JP5244566B2 - テンプレート洗浄方法、洗浄システム、及び洗浄装置 - Google Patents
テンプレート洗浄方法、洗浄システム、及び洗浄装置 Download PDFInfo
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- JP5244566B2 JP5244566B2 JP2008307215A JP2008307215A JP5244566B2 JP 5244566 B2 JP5244566 B2 JP 5244566B2 JP 2008307215 A JP2008307215 A JP 2008307215A JP 2008307215 A JP2008307215 A JP 2008307215A JP 5244566 B2 JP5244566 B2 JP 5244566B2
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- template
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
図1は、第1実施形態のテンプレート洗浄装置101の構成を示す側方断面図である。
図18は、第2実施形態の搬送アーム123の構成を示す上面図である。第2実施形態のテンプレート洗浄装置101は、第1実施形態のテンプレート洗浄装置101と同様、図1に示す構造を有する。一方、第1実施形態の搬送アーム123は、図6に示す構造を有するのに対し、第2実施形態の搬送アーム123は、図18に示す構成を有する。
102 異物検査装置
111 チャンバ
121 スピンチャック
122 ノズル
123 搬送アーム
131 ステージ
132 スピン軸
133 チャックピン
134 上下可動軸
135 突き上げボート
136 回転用モータ
137 上下駆動用モータ
141 アーム本体
142 支持部材
143 チャックピン
201 ウエハ
301 テンプレート
401 テンプレート洗浄システム
411 異物検査部
412 比較部
413 判断部
Claims (5)
- ナノインプリント用のテンプレートを洗浄するテンプレート洗浄方法であって、
チャンバ内に設けられたステージ上にウエハを設置し、
前記ステージ上に設置された前記ウエハを洗浄し、
前記ウエハの洗浄後に、前記チャンバ内が清浄であるかどうかを判断するために、前記ウエハ上の異物検査を行い、
前記異物検査の結果に基づいて前記チャンバ内が清浄であると判断された場合に、前記ステージ上に前記テンプレートを設置し、
前記ステージ上に設置された前記テンプレートを洗浄する、
ことを特徴とするテンプレート洗浄方法。 - 前記ウエハ及び前記テンプレートを洗浄する際には、前記ウエハ及び前記テンプレートを回転させ、前記ウエハ及び前記テンプレートの表面に薬液を供給することで、前記ウエハ及び前記テンプレートを洗浄し、
前記ウエハ及び前記テンプレートの前記洗浄では、前記ウエハ及び前記テンプレートを、同一の回転軸を中心に回転させる、
ことを特徴とする請求項1に記載のテンプレート洗浄方法。 - 前記テンプレートには、レジスト充填幅が50nm以下のパターンが形成されていることを特徴とする請求項1又は2に記載のテンプレート洗浄方法。
- ナノインプリント用のテンプレートを洗浄するテンプレート洗浄システムであって、
ウエハ及び前記テンプレートを収容して洗浄するためのチャンバと、
前記チャンバ内に設けられ、前記ウエハ及び前記テンプレートを設置可能なステージと、
前記ウエハ及び前記テンプレートを前記チャンバ内に搬送可能な搬送アームと、
前記チャンバ内が清浄であるかどうかを判断するために、前記チャンバ内で前記ウエハを洗浄した後に前記ウエハ上の異物検査を行うための異物検査装置とを備え、
前記異物検査の結果に基づいて前記チャンバ内が清浄であると判断された場合に、前記ステージ上に前記テンプレートを設置して洗浄する、ことを特徴とするテンプレート洗浄システム。 - ナノインプリント用のテンプレートを洗浄するテンプレート洗浄装置であって、
ウエハ及び前記テンプレートを収容して洗浄するためのチャンバと、
前記チャンバ内に設けられ、前記ウエハ及び前記テンプレートを設置可能なステージと、
前記ウエハ及び前記テンプレートを前記チャンバ内に搬送可能な搬送アームとを備え、
前記チャンバ内で前記ウエハを洗浄した後に行われた前記ウエハ上の異物検査の結果に基づいて、前記チャンバ内が清浄である判断された場合に、前記ステージ上に前記テンプレートを設置して洗浄する、ことを特徴とするテンプレート洗浄装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008307215A JP5244566B2 (ja) | 2008-12-02 | 2008-12-02 | テンプレート洗浄方法、洗浄システム、及び洗浄装置 |
US12/560,210 US8375964B2 (en) | 2008-12-02 | 2009-09-15 | Template cleaning method, system, and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008307215A JP5244566B2 (ja) | 2008-12-02 | 2008-12-02 | テンプレート洗浄方法、洗浄システム、及び洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010135368A JP2010135368A (ja) | 2010-06-17 |
JP5244566B2 true JP5244566B2 (ja) | 2013-07-24 |
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JP2008307215A Active JP5244566B2 (ja) | 2008-12-02 | 2008-12-02 | テンプレート洗浄方法、洗浄システム、及び洗浄装置 |
