SE515607C2 - Anordning och metod vid tillverkning av strukturer - Google Patents

Anordning och metod vid tillverkning av strukturer

Info

Publication number
SE515607C2
SE515607C2 SE9904517A SE9904517A SE515607C2 SE 515607 C2 SE515607 C2 SE 515607C2 SE 9904517 A SE9904517 A SE 9904517A SE 9904517 A SE9904517 A SE 9904517A SE 515607 C2 SE515607 C2 SE 515607C2
Authority
SE
Sweden
Prior art keywords
substrate
template
support plate
membrane
main part
Prior art date
Application number
SE9904517A
Other languages
English (en)
Swedish (sv)
Other versions
SE9904517L (sv
SE9904517D0 (sv
Inventor
Babak Heidari
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE9904517A priority Critical patent/SE515607C2/sv
Publication of SE9904517D0 publication Critical patent/SE9904517D0/xx
Priority to CNB008169896A priority patent/CN1260615C/zh
Priority to AT00983631T priority patent/ATE335223T1/de
Priority to EP00983631A priority patent/EP1244939B1/en
Priority to DE60029827T priority patent/DE60029827T2/de
Priority to PCT/SE2000/002417 priority patent/WO2001042858A1/en
Priority to US10/149,072 priority patent/US7195734B2/en
Priority to JP2001544087A priority patent/JP3862216B2/ja
Priority to AU20362/01A priority patent/AU2036201A/en
Publication of SE9904517L publication Critical patent/SE9904517L/xx
Publication of SE515607C2 publication Critical patent/SE515607C2/sv
Priority to HK03104958.9A priority patent/HK1052750B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/06—Lithographic printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Glass Compositions (AREA)
  • Combinations Of Printed Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SE9904517A 1999-12-10 1999-12-10 Anordning och metod vid tillverkning av strukturer SE515607C2 (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SE9904517A SE515607C2 (sv) 1999-12-10 1999-12-10 Anordning och metod vid tillverkning av strukturer
AU20362/01A AU2036201A (en) 1999-12-10 2000-12-04 Device and method in connection with the production of structures
DE60029827T DE60029827T2 (de) 1999-12-10 2000-12-04 Vorrichtung und verfahren in zusammenhang mit der herstellung von strukturen
AT00983631T ATE335223T1 (de) 1999-12-10 2000-12-04 Vorrichtung und verfahren in zusammenhang mit der herstellung von strukturen
EP00983631A EP1244939B1 (en) 1999-12-10 2000-12-04 Device and method in connection with the production of structures
CNB008169896A CN1260615C (zh) 1999-12-10 2000-12-04 用于纹理制作的装置与方法
PCT/SE2000/002417 WO2001042858A1 (en) 1999-12-10 2000-12-04 Device and method in connection with the production of structures
US10/149,072 US7195734B2 (en) 1999-12-10 2000-12-04 Device and method in connection with the production of structures
JP2001544087A JP3862216B2 (ja) 1999-12-10 2000-12-04 構造物の製造に関する装置および方法
HK03104958.9A HK1052750B (zh) 1999-12-10 2003-07-09 用於紋理製作的裝置與方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904517A SE515607C2 (sv) 1999-12-10 1999-12-10 Anordning och metod vid tillverkning av strukturer

Publications (3)

Publication Number Publication Date
SE9904517D0 SE9904517D0 (sv) 1999-12-10
SE9904517L SE9904517L (sv) 2001-06-11
SE515607C2 true SE515607C2 (sv) 2001-09-10

Family

ID=20418070

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904517A SE515607C2 (sv) 1999-12-10 1999-12-10 Anordning och metod vid tillverkning av strukturer

Country Status (10)

Country Link
US (1) US7195734B2 (zh)
EP (1) EP1244939B1 (zh)
JP (1) JP3862216B2 (zh)
CN (1) CN1260615C (zh)
AT (1) ATE335223T1 (zh)
AU (1) AU2036201A (zh)
DE (1) DE60029827T2 (zh)
HK (1) HK1052750B (zh)
SE (1) SE515607C2 (zh)
WO (1) WO2001042858A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041228B2 (en) 2000-04-18 2006-05-09 Obducat Aktiebolag Substrate for and a process in connection with the product of structures

