JP5904957B2 - 電子部品および電子機器。 - Google Patents

電子部品および電子機器。 Download PDF

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Publication number
JP5904957B2
JP5904957B2 JP2013039448A JP2013039448A JP5904957B2 JP 5904957 B2 JP5904957 B2 JP 5904957B2 JP 2013039448 A JP2013039448 A JP 2013039448A JP 2013039448 A JP2013039448 A JP 2013039448A JP 5904957 B2 JP5904957 B2 JP 5904957B2
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JP
Japan
Prior art keywords
electronic device
electronic component
conductor
reference plane
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013039448A
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English (en)
Japanese (ja)
Other versions
JP2014167991A (ja
JP2014167991A5 (enExample
Inventor
孝正 桜木
孝正 桜木
幸司 都築
幸司 都築
隆典 鈴木
隆典 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013039448A priority Critical patent/JP5904957B2/ja
Priority to GB1402986.2A priority patent/GB2512479B/en
Priority to US14/189,854 priority patent/US9225882B2/en
Priority to BR102014004628A priority patent/BR102014004628A2/pt
Priority to DE102014203427.2A priority patent/DE102014203427A1/de
Priority to RU2014107542/28A priority patent/RU2575944C2/ru
Priority to CN201410072283.0A priority patent/CN104022131B/zh
Publication of JP2014167991A publication Critical patent/JP2014167991A/ja
Publication of JP2014167991A5 publication Critical patent/JP2014167991A5/ja
Application granted granted Critical
Publication of JP5904957B2 publication Critical patent/JP5904957B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0054—Casings specially adapted for display applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Hall/Mr Elements (AREA)
JP2013039448A 2013-02-28 2013-02-28 電子部品および電子機器。 Expired - Fee Related JP5904957B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013039448A JP5904957B2 (ja) 2013-02-28 2013-02-28 電子部品および電子機器。
GB1402986.2A GB2512479B (en) 2013-02-28 2014-02-20 Electronic component and electronic apparatus
US14/189,854 US9225882B2 (en) 2013-02-28 2014-02-25 Electronic component packaging that can suppress noise and electronic apparatus
DE102014203427.2A DE102014203427A1 (de) 2013-02-28 2014-02-26 Elektronisches Bauteil und elektronische Vorrichtung
BR102014004628A BR102014004628A2 (pt) 2013-02-28 2014-02-26 componente eletrônico e aparelho eletrônico
RU2014107542/28A RU2575944C2 (ru) 2013-02-28 2014-02-27 Электронный компонент и электронное устройство
CN201410072283.0A CN104022131B (zh) 2013-02-28 2014-02-28 电子组件和电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013039448A JP5904957B2 (ja) 2013-02-28 2013-02-28 電子部品および電子機器。

Publications (3)

Publication Number Publication Date
JP2014167991A JP2014167991A (ja) 2014-09-11
JP2014167991A5 JP2014167991A5 (enExample) 2015-02-19
JP5904957B2 true JP5904957B2 (ja) 2016-04-20

Family

ID=50482506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013039448A Expired - Fee Related JP5904957B2 (ja) 2013-02-28 2013-02-28 電子部品および電子機器。

Country Status (7)

Country Link
US (1) US9225882B2 (enExample)
JP (1) JP5904957B2 (enExample)
CN (1) CN104022131B (enExample)
BR (1) BR102014004628A2 (enExample)
DE (1) DE102014203427A1 (enExample)
GB (1) GB2512479B (enExample)
RU (1) RU2575944C2 (enExample)

