RU2575944C2 - Электронный компонент и электронное устройство - Google Patents

Электронный компонент и электронное устройство Download PDF

Info

Publication number
RU2575944C2
RU2575944C2 RU2014107542/28A RU2014107542A RU2575944C2 RU 2575944 C2 RU2575944 C2 RU 2575944C2 RU 2014107542/28 A RU2014107542/28 A RU 2014107542/28A RU 2014107542 A RU2014107542 A RU 2014107542A RU 2575944 C2 RU2575944 C2 RU 2575944C2
Authority
RU
Russia
Prior art keywords
electronic device
electronic component
component according
conductor
paragraphs
Prior art date
Application number
RU2014107542/28A
Other languages
English (en)
Russian (ru)
Other versions
RU2014107542A (ru
Inventor
Такамаса САКУРАГИ
Таканори СУДЗУКИ
Кодзи ЦУДУКИ
Original Assignee
Кэнон Кабусики Кайся
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Кэнон Кабусики Кайся filed Critical Кэнон Кабусики Кайся
Publication of RU2014107542A publication Critical patent/RU2014107542A/ru
Application granted granted Critical
Publication of RU2575944C2 publication Critical patent/RU2575944C2/ru

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0054—Casings specially adapted for display applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Hall/Mr Elements (AREA)
RU2014107542/28A 2013-02-28 2014-02-27 Электронный компонент и электронное устройство RU2575944C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013039448A JP5904957B2 (ja) 2013-02-28 2013-02-28 電子部品および電子機器。
JP2013-039448 2013-02-28

Publications (2)

Publication Number Publication Date
RU2014107542A RU2014107542A (ru) 2015-09-10
RU2575944C2 true RU2575944C2 (ru) 2016-02-27

Family

ID=50482506

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2014107542/28A RU2575944C2 (ru) 2013-02-28 2014-02-27 Электронный компонент и электронное устройство

Country Status (7)

Country Link
US (1) US9225882B2 (enExample)
JP (1) JP5904957B2 (enExample)
CN (1) CN104022131B (enExample)
BR (1) BR102014004628A2 (enExample)
DE (1) DE102014203427A1 (enExample)
GB (1) GB2512479B (enExample)
RU (1) RU2575944C2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP6111284B2 (ja) * 2015-04-28 2017-04-05 エムテックスマツムラ株式会社 中空パッケージの製造方法、固体撮像素子の製造方法、中空パッケージおよび固体撮像素子
US10154175B2 (en) * 2015-05-14 2018-12-11 Sony Corporation Circuit board, imaging device, and electronic apparatus
US10764478B2 (en) * 2015-10-28 2020-09-01 Kyocera Corporation Camera module includes a lens unit that is fixed to a holding member having an image sensor via an engaging member of cured resin and manufacturing method thereof
US20170290170A1 (en) * 2016-03-30 2017-10-05 Delphi Technologies, Inc. Method Of Making A Camera For Use On A Vehicle
FR3060851B1 (fr) * 2016-12-20 2018-12-07 3D Plus Module optoelectronique 3d d'imagerie
JP2018157074A (ja) * 2017-03-17 2018-10-04 キヤノン株式会社 電子部品、電子部品の製造方法及び電子機器
JP6745418B2 (ja) * 2018-01-29 2020-08-26 富士フイルム株式会社 撮像ユニット及び撮像装置
CN111748763A (zh) * 2019-03-26 2020-10-09 Oppo广东移动通信有限公司 增强不锈钢被磁铁吸附能力的方法、支撑装置及电子设备
US10832993B1 (en) * 2019-05-09 2020-11-10 Texas Instruments Incorporated Packaged multichip device with stacked die having a metal die attach
CN113315893B (zh) * 2021-05-17 2023-10-27 杭州海康威视数字技术股份有限公司 摄像机及视频设备
US20230028070A1 (en) * 2021-07-23 2023-01-26 Absolics Inc. Substrate comprising a lid structure, package substrate comprising the same and semiconductor device
JP7686542B2 (ja) * 2021-11-25 2025-06-02 Ｎｇｋエレクトロデバイス株式会社 パッケージ