Families Citing this family (153)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US7635262B2 (en) 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7322287B2 (en) * 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
US20080213418A1 (en) * 2000-07-18 2008-09-04 Hua Tan Align-transfer-imprint system for imprint lithogrphy
JP2004523906A (ja) * 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート
SE523309E (sv) 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
CA2380114C (en) 2002-04-04 2010-01-19 Obducat Aktiebolag Imprint method and device
WO2003090985A1 (en) * 2002-04-24 2003-11-06 Obducat Ab Device and method for transferring a pattern to a substrate
WO2003104898A1 (en) * 2002-06-07 2003-12-18 Obducat Ab Method for transferring a pattern
US7252492B2 (en) 2002-06-20 2007-08-07 Obducat Ab Devices and methods for aligning a stamp and a substrate
WO2004006019A1 (en) * 2002-07-08 2004-01-15 Obducat Ab A method and a stamp for transferring a pattern to a substrate
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
AU2003251262A1 (en) 2002-08-27 2004-03-19 Obducat Ab Device for transferring a pattern to an object
US6939120B1 (en) 2002-09-12 2005-09-06 Komag, Inc. Disk alignment apparatus and method for patterned media production
DE60311846T2 (de) * 2002-10-03 2007-10-18 Koninklijke Philips Electronics N.V. Speichersystem mit einem elektromagnetischen array
TW570290U (en) 2003-05-02 2004-01-01 Ind Tech Res Inst Uniform pressing device for nanometer transfer-print
TW568349U (en) 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
EP1533657B1 (en) * 2003-11-21 2011-03-09 Obducat AB Multilayer nano imprint lithography
JP2005153091A (ja) * 2003-11-27 2005-06-16 Hitachi Ltd 転写方法及び転写装置
JP2005153113A (ja) * 2003-11-28 2005-06-16 Ricoh Opt Ind Co Ltd ナノプリントを用いた微細３次元構造体の製造方法及び微細３次元構造体
KR100974144B1 (ko) * 2003-12-05 2010-08-04 오브듀캇 아베 대면적 리소그래피용 장치 및 방법
EP1538482B1 (en) * 2003-12-05 2016-02-17 Obducat AB Device and method for large area lithography
EP1696471A1 (en) * 2003-12-11 2006-08-30 Tokyo University of Agriculture and Technology TLO Co., Ltd. Pattern-forming process utilizing nanoimprint and apparatus for performing such process
US7686606B2 (en) 2004-01-20 2010-03-30 Wd Media, Inc. Imprint embossing alignment system
KR100558754B1 (ko) * 2004-02-24 2006-03-10 한국기계연구원 Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
WO2005093737A1 (ja) * 2004-03-29 2005-10-06 Pioneer Corporation パターン転写装置及びパターン転写方法
CN101427182B (zh) * 2004-04-27 2011-10-19 伊利诺伊大学评议会 用于软光刻法的复合构图设备
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
TWI243796B (en) * 2004-06-08 2005-11-21 Ind Tech Res Inst Device of nano-structure imprint for pattern transfer and method of the same
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
CN1716091B (zh) * 2004-07-02 2010-04-28 财团法人工业技术研究院 一种微纳米结构图案的转印装置及方法
US20060027036A1 (en) * 2004-08-05 2006-02-09 Biggs Todd L Methods and apparatuses for imprinting substrates
US20060177634A1 (en) 2004-09-01 2006-08-10 John Lazar Activator means for pre-applied adhesives
US7641468B2 (en) 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
CN100395121C (zh) * 2004-11-19 2008-06-18 鸿富锦精密工业（深圳）有限公司 热压印方法
JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) * 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
EP1854617A4 (en) * 2005-02-25 2011-07-06 Sumitomo Electric Industries METHOD FOR MACHINING A MICROSTRUCTURE AND SYSTEM FOR MACHINING A MICROSTRUCTURE