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* Cited by examiner, † Cited by third party
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JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP6111284B2 (ja) * 2015-04-28 2017-04-05 エムテックスマツムラ株式会社 中空パッケージの製造方法、固体撮像素子の製造方法、中空パッケージおよび固体撮像素子
US10154175B2 (en) * 2015-05-14 2018-12-11 Sony Corporation Circuit board, imaging device, and electronic apparatus
US10764478B2 (en) * 2015-10-28 2020-09-01 Kyocera Corporation Camera module includes a lens unit that is fixed to a holding member having an image sensor via an engaging member of cured resin and manufacturing method thereof
US20170290170A1 (en) * 2016-03-30 2017-10-05 Delphi Technologies, Inc. Method Of Making A Camera For Use On A Vehicle
FR3060851B1 (fr) * 2016-12-20 2018-12-07 3D Plus Module optoelectronique 3d d'imagerie
JP2018157074A (ja) * 2017-03-17 2018-10-04 キヤノン株式会社 電子部品、電子部品の製造方法及び電子機器
JP6745418B2 (ja) * 2018-01-29 2020-08-26 富士フイルム株式会社 撮像ユニット及び撮像装置
CN111748763A (zh) * 2019-03-26 2020-10-09 Oppo广东移动通信有限公司 增强不锈钢被磁铁吸附能力的方法、支撑装置及电子设备
US10832993B1 (en) * 2019-05-09 2020-11-10 Texas Instruments Incorporated Packaged multichip device with stacked die having a metal die attach
CN113315893B (zh) * 2021-05-17 2023-10-27 杭州海康威视数字技术股份有限公司 摄像机及视频设备
US20230028070A1 (en) * 2021-07-23 2023-01-26 Absolics Inc. Substrate comprising a lid structure, package substrate comprising the same and semiconductor device
JP7686542B2 (ja) * 2021-11-25 2025-06-02 Ｎｇｋエレクトロデバイス株式会社 パッケージ

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JPH01299094A (ja) * 1988-05-28 1989-12-01 Ibiden Co Ltd Ｉｃカード
FI117224B (fi) 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JPH11284163A (ja) 1998-03-31 1999-10-15 Sony Corp 固体撮像装置
JP2003101042A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
US6906396B2 (en) * 2002-01-15 2005-06-14 Micron Technology, Inc. Magnetic shield for integrated circuit packaging
JP2003282754A (ja) 2002-03-27 2003-10-03 Kyocera Corp 光デバイス収納用パッケージ
US20030231093A1 (en) * 2002-06-13 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic inductor structure with annular magnetic shielding layer
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JP2004031815A (ja) 2002-06-27 2004-01-29 Kyocera Corp 蓋体およびこれを用いた光デバイス収納用パッケージ
JP4073821B2 (ja) * 2003-05-06 2008-04-09 セイコーインスツル株式会社 通信用デバイスパッケージおよびその製造方法
JP4418720B2 (ja) 2003-11-21 2010-02-24 キヤノン株式会社 放射線撮像装置及び方法、並びに放射線撮像システム
JP2005353911A (ja) * 2004-06-11 2005-12-22 Toshiba Corp 半導体装置
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JP5550380B2 (ja) 2010-02-25 2014-07-16 キヤノン株式会社 固体撮像装置及び撮像装置
JP5407936B2 (ja) * 2010-03-02 2014-02-05 日本電気株式会社 電磁ノイズ抑制体
KR101855294B1 (ko) * 2010-06-10 2018-05-08 삼성전자주식회사 반도체 패키지
KR20110135757A (ko) * 2010-06-11 2011-12-19 삼성전자주식회사 이미지 센서 칩 및 이를 포함하는 카메라 모듈
JP2012220419A (ja) * 2011-04-12 2012-11-12 Panasonic Corp 検知装置
JP2013222772A (ja) * 2012-04-13 2013-10-28 Sony Corp 撮像素子パッケージおよび撮像装置
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5574508B2 (ja) 2012-11-27 2014-08-20 マルホン工業株式会社 パチンコ遊技機

Also Published As

Publication number Publication date
DE102014203427A1 (de) 2014-08-28
GB2512479A (en) 2014-10-01
JP2014167991A (ja) 2014-09-11
CN104022131A (zh) 2014-09-03
GB2512479B (en) 2015-11-04
US9225882B2 (en) 2015-12-29
BR102014004628A2 (pt) 2015-10-20
CN104022131B (zh) 2017-04-12
US20140240588A1 (en) 2014-08-28
RU2575944C2 (ru) 2016-02-27
GB201402986D0 (en) 2014-04-09
RU2014107542A (ru) 2015-09-10

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