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299094A (ja) * 1988-05-28 1989-12-01 Ibiden Co Ltd Ｉｃカード
FI117224B (fi) 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JPH11284163A (ja) 1998-03-31 1999-10-15 Sony Corp 固体撮像装置
JP2003101042A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
US6906396B2 (en) * 2002-01-15 2005-06-14 Micron Technology, Inc. Magnetic shield for integrated circuit packaging
JP2003282754A (ja) 2002-03-27 2003-10-03 Kyocera Corp 光デバイス収納用パッケージ
US20030231093A1 (en) * 2002-06-13 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic inductor structure with annular magnetic shielding layer
JP2004022955A (ja) 2002-06-19 2004-01-22 Kyocera Corp 赤外線センサ素子収納用パッケージおよび赤外線センサ装置
JP2004031815A (ja) 2002-06-27 2004-01-29 Kyocera Corp 蓋体およびこれを用いた光デバイス収納用パッケージ
JP4073821B2 (ja) * 2003-05-06 2008-04-09 セイコーインスツル株式会社 通信用デバイスパッケージおよびその製造方法
JP4418720B2 (ja) 2003-11-21 2010-02-24 キヤノン株式会社 放射線撮像装置及び方法、並びに放射線撮像システム
JP2005353911A (ja) * 2004-06-11 2005-12-22 Toshiba Corp 半導体装置
JP4578312B2 (ja) * 2005-04-27 2010-11-10 京セラ株式会社 電子部品収納容器
US7778039B2 (en) 2006-05-08 2010-08-17 Micron Technology, Inc. Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
US7795708B2 (en) * 2006-06-02 2010-09-14 Honeywell International Inc. Multilayer structures for magnetic shielding
JP2008245244A (ja) * 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP5392533B2 (ja) 2008-10-10 2014-01-22 ソニー株式会社 固体撮像素子、光学装置、信号処理装置及び信号処理システム
US20120086110A1 (en) * 2009-06-17 2012-04-12 Norio Masuda Ic package
JP5277105B2 (ja) * 2009-07-29 2013-08-28 富士フイルム株式会社 カメラモジュール
JP5570163B2 (ja) 2009-08-31 2014-08-13 キヤノン株式会社 固体撮像装置
JP5550380B2 (ja) 2010-02-25 2014-07-16 キヤノン株式会社 固体撮像装置及び撮像装置
JP5407936B2 (ja) * 2010-03-02 2014-02-05 日本電気株式会社 電磁ノイズ抑制体
KR101855294B1 (ko) * 2010-06-10 2018-05-08 삼성전자주식회사 반도체 패키지
KR20110135757A (ko) * 2010-06-11 2011-12-19 삼성전자주식회사 이미지 센서 칩 및 이를 포함하는 카메라 모듈
JP2012220419A (ja) * 2011-04-12 2012-11-12 Panasonic Corp 検知装置
JP2013222772A (ja) * 2012-04-13 2013-10-28 Sony Corp 撮像素子パッケージおよび撮像装置
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5574508B2 (ja) 2012-11-27 2014-08-20 マルホン工業株式会社 パチンコ遊技機

Also Published As

Publication number Publication date
DE102014203427A1 (de) 2014-08-28
GB2512479A (en) 2014-10-01
JP2014167991A (ja) 2014-09-11
CN104022131A (zh) 2014-09-03
JP5904957B2 (ja) 2016-04-20
GB2512479B (en) 2015-11-04
US9225882B2 (en) 2015-12-29
BR102014004628A2 (pt) 2015-10-20
CN104022131B (zh) 2017-04-12
US20140240588A1 (en) 2014-08-28
GB201402986D0 (en) 2014-04-09
RU2014107542A (ru) 2015-09-10

Similar Documents

Publication Publication Date Title
RU2575944C2 (ru) Электронный компонент и электронное устройство
CN103378013B (zh) 电子部件和电子装置
CN103378118B (zh) 电子元器件、安装部件、电子装置和它们的制造方法
US9220172B2 (en) Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
KR101386267B1 (ko) 고체 촬상 장치
US9585287B2 (en) Electronic component, electronic apparatus, and method for manufacturing the electronic component
CN209858825U (zh) 光学元件驱动机构
CN100517698C (zh) 图像感应装置、图像传感器模组及制备方法
CN102237387A (zh) 具有图像传感器封装件的图像传感器模块
CN108391451B (zh) 图像拾取元件封装件及其制造方法、图像拾取装置
JP2004242166A (ja) 光モジュール及びその製造方法並びに電子機器
JP6067262B2 (ja) 半導体装置およびその製造方法、ならびにカメラ
US9576877B2 (en) Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component
JP7406314B2 (ja) 電子モジュール及び機器
CN110290293B (zh) 感光模块
JP2024074533A (ja) 電子部品および機器
JP2024046422A (ja) 電子部品およびその製造方法