US7523701B2 (en) 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
CN1831644B (zh) * 2005-03-07 2010-12-22 财团法人工业技术研究院 微纳米转印装置
KR100729427B1 (ko) 2005-03-07 2007-06-15 주식회사 디엠에스 미세패턴 형성장치
US7762186B2 (en) * 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
TWI271777B (en) 2005-04-27 2007-01-21 Ind Tech Res Inst Uniform pressing micro-nano transfer printing apparatus
KR100717971B1 (ko) 2005-04-29 2007-05-14 주식회사 에이디피엔지니어링 패턴 임프린트 장치
US7442029B2 (en) 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
JP4596981B2 (ja) * 2005-05-24 2010-12-15 株式会社日立ハイテクノロジーズ インプリント装置、及び微細構造転写方法
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
GB2426486A (en) * 2005-05-27 2006-11-29 Microsaic Systems Ltd Self-aligning micro-contact print engine
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
JP3958344B2 (ja) 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
US7927089B2 (en) * 2005-06-08 2011-04-19 Canon Kabushiki Kaisha Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
US7854873B2 (en) 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
KR101229100B1 (ko) 2005-06-10 2013-02-15 오브듀캇 아베 중간 스탬프를 갖는 패턴 복제
KR100903097B1 (ko) * 2005-06-13 2009-06-15 한국기계연구원 균일압으로 패턴 성형이 가능한 임프린팅장치
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
US20070035717A1 (en) * 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
EP1764648B1 (de) * 2005-09-14 2012-05-23 Thallner, Erich, Dipl.-Ing. Stempel mit einer Nanostempelstruktur sowie Vorrichtung und Verfahren zu dessen Herstellung
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7906058B2 (en) * 2005-12-01 2011-03-15 Molecular Imprints, Inc. Bifurcated contact printing technique
US7670529B2 (en) 2005-12-08 2010-03-02 Molecular Imprints, Inc. Method and system for double-sided patterning of substrates
ATE549294T1 (de) * 2005-12-09 2012-03-15 Obducat Ab Vorrichtung und verfahren zum transfer von mustern mit zwischenstempel
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
JP4832895B2 (ja) * 2005-12-28 2011-12-07 東芝機械株式会社 転写装置
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure
US7377765B2 (en) * 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
JP2007250685A (ja) * 2006-03-14 2007-09-27 Engineering System Kk ナノインプリント装置の型押し機構
US20070231422A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. System to vary dimensions of a thin template
EP2001602B1 (en) * 2006-04-03 2011-06-22 Molecular Imprints, Inc. Lithography imprinting system
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
JP4830171B2 (ja) * 2006-05-15 2011-12-07 学校法人早稲田大学 モールド支持構造
US20070284779A1 (en) * 2006-06-13 2007-12-13 Wei Wu Imprint lithography apparatus and methods
KR101358255B1 (ko) * 2006-06-27 2014-02-05 엘지디스플레이 주식회사 광경화 타입 소수성 몰드 및 그 제조방법
US8015939B2 (en) * 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
EP1884830A1 (en) * 2006-08-04 2008-02-06 Sony Deutschland GmbH A method of applying a material on a substrate
US7830498B2 (en) * 2006-10-10 2010-11-09 Hewlett-Packard Development Company, L.P. Hydraulic-facilitated contact lithography apparatus, system and method
US8025829B2 (en) * 2006-11-28 2011-09-27 Nanonex Corporation Die imprint by double side force-balanced press for step-and-repeat imprint lithography
JP2008198273A (ja) 2007-02-09 2008-08-28 Fujifilm Corp 転写方法、転写装置、及び記録媒体
JP4478164B2 (ja) * 2007-03-12 2010-06-09 株式会社日立ハイテクノロジーズ 微細構造転写装置、スタンパおよび微細構造の製造方法
