RU2332523C2 - Устройство вакуумного осаждения и способ получения пленки вакуумным осаждением - Google Patents

Устройство вакуумного осаждения и способ получения пленки вакуумным осаждением Download PDF

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Publication number
RU2332523C2
RU2332523C2 RU2005120006/02A RU2005120006A RU2332523C2 RU 2332523 C2 RU2332523 C2 RU 2332523C2 RU 2005120006/02 A RU2005120006/02 A RU 2005120006/02A RU 2005120006 A RU2005120006 A RU 2005120006A RU 2332523 C2 RU2332523 C2 RU 2332523C2
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RU
Russia
Prior art keywords
roller
vacuum
film
coating
vacuum deposition
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RU2005120006/02A
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English (en)
Russian (ru)
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RU2005120006A (ru
Inventor
Нобору САСАКИ (JP)
Нобору САСАКИ
Хироси СУЗУКИ (JP)
Хироси Сузуки
Фумитаке КОИЗУМИ (JP)
Фумитаке КОИЗУМИ
Нобухико ИМАЙ (JP)
Нобухико ИМАЙ
Кунимаса АРАЙ (JP)
Кунимаса АРАЙ
Хироюки КОНАГАЙ (JP)
Хироюки КОНАГАЙ
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Топпан Принтинг Ко., Лтд.
Эпплайд Матириэлс Гмбх Унд Ко.Кг
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Publication of RU2005120006A publication Critical patent/RU2005120006A/ru
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
RU2005120006/02A 2002-12-26 2003-12-26 Устройство вакуумного осаждения и способ получения пленки вакуумным осаждением RU2332523C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-376933 2002-12-26
JP2002376933 2002-12-26

Publications (2)

Publication Number Publication Date
RU2005120006A RU2005120006A (ru) 2006-02-10
RU2332523C2 true RU2332523C2 (ru) 2008-08-27

Family

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RU2005120006/02A RU2332523C2 (ru) 2002-12-26 2003-12-26 Устройство вакуумного осаждения и способ получения пленки вакуумным осаждением

Country Status (9)

Country Link
US (1) US7754015B2 (cg-RX-API-DMAC7.html)
EP (1) EP1593754B1 (cg-RX-API-DMAC7.html)
JP (1) JP4529688B2 (cg-RX-API-DMAC7.html)
KR (1) KR101045515B1 (cg-RX-API-DMAC7.html)
CN (1) CN100582295C (cg-RX-API-DMAC7.html)
AU (1) AU2003292634A1 (cg-RX-API-DMAC7.html)
IN (1) IN266855B (cg-RX-API-DMAC7.html)
RU (1) RU2332523C2 (cg-RX-API-DMAC7.html)
WO (1) WO2004059032A1 (cg-RX-API-DMAC7.html)

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JP5291875B2 (ja) * 2006-11-01 2013-09-18 富士フイルム株式会社 プラズマ装置
US8202368B2 (en) 2008-04-15 2012-06-19 Yakima Products, Inc. Apparatus and methods for manufacturing thin-film solar cells
US7945344B2 (en) 2008-06-20 2011-05-17 SAKT13, Inc. Computational method for design and manufacture of electrochemical systems
US9249502B2 (en) * 2008-06-20 2016-02-02 Sakti3, Inc. Method for high volume manufacture of electrochemical cells using physical vapor deposition
US20100196591A1 (en) * 2009-02-05 2010-08-05 Applied Materials, Inc. Modular pvd system for flex pv
US8357464B2 (en) 2011-04-01 2013-01-22 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
DE102009060413A1 (de) * 2009-09-07 2011-03-24 Von Ardenne Anlagentechnik Gmbh Vorrichtung zum Transport bandförmigen Materials
EP2292339A1 (en) * 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Coating method and coating apparatus
US8637117B2 (en) 2009-10-14 2014-01-28 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system
WO2011082179A1 (en) * 2009-12-28 2011-07-07 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
EP2596146B1 (en) 2010-07-23 2017-02-22 Lotus Applied Technology, LLC Substrate transport mechanism contacting a single side of a flexible web substrate for roll-to-roll thin film deposition
CN102021529A (zh) * 2010-12-01 2011-04-20 常州常松金属复合材料有限公司 一种真空镀翻转辊道装置
US9065080B2 (en) 2011-04-01 2015-06-23 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
JP2012219322A (ja) * 2011-04-07 2012-11-12 Ulvac Japan Ltd 巻取式成膜装置及び巻取式成膜方法
JP5930791B2 (ja) 2011-04-28 2016-06-08 日東電工株式会社 真空成膜方法、及び該方法によって得られる積層体
US9127344B2 (en) 2011-11-08 2015-09-08 Sakti3, Inc. Thermal evaporation process for manufacture of solid state battery devices
JP6474546B2 (ja) * 2011-12-28 2019-02-27 大日本印刷株式会社 プラズマを使った前処理装置を有した蒸着装置
JP5794151B2 (ja) * 2012-01-19 2015-10-14 住友金属鉱山株式会社 長尺帯状体の搬送制御方法と長尺帯状体の表面処理方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
US9627717B1 (en) 2012-10-16 2017-04-18 Sakti3, Inc. Embedded solid-state battery
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KR101697609B1 (ko) * 2013-10-24 2017-01-19 주식회사 석원 무장력 상태에서의 진공 코팅 필름 건조 장치
US9627709B2 (en) 2014-10-15 2017-04-18 Sakti3, Inc. Amorphous cathode material for battery device
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CN105986235B (zh) * 2016-06-27 2018-09-07 广东腾胜真空技术工程有限公司 多功能卷绕镀膜设备及方法
JP6772663B2 (ja) * 2016-08-23 2020-10-21 住友金属鉱山株式会社 ロールツーロール方式による長尺基材の処理装置及びこれを用いた成膜装置
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Also Published As

Publication number Publication date
AU2003292634A1 (en) 2004-07-22
EP1593754B1 (en) 2018-05-23
JP4529688B2 (ja) 2010-08-25
CN1732284A (zh) 2006-02-08
KR101045515B1 (ko) 2011-06-30
EP1593754A4 (en) 2011-03-23
CN100582295C (zh) 2010-01-20
US20050249875A1 (en) 2005-11-10
IN266855B (cg-RX-API-DMAC7.html) 2015-06-09
US7754015B2 (en) 2010-07-13
WO2004059032A1 (ja) 2004-07-15
JPWO2004059032A1 (ja) 2006-04-27
RU2005120006A (ru) 2006-02-10
EP1593754A1 (en) 2005-11-09
KR20050092724A (ko) 2005-09-22

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