JP5904957B2 - 電子部品および電子機器。 - Google Patents

電子部品および電子機器。 Download PDF

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Publication number
JP5904957B2
JP5904957B2 JP2013039448A JP2013039448A JP5904957B2 JP 5904957 B2 JP5904957 B2 JP 5904957B2 JP 2013039448 A JP2013039448 A JP 2013039448A JP 2013039448 A JP2013039448 A JP 2013039448A JP 5904957 B2 JP5904957 B2 JP 5904957B2
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Japan
Prior art keywords
electronic device
electronic component
conductor
reference plane
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013039448A
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English (en)
Japanese (ja)
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JP2014167991A (ja
JP2014167991A5 (enExample
Inventor
孝正 桜木
孝正 桜木
幸司 都築
幸司 都築
隆典 鈴木
隆典 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013039448A priority Critical patent/JP5904957B2/ja
Priority to GB1402986.2A priority patent/GB2512479B/en
Priority to US14/189,854 priority patent/US9225882B2/en
Priority to DE102014203427.2A priority patent/DE102014203427A1/de
Priority to BR102014004628A priority patent/BR102014004628A2/pt
Priority to RU2014107542/28A priority patent/RU2575944C2/ru
Priority to CN201410072283.0A priority patent/CN104022131B/zh
Publication of JP2014167991A publication Critical patent/JP2014167991A/ja
Publication of JP2014167991A5 publication Critical patent/JP2014167991A5/ja
Application granted granted Critical
Publication of JP5904957B2 publication Critical patent/JP5904957B2/ja
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
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    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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    • H01L23/585Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
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    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Hall/Mr Elements (AREA)
JP2013039448A 2013-02-28 2013-02-28 電子部品および電子機器。 Expired - Fee Related JP5904957B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013039448A JP5904957B2 (ja) 2013-02-28 2013-02-28 電子部品および電子機器。
GB1402986.2A GB2512479B (en) 2013-02-28 2014-02-20 Electronic component and electronic apparatus
US14/189,854 US9225882B2 (en) 2013-02-28 2014-02-25 Electronic component packaging that can suppress noise and electronic apparatus
BR102014004628A BR102014004628A2 (pt) 2013-02-28 2014-02-26 componente eletrônico e aparelho eletrônico
DE102014203427.2A DE102014203427A1 (de) 2013-02-28 2014-02-26 Elektronisches Bauteil und elektronische Vorrichtung
RU2014107542/28A RU2575944C2 (ru) 2013-02-28 2014-02-27 Электронный компонент и электронное устройство
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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP6111284B2 (ja) * 2015-04-28 2017-04-05 エムテックスマツムラ株式会社 中空パッケージの製造方法、固体撮像素子の製造方法、中空パッケージおよび固体撮像素子
JP6711351B2 (ja) * 2015-05-14 2020-06-17 ソニー株式会社 回路基板、撮像素子、並びに電子機器
US10764478B2 (en) * 2015-10-28 2020-09-01 Kyocera Corporation Camera module includes a lens unit that is fixed to a holding member having an image sensor via an engaging member of cured resin and manufacturing method thereof
US20170290170A1 (en) * 2016-03-30 2017-10-05 Delphi Technologies, Inc. Method Of Making A Camera For Use On A Vehicle
FR3060851B1 (fr) * 2016-12-20 2018-12-07 3D Plus Module optoelectronique 3d d'imagerie
JP2018157074A (ja) * 2017-03-17 2018-10-04 キヤノン株式会社 電子部品、電子部品の製造方法及び電子機器
WO2019146492A1 (ja) * 2018-01-29 2019-08-01 富士フイルム株式会社 撮像ユニット及び撮像装置
CN111748763A (zh) * 2019-03-26 2020-10-09 Oppo广东移动通信有限公司 增强不锈钢被磁铁吸附能力的方法、支撑装置及电子设备
US10832993B1 (en) * 2019-05-09 2020-11-10 Texas Instruments Incorporated Packaged multichip device with stacked die having a metal die attach
CN113315893B (zh) * 2021-05-17 2023-10-27 杭州海康威视数字技术股份有限公司 摄像机及视频设备
US20230028070A1 (en) * 2021-07-23 2023-01-26 Absolics Inc. Substrate comprising a lid structure, package substrate comprising the same and semiconductor device
JP7686542B2 (ja) * 2021-11-25 2025-06-02 Ngkエレクトロデバイス株式会社 パッケージ

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299094A (ja) * 1988-05-28 1989-12-01 Ibiden Co Ltd Icカード
FI117224B (fi) 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
JPH11284163A (ja) 1998-03-31 1999-10-15 Sony Corp 固体撮像装置
JP2003101042A (ja) * 2001-09-25 2003-04-04 Kyocera Corp 光半導体素子収納用容器
US6906396B2 (en) * 2002-01-15 2005-06-14 Micron Technology, Inc. Magnetic shield for integrated circuit packaging
JP2003282754A (ja) 2002-03-27 2003-10-03 Kyocera Corp 光デバイス収納用パッケージ
US20030231093A1 (en) * 2002-06-13 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic inductor structure with annular magnetic shielding layer
JP2004022955A (ja) 2002-06-19 2004-01-22 Kyocera Corp 赤外線センサ素子収納用パッケージおよび赤外線センサ装置
JP2004031815A (ja) 2002-06-27 2004-01-29 Kyocera Corp 蓋体およびこれを用いた光デバイス収納用パッケージ
JP4073821B2 (ja) * 2003-05-06 2008-04-09 セイコーインスツル株式会社 通信用デバイスパッケージおよびその製造方法
JP4418720B2 (ja) 2003-11-21 2010-02-24 キヤノン株式会社 放射線撮像装置及び方法、並びに放射線撮像システム
JP2005353911A (ja) * 2004-06-11 2005-12-22 Toshiba Corp 半導体装置
JP4578312B2 (ja) * 2005-04-27 2010-11-10 京セラ株式会社 電子部品収納容器
US7778039B2 (en) 2006-05-08 2010-08-17 Micron Technology, Inc. Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
US7795708B2 (en) * 2006-06-02 2010-09-14 Honeywell International Inc. Multilayer structures for magnetic shielding
JP2008245244A (ja) 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP5392533B2 (ja) 2008-10-10 2014-01-22 ソニー株式会社 固体撮像素子、光学装置、信号処理装置及び信号処理システム
JP5408253B2 (ja) * 2009-06-17 2014-02-05 日本電気株式会社 Icパッケージ
JP5277105B2 (ja) * 2009-07-29 2013-08-28 富士フイルム株式会社 カメラモジュール
JP5570163B2 (ja) 2009-08-31 2014-08-13 キヤノン株式会社 固体撮像装置
JP5550380B2 (ja) * 2010-02-25 2014-07-16 キヤノン株式会社 固体撮像装置及び撮像装置
JP5407936B2 (ja) * 2010-03-02 2014-02-05 日本電気株式会社 電磁ノイズ抑制体
KR101855294B1 (ko) * 2010-06-10 2018-05-08 삼성전자주식회사 반도체 패키지
KR20110135757A (ko) * 2010-06-11 2011-12-19 삼성전자주식회사 이미지 센서 칩 및 이를 포함하는 카메라 모듈
JP2012220419A (ja) * 2011-04-12 2012-11-12 Panasonic Corp 検知装置
JP2013222772A (ja) * 2012-04-13 2013-10-28 Sony Corp 撮像素子パッケージおよび撮像装置
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5574508B2 (ja) 2012-11-27 2014-08-20 マルホン工業株式会社 パチンコ遊技機

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RU2014107542A (ru) 2015-09-10
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