DE102007019268B4 (de) * 2007-04-24 2015-10-22 Erich Thallner Vorrichtung zum Bedrucken und/oder Prägen von Substraten
JP5041214B2 (ja) * 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8033808B2 (en) * 2007-08-24 2011-10-11 Delta Pt, Llc Pressure compensating molding system
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
CN101380824B (zh) * 2007-09-07 2010-09-29 洪荣崇 用于微结构转印的均压装置
JP4578517B2 (ja) * 2007-12-26 2010-11-10 Ｓｃｉｖａｘ株式会社 インプリント装置およびインプリント方法
TWI342862B (en) 2008-01-31 2011-06-01 Univ Nat Taiwan Method of micro/nano imprinting
JP5018565B2 (ja) * 2008-03-06 2012-09-05 ブラザー工業株式会社 マイクロコンタクトプリント方法及びマイクロコンタクトプリント装置
DE102008030981A1 (de) 2008-06-27 2009-12-31 BAM Bundesanstalt für Materialforschung und -prüfung Hydraulische Positionierungseinheit
TWI342270B (en) * 2008-07-15 2011-05-21 Univ Nat Taiwan Specific-light-cured and pressure-differential embossing apparatus
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
WO2010059781A1 (en) 2008-11-19 2010-05-27 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
JP5244566B2 (ja) * 2008-12-02 2013-07-24 株式会社東芝 テンプレート洗浄方法、洗浄システム、及び洗浄装置
JP4907638B2 (ja) * 2008-12-08 2012-04-04 榮 崇 洪 マイクロナノインプリント工程において使用される均等プレス装置
EP2199854B1 (en) * 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
EP2199855B1 (en) * 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
EP2236271A1 (en) * 2009-03-30 2010-10-06 Eurocopter Deutschland GmbH Method and mould tool for producing a component made of fibre-reinforced plastic
JP4944158B2 (ja) * 2009-06-01 2012-05-30 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
US8261660B2 (en) * 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
JP5540628B2 (ja) * 2009-09-28 2014-07-02 大日本印刷株式会社 ナノインプリントパターン形成方法
US9330685B1 (en) 2009-11-06 2016-05-03 WD Media, LLC Press system for nano-imprinting of recording media with a two step pressing method
US8496466B1 (en) 2009-11-06 2013-07-30 WD Media, LLC Press system with interleaved embossing foil holders for nano-imprinting of recording media
US8402638B1 (en) 2009-11-06 2013-03-26 Wd Media, Inc. Press system with embossing foil free to expand for nano-imprinting of recording media
KR100974822B1 (ko) * 2009-12-15 2010-08-09 주식회사 광성테크 멜라민시이트 성형용 니켈박판의 가압방법 및 그 장치
US8747092B2 (en) 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
WO2011135532A2 (en) 2010-04-28 2011-11-03 Kimberly-Clark Worldwide, Inc. Composite microneedle array including nanostructures thereon
CN102241136B (zh) * 2010-05-12 2014-12-10 鸿富锦精密工业（深圳）有限公司 纳米压印装置及纳米压印方法
TWI363689B (en) * 2010-05-24 2012-05-11 Chenming Mold Ind Corp Apparatus and system of uniform pressure for shaping
CN102285112B (zh) * 2010-06-18 2014-06-04 晟铭电子科技股份有限公司 一种均压成型装置及系统
JP5677667B2 (ja) * 2010-07-27 2015-02-25 株式会社日立ハイテクノロジーズ インプリント装置及びインプリント転写方法
CN102442143B (zh) * 2010-10-11 2015-03-18 晟铭电子科技股份有限公司 均压成型方法及其系统
CN102441988B (zh) * 2010-10-14 2015-09-09 晟铭电子科技股份有限公司 多层式均压成型模具及其均压成型方法
FR2960177A1 (fr) * 2010-10-15 2011-11-25 Commissariat Energie Atomique Dispositif de nanoimpression et systeme de mesure dynamique d'ecoulement en lithographie par nanoimpression comportant un tel dispositif
US8449285B2 (en) * 2011-01-21 2013-05-28 Hepregen Corporation Systems and methods for micro-contact stamping
WO2012147958A1 (ja) * 2011-04-28 2012-11-01 Ｓｃｉｖａｘ株式会社 流体圧インプリント装置および加圧装置
KR20140033159A (ko) * 2011-06-02 2014-03-17 에스씨아이브이에이엑스 가부시키가이샤 유압 임프린트 장치 및 임프린트 방법
