JPWO2011043058A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JPWO2011043058A1
JPWO2011043058A1 JP2011535278A JP2011535278A JPWO2011043058A1 JP WO2011043058 A1 JPWO2011043058 A1 JP WO2011043058A1 JP 2011535278 A JP2011535278 A JP 2011535278A JP 2011535278 A JP2011535278 A JP 2011535278A JP WO2011043058 A1 JPWO2011043058 A1 JP WO2011043058A1
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Prior art keywords
epoxy resin
semiconductor device
group
general formula
metal hydroxide
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JP2011535278A
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Japanese (ja)
Inventor
伸一 前佛
伸一 前佛
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • H01L23/293—Organic, e.g. plastic
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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CN104882386B (zh) 2014-02-27 2019-03-01 恩智浦美国有限公司 半导体器件格栅阵列封装
JP6605190B2 (ja) * 2014-05-28 2019-11-13 住友ベークライト株式会社 封止用樹脂組成物、および半導体装置
KR101689833B1 (ko) * 2015-05-19 2017-01-10 주식회사 프로텍 Bga 반도체 패키지의 전자파 차폐막 형성 방법 및 이에 사용되는 베이스 테이프
US10797025B2 (en) 2016-05-17 2020-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Advanced INFO POP and method of forming thereof
SG10201912594XA (en) 2016-05-30 2020-02-27 Hitachi Chemical Co Ltd Sealing composition and semiconductor device
DE102017121485A1 (de) * 2017-09-15 2019-03-21 Infineon Technologies Austria Ag Halbleitervorrichtung mit Kupferkorrosionsinhibitoren
KR20210000530A (ko) 2019-06-25 2021-01-05 삼성전자주식회사 칩 적층 반도체 패키지 및 그 제조 방법

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