作所 基板の接液方法、およびめっき装置
JP6936422B1 (ja) * 2021-01-20 2021-09-15 株式会社荏原製作所 めっき装置及び基板の膜厚測定方法
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法
JP7192132B1 (ja) * 2021-03-03 2022-12-19 株式会社荏原製作所 基板ホルダ、めっき装置、及びめっき装置の製造方法
JP7027622B1 (ja) * 2021-06-17 2022-03-01 株式会社荏原製作所 抵抗体、及び、めっき装置
KR102565864B1 (ko) 2021-06-18 2023-08-10 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
JP7285389B1 (ja) * 2022-06-27 2023-06-01 株式会社荏原製作所 めっき装置、および、めっき方法

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JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
JP2010209440A (ja) * 2009-03-12 2010-09-24 Sumitomo Bakelite Co Ltd メッキ用治具
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JP5898540B2 (ja) * 2012-03-22 2016-04-06 アルメックスＰｅ株式会社 ワーク保持治具及び表面処理装置
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JP6247557B2 (ja) * 2014-02-14 2017-12-13 株式会社Ｊｃｕ 基板めっき治具

Also Published As

Publication number Publication date
JP6317299B2 (ja) 2018-04-25
JP2017043815A (ja) 2017-03-02
JP2018090911A (ja) 2018-06-14
CN106480480B (zh) 2020-05-05
JP6488041B2 (ja) 2019-03-20
US20190249326A1 (en) 2019-08-15
US10316426B2 (en) 2019-06-11
US10513795B2 (en) 2019-12-24
CN106480480A (zh) 2017-03-08
US20170058423A1 (en) 2017-03-02
KR102483669B1 (ko) 2023-01-02
TWI687555B (zh) 2020-03-11
CN111304715B (zh) 2021-01-26
KR20170026112A (ko) 2017-03-08
CN111304715A (zh) 2020-06-19
TW201708623A (zh) 2017-03-01

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