CN104766853B - 一种耐撞击的半导体芯片封装结构 - Google Patents
一种耐撞击的半导体芯片封装结构 Download PDFInfo
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CN104766853B true CN104766853B (zh) | 2017-11-07 |
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CN107438330A (zh) * | 2017-08-23 | 2017-12-05 | 西安易朴通讯技术有限公司 | 一种器件结构 |
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CN103367174A (zh) * | 2012-03-28 | 2013-10-23 | 英飞凌科技股份有限公司 | 制造半导体器件的方法以及半导体器件 |
CN103897344A (zh) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 |
CN204516754U (zh) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | 一种耐撞击的半导体芯片封装结构 |
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US7084494B2 (en) * | 2004-06-18 | 2006-08-01 | Texas Instruments Incorporated | Semiconductor package having integrated metal parts for thermal enhancement |
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CN103367174A (zh) * | 2012-03-28 | 2013-10-23 | 英飞凌科技股份有限公司 | 制造半导体器件的方法以及半导体器件 |
CN103897344A (zh) * | 2012-12-26 | 2014-07-02 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 |
CN204516754U (zh) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | 一种耐撞击的半导体芯片封装结构 |
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Effective date of registration: 20160615 Address after: 215300 Jiangsu province north of the city of Yushan town of Kunshan city Hanpu Road No. 998, room 3 Applicant after: Suzhou Juda senchip Microelectronics Co. Ltd. Address before: 225500 hi tech innovation center, Jiangyan District, Taizhou, Jiangsu Applicant before: Jiangsu Senchip Microelectronics Co., Ltd. |
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Effective date of registration: 20180918 Address after: 215316 Han Po Road, hi tech Industrial Park, Kunshan Development Zone, Jiangsu (998) Patentee after: Kunshan Juda Electronic Co., Ltd. Address before: 215300 room 3, Han Po Road, Yushan Town, Yushan Town, Kunshan, Jiangsu Patentee before: Suzhou Juda senchip Microelectronics Co. Ltd. |