WO2013035759A1 (ja) * 2011-09-06 2013-03-14 Ｓｃｉｖａｘ株式会社 剛体ステージを備えた流体圧インプリント装置及び加圧ステージ
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
TWI447023B (zh) * 2011-10-11 2014-08-01 Chenming Mold Ind Corp 熱壓成型裝置及其熱壓成型方法
US11110066B2 (en) 2011-10-27 2021-09-07 Sorrento Therapeutics, Inc. Implantable devices for delivery of bioactive agents
KR20130123760A (ko) 2012-05-03 2013-11-13 삼성전자주식회사 탬플릿 시스템 및 그 나노 임프린트 방법
FR2990384B1 (fr) * 2012-05-14 2015-05-15 Saint Gobain Procede de texturation sur un substrat de grande surface
WO2014000024A1 (en) * 2012-06-26 2014-01-03 University Of South Australia Apparatus for fabricating microstructured devices
US10105883B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation Imprint lithography system and method for manufacturing
WO2014145826A2 (en) 2013-03-15 2014-09-18 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
ES2638783T3 (es) * 2013-07-15 2017-10-24 Flint Group Germany Gmbh Proceso para la fabricación de formas de impresión flexográfica
CN104425656B (zh) * 2013-09-03 2018-01-19 和椿科技股份有限公司 压印装置与压印方式
JP6318907B2 (ja) * 2014-06-24 2018-05-09 大日本印刷株式会社 研磨方法及び研磨装置
FR3029455A1 (fr) 2014-12-04 2016-06-10 Commissariat Energie Atomique Procede de fabrication d'un composant comportant un empilement d'une couche fonctionnelle sur un film composite
FR3029433B1 (fr) 2014-12-04 2017-01-13 Commissariat Energie Atomique Procede de transfert d'au moins une partie d'un film composite sur une membrane souple en polymere
CN105773790B (zh) * 2014-12-25 2017-11-17 辽宁爱尔创生物材料有限公司 纳米陶瓷坯体成型装置
CN108957945B (zh) * 2017-05-18 2021-07-20 苏州光舵微纳科技股份有限公司 纳米压印软膜板生产机构
CN107839366A (zh) * 2017-10-31 2018-03-27 四川南格尔生物科技有限公司 一种膜袋印刷方法及装置
KR102098867B1 (ko) * 2018-09-12 2020-04-09 (주)아이테드 임프린팅 장치 및 임프린팅 방법
CN112571367B (zh) * 2019-09-30 2022-07-01 盟立自动化股份有限公司 贴合设备及其中介机构、及贴合方法
US11731413B2 (en) 2019-09-30 2023-08-22 Mirle Automation Corporation Attaching device and intermediate mechanism thereof, and attaching method
JP2023528143A (ja) 2020-04-03 2023-07-04 アストラヴェウス 原材料をエンボス加工するための成形装置および方法
CN111679554B (zh) * 2020-06-03 2021-04-27 璞璘科技(杭州)有限公司 一种双腔式匀压纳米压印机构、纳米压印设备及方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2637147B2 (ja) 1988-03-22 1997-08-06 株式会社東芝 光ディスクの貼り合せ方法及び光ディスク貼り合せ装置
FR2676386A1 (fr) * 1991-05-15 1992-11-20 Scient Tech Batimen Centre Procede et dispositif de fabrication de blocs de construction a partir d'un liant hydraulique tel que du platre, d'une charge inerte telle que du sable et d'eau.
FR2694906B1 (fr) * 1992-08-20 1994-09-23 Acb Presse pour le formage d'une pièce en matériau composite comportant des renforts fibreux dans une matrice en polymère.
EP0734819A3 (en) * 1992-09-16 1997-11-05 Mino Ganryo Kagaku Corporation Tile having a pattern and its manufacturing method
US5820769A (en) 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
JP3241983B2 (ja) * 1995-11-28 2001-12-25 株式会社精工技研 光ディスク基盤射出成形金型用スタンパプレート着脱装置
IT1294944B1 (it) * 1997-08-01 1999-04-23 Sacmi Metodo per formare piastrelle ceramiche di grandi dimensioni mediante stampi parzialmente isostatici, e dispositivo per attuare il metodo.
US5947027A (en) 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
CA2380114C (en) * 2002-04-04 2010-01-19 Obducat Aktiebolag Imprint method and device
TW570290U (en) * 2003-05-02 2004-01-01 Ind Tech Res Inst Uniform pressing device for nanometer transfer-print

