SG10201604456TA - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
SG10201604456TA
SG10201604456TA SG10201604456TA SG10201604456TA SG10201604456TA SG 10201604456T A SG10201604456T A SG 10201604456TA SG 10201604456T A SG10201604456T A SG 10201604456TA SG 10201604456T A SG10201604456T A SG 10201604456TA SG 10201604456T A SG10201604456T A SG 10201604456TA
Authority
SG
Singapore
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
Prior art date
Application number
SG10201604456TA
Other languages
English (en)
Inventor
Hayashi Masato
Noguchi Kohei
Iizuka Kenji
Iida Naruaki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201604456TA publication Critical patent/SG10201604456TA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • G01N2021/8578—Gaseous flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
SG10201604456TA 2015-06-03 2016-06-02 Substrate processing apparatus and substrate processing method SG10201604456TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015113240A JP6319193B2 (ja) 2015-06-03 2015-06-03 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
SG10201604456TA true SG10201604456TA (en) 2017-01-27

Family

ID=57452024

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201604456TA SG10201604456TA (en) 2015-06-03 2016-06-02 Substrate processing apparatus and substrate processing method

Country Status (6)

Country Link
US (1) US9818654B2 (ja)
JP (1) JP6319193B2 (ja)
KR (2) KR102405539B1 (ja)
CN (2) CN106252196B (ja)
SG (1) SG10201604456TA (ja)
TW (2) TWI650189B (ja)

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JP6319193B2 (ja) * 2015-06-03 2018-05-09 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR102619157B1 (ko) * 2016-01-21 2023-12-28 도쿄엘렉트론가부시키가이샤 약액 공급 장치 및 도포 현상 시스템
TWI743288B (zh) * 2017-01-20 2021-10-21 日商東京威力科創股份有限公司 異物檢出裝置，異物檢出方法及記憶媒體
TWI773721B (zh) * 2017-01-20 2022-08-11 日商東京威力科創股份有限公司 異物檢測裝置、異物檢測方法及記憶媒體
JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
CN106908411A (zh) * 2017-04-26 2017-06-30 上海健康医学院 一种血清中尿素氮含量近红外光谱测定方法
CN106932362A (zh) * 2017-04-26 2017-07-07 上海健康医学院 一种血清中尿素氮肌酐含量近红外光谱测定方法
JP7021877B2 (ja) 2017-08-08 2022-02-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、位置合わせ装置および位置合わせ方法
WO2019131226A1 (ja) 2017-12-28 2019-07-04 東京エレクトロン株式会社 基板処理装置、基板処理方法、及びコンピュータ読み取り可能な記録媒体
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CN108746010A (zh) * 2018-05-24 2018-11-06 友达光电（昆山）有限公司 一种清洗系统
JP7232586B2 (ja) * 2018-07-31 2023-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102134161B1 (ko) * 2018-08-23 2020-07-21 세메스 주식회사 기판 처리 장치 및 방법
CN112601948A (zh) 2018-08-31 2021-04-02 粒子监测系统有限公司 流体折射率优化粒子计数器
JP7260308B2 (ja) * 2019-01-24 2023-04-18 リオン株式会社 流体中浮遊物質測定用フローセル及び粒子計数装置
JP7202904B2 (ja) * 2019-01-24 2023-01-12 リオン株式会社 粒子計数器
JP7318212B2 (ja) * 2019-01-24 2023-08-01 東京エレクトロン株式会社 基板処理装置、基板処理システム及び基板処理方法。
TW202200988A (zh) * 2020-03-09 2022-01-01 日商東京威力科創股份有限公司 異物偵測裝置、基板處理裝置、異物偵測方法及記錄媒體
CN111394739B (zh) * 2020-04-26 2024-01-05 北京七星华创集成电路装备有限公司 一种金属掩膜板清洗设备
CN115702338A (zh) * 2020-06-17 2023-02-14 东京毅力科创株式会社 异物检查基板、基板处理装置以及基板处理方法
KR20220097680A (ko) * 2020-12-30 2022-07-08 세메스 주식회사 노즐 대기 포트와 이를 포함하는 기판 처리 장치 및 이를 이용한 노즐 세정 방법
JP2022122680A (ja) * 2021-02-10 2022-08-23 株式会社菊水製作所 粉体測定装置、センサプローブの特性の確認又は較正方法
JP2022124070A (ja) * 2021-02-15 2022-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法

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Also Published As

Publication number Publication date
KR102513791B1 (ko) 2023-03-27
CN106252196B (zh) 2020-11-13
CN112255889A (zh) 2021-01-22
CN112255889B (zh) 2023-07-14
US20160358829A1 (en) 2016-12-08
US9818654B2 (en) 2017-11-14
KR20220070416A (ko) 2022-05-31
JP6319193B2 (ja) 2018-05-09
TW201919784A (zh) 2019-06-01
TWI720384B (zh) 2021-03-01
CN106252196A (zh) 2016-12-21
KR20160142778A (ko) 2016-12-13
JP2016225574A (ja) 2016-12-28
TWI650189B (zh) 2019-02-11
TW201709989A (zh) 2017-03-16
KR102405539B1 (ko) 2022-06-08

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