SE9604690D0 - A Packaging structure fjor intergrated ciruits - Google Patents

A Packaging structure fjor intergrated ciruits

Info

Publication number
SE9604690D0
SE9604690D0 SE9604690A SE9604690A SE9604690D0 SE 9604690 D0 SE9604690 D0 SE 9604690D0 SE 9604690 A SE9604690 A SE 9604690A SE 9604690 A SE9604690 A SE 9604690A SE 9604690 D0 SE9604690 D0 SE 9604690D0
Authority
SE
Sweden
Prior art keywords
stack
components
chips
substrates
signal paths
Prior art date
Application number
SE9604690A
Other languages
English (en)
Other versions
SE511425C2 (sv
SE9604690L (sv
Inventor
Hjalmar Hesselbom
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604690A priority Critical patent/SE511425C2/sv
Publication of SE9604690D0 publication Critical patent/SE9604690D0/sv
Priority to TW086100961A priority patent/TW462098B/zh
Priority to JP52763498A priority patent/JP2001506417A/ja
Priority to PCT/SE1997/002190 priority patent/WO1998027587A1/en
Priority to CNB971818746A priority patent/CN1139120C/zh
Priority to CA002275506A priority patent/CA2275506A1/en
Priority to US08/994,648 priority patent/US6014313A/en
Priority to AU55060/98A priority patent/AU5506098A/en
Priority to EP97951411A priority patent/EP0951735A1/en
Priority to KR1019997005626A priority patent/KR20000069624A/ko
Publication of SE9604690L publication Critical patent/SE9604690L/sv
Publication of SE511425C2 publication Critical patent/SE511425C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
SE9604690A 1996-12-19 1996-12-19 Packningsanordning för integrerade kretsar SE511425C2 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9604690A SE511425C2 (sv) 1996-12-19 1996-12-19 Packningsanordning för integrerade kretsar
TW086100961A TW462098B (en) 1996-12-19 1997-01-29 A packaging structure for integrated circuits
KR1019997005626A KR20000069624A (ko) 1996-12-19 1997-12-19 집적회로용 패키징 구조물
CNB971818746A CN1139120C (zh) 1996-12-19 1997-12-19 集成电路的封装结构
PCT/SE1997/002190 WO1998027587A1 (en) 1996-12-19 1997-12-19 A packaging structure for integrated circuits
JP52763498A JP2001506417A (ja) 1996-12-19 1997-12-19 集積回路用パッケージ構造
CA002275506A CA2275506A1 (en) 1996-12-19 1997-12-19 A packaging structure for integrated circuits
US08/994,648 US6014313A (en) 1996-12-19 1997-12-19 Packaging structure for integrated circuits
AU55060/98A AU5506098A (en) 1996-12-19 1997-12-19 A packaging structure for integrated circuits
EP97951411A EP0951735A1 (en) 1996-12-19 1997-12-19 A packaging structure for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604690A SE511425C2 (sv) 1996-12-19 1996-12-19 Packningsanordning för integrerade kretsar

Publications (3)

Publication Number Publication Date
SE9604690D0 true SE9604690D0 (sv) 1996-12-19
SE9604690L SE9604690L (sv) 1998-06-20
SE511425C2 SE511425C2 (sv) 1999-09-27

Family

ID=20405056

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604690A SE511425C2 (sv) 1996-12-19 1996-12-19 Packningsanordning för integrerade kretsar

Country Status (10)

Country Link
US (1) US6014313A (sv)
EP (1) EP0951735A1 (sv)
JP (1) JP2001506417A (sv)
KR (1) KR20000069624A (sv)
CN (1) CN1139120C (sv)
AU (1) AU5506098A (sv)
CA (1) CA2275506A1 (sv)
SE (1) SE511425C2 (sv)
TW (1) TW462098B (sv)
WO (1) WO1998027587A1 (sv)

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Also Published As

Publication number Publication date
AU5506098A (en) 1998-07-15
JP2001506417A (ja) 2001-05-15
TW462098B (en) 2001-11-01
SE511425C2 (sv) 1999-09-27
KR20000069624A (ko) 2000-11-25
EP0951735A1 (en) 1999-10-27
CA2275506A1 (en) 1998-06-25
US6014313A (en) 2000-01-11
CN1139120C (zh) 2004-02-18
WO1998027587A1 (en) 1998-06-25
SE9604690L (sv) 1998-06-20
CN1247634A (zh) 2000-03-15

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