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041228B2 (en) 2000-04-18 2006-05-09 Obducat Aktiebolag Substrate for and a process in connection with the product of structures

Also Published As

Publication number Publication date
WO2001042858A1 (en) 2001-06-14
DE60029827D1 (de) 2006-09-14
EP1244939B1 (en) 2006-08-02
HK1052750B (zh) 2006-09-22
DE60029827T2 (de) 2007-02-22
SE9904517L (sv) 2001-06-11
US20030159608A1 (en) 2003-08-28
SE9904517D0 (sv) 1999-12-10
JP2003516644A (ja) 2003-05-13
CN1260615C (zh) 2006-06-21
ATE335223T1 (de) 2006-08-15
JP3862216B2 (ja) 2006-12-27
AU2036201A (en) 2001-06-18
HK1052750A1 (en) 2003-09-26
CN1409832A (zh) 2003-04-09
EP1244939A1 (en) 2002-10-02
US7195734B2 (en) 2007-03-27

Similar Documents

Publication Publication Date Title
SE515607C2 (sv) Anordning och metod vid tillverkning av strukturer
KR101850156B1 (ko) 반도체 소자의 건식 전사 프린팅을 위한 강화 복합 스탬프
US20080229941A1 (en) Nano-imprinting apparatus and method
EP2001602B1 (en) Lithography imprinting system
CN101198903B (zh) 利用中间印模的图案复制
Martin et al. Submicrometer-scale patterning of ceramic thin films
EP1710624A2 (en) Methods of fabricating nano-scale and micro-scale mold for nano-imprint, and mold usage on nano-imprinting equipment
JP4546315B2 (ja) 微細加工用型の製造方法
EP1497102B1 (en) Device and method for transferring a pattern to a substrate
US20110024948A1 (en) Imprinting device and imprinting method
US8685306B2 (en) Molding apparatus and molding method
WO2007049530A1 (ja) 型保持具、加工対象物保持具、微細加工装置および型取付方法
JP2013074258A (ja) ナノインプリント方法およびそれに用いられるナノインプリント装置並びにパターン化基板の製造方法
CN100594137C (zh) 图案形成方法和图案形成装置
US20100081282A1 (en) Process for adjusting the size and shape of nanostructures
US20100009541A1 (en) Process for Adjusting the Size and Shape of Nanostructures
JPWO2006082867A1 (ja) ハイブリッド接離システム
JP2020088286A (ja) 成形装置、成形方法、および物品の製造方法
Rabarot et al. Thick SU-8 photolithography for BioMEMS
Kreindl et al. High accuracy UV-nanoimprint lithography step-and-repeat master stamp fabrication for wafer level camera application
JP2013062287A (ja) 型、それを用いたインプリント方法および物品の製造方法
US20230229076A1 (en) Method and device for producing micro- and/or nanostructures
Kiyohara et al. Diamond Nanopit Arrays Fabricated by Room-Temperature Nanoimprinting using Diamond Molds
US20080258036A1 (en) System for dimensional stability of elastomeric microdevices
Pabba Evaluation of processes in nanoimprint lithography

Legal Events

Date Code Title Description
NUG Patent has lapsed