Country Status (2)
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US (1) | US8375964B2 (ja) |
JP (1) | JP5244566B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI524456B (zh) * | 2011-11-04 | 2016-03-01 | 東京威力科創股份有限公司 | 基板處理系統、基板運送方法、程式及電腦記憶媒體 |
TWI550686B (zh) * | 2011-11-04 | 2016-09-21 | 東京威力科創股份有限公司 | 基板處理系統、基板運送方法及電腦記憶媒體 |
JP5984424B2 (ja) * | 2012-02-27 | 2016-09-06 | 国立大学法人京都大学 | 基板洗浄方法、基板洗浄装置及び真空処理装置 |
KR101344921B1 (ko) * | 2012-03-28 | 2013-12-27 | 세메스 주식회사 | 기판처리장치 및 방법 |
JP2014120584A (ja) | 2012-12-14 | 2014-06-30 | Toshiba Corp | インプリント用マスクの洗浄方法 |
TWI729101B (zh) * | 2016-04-02 | 2021-06-01 | 美商應用材料股份有限公司 | 用於旋轉料架基座中的晶圓旋轉的設備及方法 |
JP6596396B2 (ja) | 2016-08-09 | 2019-10-23 | 東芝メモリ株式会社 | 基板の洗浄方法および洗浄装置 |
JP6971865B2 (ja) * | 2018-01-17 | 2021-11-24 | キオクシア株式会社 | 処理装置 |
JP7454385B2 (ja) * | 2020-01-23 | 2024-03-22 | 浜松ホトニクス株式会社 | ウェハ搬送ユニット及びウェハ搬送方法 |
CN114809626B (zh) * | 2022-03-25 | 2023-03-21 | 中南大学 | 一种建筑施工用建筑模板清理装置 |
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SE515607C2 (sv) * | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
US20030029479A1 (en) * | 2001-08-08 | 2003-02-13 | Dainippon Screen Mfg. Co, Ltd. | Substrate cleaning apparatus and method |
JP2003289058A (ja) * | 2002-03-28 | 2003-10-10 | Sumitomo Electric Ind Ltd | 化合物半導体ウエハの研磨方法および化合物半導体ウエハの研磨装置 |
JP2004241731A (ja) * | 2003-02-10 | 2004-08-26 | Sigma Meltec Ltd | 基板洗浄装置及び基板洗浄方法 |
JP3950985B2 (ja) * | 2003-05-07 | 2007-08-01 | レーザーテック株式会社 | 基板保持具及び該基板保持具を用いた基板反転装置、基板処理装置、並びに基板保持機構 |
JP2004334727A (ja) | 2003-05-12 | 2004-11-25 | Dainippon Printing Co Ltd | 販売促進システム |
JP2006120681A (ja) * | 2004-10-19 | 2006-05-11 | Tsukuba Semi Technology:Kk | 被処理体の洗浄処理装置と洗浄処理方法 |
JP2008193035A (ja) * | 2007-02-08 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 微細形状転写方法および微細形状転写装置 |
JP4810496B2 (ja) | 2007-04-25 | 2011-11-09 | 株式会社東芝 | パターン形成装置、パターン形成方法及びテンプレート |
KR20100108365A (ko) * | 2007-12-07 | 2010-10-06 | 폰타나 테크놀로지 | 웨이퍼를 세정하기 위한 방법 및 조성물 |
US8394203B2 (en) * | 2008-10-02 | 2013-03-12 | Molecular Imprints, Inc. | In-situ cleaning of an imprint lithography tool |
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2008
- 2008-12-02 JP JP2008307215A patent/JP5244566B2/ja active Active
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2009
- 2009-09-15 US US12/560,210 patent/US8375964B2/en active Active
Also Published As
Publication number | Publication date |
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US8375964B2 (en) | 2013-02-19 |
US20100132742A1 (en) | 2010-06-03 |
JP2010135368A (ja) | 2010-06-17 |
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