SG10201406428QA - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- SG10201406428QA SG10201406428QA SG10201406428QA SG10201406428QA SG10201406428QA SG 10201406428Q A SG10201406428Q A SG 10201406428QA SG 10201406428Q A SG10201406428Q A SG 10201406428QA SG 10201406428Q A SG10201406428Q A SG 10201406428QA SG 10201406428Q A SG10201406428Q A SG 10201406428QA
- Authority
- SG
- Singapore
- Prior art keywords
- epoxy resin
- circuit board
- lead frame
- resin composition
- semiconductor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 239000003822 epoxy resin Substances 0.000 abstract 4
- 229920000647 polyepoxide Polymers 0.000 abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910000000 metal hydroxide Inorganic materials 0.000 abstract 2
- 150000004692 metal hydroxides Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000006104 solid solution Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H01L2924/1025—Semiconducting materials
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
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JP2009234716 | 2009-10-09 | ||
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US (1) | US9082708B2 (ko) |
JP (1) | JPWO2011043058A1 (ko) |
KR (1) | KR101678256B1 (ko) |
CN (1) | CN102576696B (ko) |
SG (1) | SG10201406428QA (ko) |
TW (1) | TWI500648B (ko) |
WO (1) | WO2011043058A1 (ko) |
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CN103796839B (zh) | 2011-07-21 | 2016-08-24 | 惠普发展公司,有限责任合伙企业 | 打印介质 |
JP6218413B2 (ja) * | 2013-03-29 | 2017-10-25 | 株式会社Subaru | プレドープ剤、これを用いた蓄電デバイス及びその製造方法 |
CN104882386B (zh) | 2014-02-27 | 2019-03-01 | 恩智浦美国有限公司 | 半导体器件格栅阵列封装 |
JP6605190B2 (ja) * | 2014-05-28 | 2019-11-13 | 住友ベークライト株式会社 | 封止用樹脂組成物、および半導体装置 |
KR101689833B1 (ko) * | 2015-05-19 | 2017-01-10 | 주식회사 프로텍 | Bga 반도체 패키지의 전자파 차폐막 형성 방법 및 이에 사용되는 베이스 테이프 |
US10797025B2 (en) | 2016-05-17 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Advanced INFO POP and method of forming thereof |
EP3456781A4 (en) * | 2016-05-30 | 2020-02-19 | Hitachi Chemical Company, Ltd. | GASKET COMPOSITION AND SEMICONDUCTOR COMPONENT |
DE102017121485A1 (de) * | 2017-09-15 | 2019-03-21 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit Kupferkorrosionsinhibitoren |
KR20210000530A (ko) | 2019-06-25 | 2021-01-05 | 삼성전자주식회사 | 칩 적층 반도체 패키지 및 그 제조 방법 |
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JPS6213432A (ja) * | 1985-07-11 | 1987-01-22 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH0597970A (ja) * | 1991-10-07 | 1993-04-20 | Shin Etsu Chem Co Ltd | 熱硬化性樹脂組成物及び半導体装置 |
JPH086484B2 (ja) | 1992-07-01 | 1996-01-24 | 永代機械工業株式会社 | 立体駐車装置 |
JP2000311915A (ja) * | 1998-10-14 | 2000-11-07 | Texas Instr Inc <Ti> | 半導体デバイス及びボンディング方法 |
JP3661444B2 (ja) | 1998-10-28 | 2005-06-15 | 株式会社ルネサステクノロジ | 半導体装置、半導体ウエハ、半導体モジュールおよび半導体装置の製造方法 |
JP4286399B2 (ja) * | 1999-02-25 | 2009-06-24 | 日東電工株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法 |
WO2000050512A1 (en) * | 1999-02-25 | 2000-08-31 | Nitto Denko Corporation | Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
JP3573651B2 (ja) * | 1999-03-30 | 2004-10-06 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
KR100550705B1 (ko) | 1999-10-06 | 2006-02-08 | 닛토덴코 가부시키가이샤 | 반도체 밀봉용 수지 조성물, 및 이를 이용한 반도체 장치및 반도체 장치의 제조 방법 |
JP2002121260A (ja) * | 1999-10-06 | 2002-04-23 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法 |
CN1286906C (zh) * | 2000-09-30 | 2006-11-29 | 住友电木株式会社 | 环氧树脂组合物和半导体装置 |
JP4779269B2 (ja) * | 2001-09-17 | 2011-09-28 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
US20040245320A1 (en) * | 2001-10-23 | 2004-12-09 | Mesato Fukagaya | Bonding wire |
JP4030786B2 (ja) * | 2002-03-29 | 2008-01-09 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
MY148463A (en) * | 2004-07-29 | 2013-04-30 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
CN100572446C (zh) * | 2004-08-18 | 2009-12-23 | 株式会社钟化 | 半导体密封剂用环氧树脂组合物以及环氧树脂成型材料 |
JP2007012776A (ja) | 2005-06-29 | 2007-01-18 | Nippon Steel Materials Co Ltd | 半導体装置用ボンディングワイヤ |
JP4941804B2 (ja) * | 2005-03-02 | 2012-05-30 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂 |
JP5217119B2 (ja) | 2005-06-15 | 2013-06-19 | 日立化成株式会社 | 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
JP4946030B2 (ja) * | 2005-12-16 | 2012-06-06 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
SG171647A1 (en) * | 2006-05-12 | 2011-06-29 | Denki Kagaku Kogyo Kk | Ceramic powder and use thereof |
JP5120266B6 (ja) * | 2007-01-31 | 2018-06-27 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
US7791198B2 (en) * | 2007-02-20 | 2010-09-07 | Nec Electronics Corporation | Semiconductor device including a coupling region which includes layers of aluminum and copper alloys |
JP5470806B2 (ja) | 2007-11-29 | 2014-04-16 | 住友ベークライト株式会社 | 半導体装置並びに封止用エポキシ樹脂組成物及びその製造方法 |
-
2010
- 2010-10-05 SG SG10201406428QA patent/SG10201406428QA/en unknown
- 2010-10-05 WO PCT/JP2010/005950 patent/WO2011043058A1/ja active Application Filing
- 2010-10-05 KR KR1020127011809A patent/KR101678256B1/ko active IP Right Grant
- 2010-10-05 JP JP2011535278A patent/JPWO2011043058A1/ja active Pending
- 2010-10-05 CN CN201080044844.6A patent/CN102576696B/zh not_active Expired - Fee Related
- 2010-10-05 US US13/496,547 patent/US9082708B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
CN102576696A (zh) | 2012-07-11 |
KR20120091190A (ko) | 2012-08-17 |
US20120175761A1 (en) | 2012-07-12 |
WO2011043058A1 (ja) | 2011-04-14 |
TWI500648B (zh) | 2015-09-21 |
TW201120083A (en) | 2011-06-16 |
US9082708B2 (en) | 2015-07-14 |
CN102576696B (zh) | 2015-10-07 |
KR101678256B1 (ko) | 2016-11-21 |
JPWO2011043058A1 (ja) | 2013-03-04 |
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