CN100582295C - 真空蒸镀装置及蒸镀薄膜制造方法 - Google Patents

真空蒸镀装置及蒸镀薄膜制造方法 Download PDF

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Publication number
CN100582295C
CN100582295C CN200380107480A CN200380107480A CN100582295C CN 100582295 C CN100582295 C CN 100582295C CN 200380107480 A CN200380107480 A CN 200380107480A CN 200380107480 A CN200380107480 A CN 200380107480A CN 100582295 C CN100582295 C CN 100582295C
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CN
China
Prior art keywords
film
roller
coating
take
roll
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Expired - Lifetime
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CN200380107480A
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English (en)
Chinese (zh)
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CN1732284A (zh
Inventor
佐佐木昇
铃木浩
小泉文刚
今井伸彦
新井邦正
小长井裕之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials GmbH and Co KG
Toppan Inc
Original Assignee
Applied Films GmbH and Co KG
Toppan Printing Co Ltd
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Publication of CN1732284A publication Critical patent/CN1732284A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
CN200380107480A 2002-12-26 2003-12-26 真空蒸镀装置及蒸镀薄膜制造方法 Expired - Lifetime CN100582295C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002376933 2002-12-26
JP376933/2002 2002-12-26

Publications (2)

Publication Number Publication Date
CN1732284A CN1732284A (zh) 2006-02-08
CN100582295C true CN100582295C (zh) 2010-01-20

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CN200380107480A Expired - Lifetime CN100582295C (zh) 2002-12-26 2003-12-26 真空蒸镀装置及蒸镀薄膜制造方法

Country Status (9)

Country Link
US (1) US7754015B2 (cg-RX-API-DMAC7.html)
EP (1) EP1593754B1 (cg-RX-API-DMAC7.html)
JP (1) JP4529688B2 (cg-RX-API-DMAC7.html)
KR (1) KR101045515B1 (cg-RX-API-DMAC7.html)
CN (1) CN100582295C (cg-RX-API-DMAC7.html)
AU (1) AU2003292634A1 (cg-RX-API-DMAC7.html)
IN (1) IN266855B (cg-RX-API-DMAC7.html)
RU (1) RU2332523C2 (cg-RX-API-DMAC7.html)
WO (1) WO2004059032A1 (cg-RX-API-DMAC7.html)

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JP2007527553A (ja) * 2004-03-01 2007-09-27 アプライド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング・ウント・コンパニー・コマンディートゲゼルシャフト ファブリ・ペローフィルタを備えた基板およびフィルタを基板に被着するための方法
ES2361661T3 (es) 2006-03-26 2011-06-21 Lotus Applied Technology, Llc Dispositivo y procedimiento de deposición de capas atómicas y método de revestimiento de substratos flexibles.
JP5291875B2 (ja) * 2006-11-01 2013-09-18 富士フイルム株式会社 プラズマ装置
US8202368B2 (en) 2008-04-15 2012-06-19 Yakima Products, Inc. Apparatus and methods for manufacturing thin-film solar cells
US7945344B2 (en) 2008-06-20 2011-05-17 SAKT13, Inc. Computational method for design and manufacture of electrochemical systems
US9249502B2 (en) * 2008-06-20 2016-02-02 Sakti3, Inc. Method for high volume manufacture of electrochemical cells using physical vapor deposition
US20100196591A1 (en) * 2009-02-05 2010-08-05 Applied Materials, Inc. Modular pvd system for flex pv
US8357464B2 (en) 2011-04-01 2013-01-22 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
DE102009060413A1 (de) * 2009-09-07 2011-03-24 Von Ardenne Anlagentechnik Gmbh Vorrichtung zum Transport bandförmigen Materials
EP2292339A1 (en) * 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Coating method and coating apparatus
US8637117B2 (en) 2009-10-14 2014-01-28 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system
WO2011082179A1 (en) * 2009-12-28 2011-07-07 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
EP2596146B1 (en) 2010-07-23 2017-02-22 Lotus Applied Technology, LLC Substrate transport mechanism contacting a single side of a flexible web substrate for roll-to-roll thin film deposition
CN102021529A (zh) * 2010-12-01 2011-04-20 常州常松金属复合材料有限公司 一种真空镀翻转辊道装置
US9065080B2 (en) 2011-04-01 2015-06-23 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
JP2012219322A (ja) * 2011-04-07 2012-11-12 Ulvac Japan Ltd 巻取式成膜装置及び巻取式成膜方法
JP5930791B2 (ja) 2011-04-28 2016-06-08 日東電工株式会社 真空成膜方法、及び該方法によって得られる積層体
US9127344B2 (en) 2011-11-08 2015-09-08 Sakti3, Inc. Thermal evaporation process for manufacture of solid state battery devices
JP6474546B2 (ja) * 2011-12-28 2019-02-27 大日本印刷株式会社 プラズマを使った前処理装置を有した蒸着装置
JP5794151B2 (ja) * 2012-01-19 2015-10-14 住友金属鉱山株式会社 長尺帯状体の搬送制御方法と長尺帯状体の表面処理方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
US9627717B1 (en) 2012-10-16 2017-04-18 Sakti3, Inc. Embedded solid-state battery
US9435028B2 (en) 2013-05-06 2016-09-06 Lotus Applied Technology, Llc Plasma generation for thin film deposition on flexible substrates
KR101697609B1 (ko) * 2013-10-24 2017-01-19 주식회사 석원 무장력 상태에서의 진공 코팅 필름 건조 장치
US9627709B2 (en) 2014-10-15 2017-04-18 Sakti3, Inc. Amorphous cathode material for battery device
US9508976B2 (en) 2015-01-09 2016-11-29 Applied Materials, Inc. Battery separator with dielectric coating
CN105986235B (zh) * 2016-06-27 2018-09-07 广东腾胜真空技术工程有限公司 多功能卷绕镀膜设备及方法
JP6772663B2 (ja) * 2016-08-23 2020-10-21 住友金属鉱山株式会社 ロールツーロール方式による長尺基材の処理装置及びこれを用いた成膜装置
WO2018149510A1 (en) * 2017-02-20 2018-08-23 Applied Materials, Inc. Deposition apparatus for coating a flexible substrate and method of coating a flexible substrate
JP7414709B2 (ja) 2017-08-17 2024-01-16 アプライド マテリアルズ インコーポレイテッド オレフィンセパレータを含まないｌｉイオンバッテリ
EP3841631A4 (en) 2018-08-21 2022-03-30 Applied Materials, Inc. ULTRA-THIN CERAMIC COATING ON A BATTERY SEPARATOR
WO2020183777A1 (ja) * 2019-03-12 2020-09-17 株式会社アルバック 真空蒸着装置
JP6681524B1 (ja) 2019-03-12 2020-04-15 株式会社アルバック 真空蒸着装置
DE102019135296A1 (de) * 2019-07-18 2021-01-21 Tdk Electronics Ag Metallisierte Folie, Vorrichtung für die Herstellung einer metallisierten Folie, Verfahren zur Herstellung einer metallisierten Folie und Folienkondensator, der die metallisierte Folie enthält
KR102422431B1 (ko) * 2021-07-07 2022-07-19 주식회사 서일 마찰대전수단을 구비한 진공증착장치
CN113684464B (zh) * 2021-08-27 2023-06-02 辽宁分子流科技有限公司 一种用于石墨烯复合薄膜制备的卷绕式设备

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CN2232924Y (zh) * 1995-09-04 1996-08-14 青州市包装装璜材料厂 一种真空镀膜机收卷装置
JPH09176855A (ja) 1995-12-22 1997-07-08 Fuji Electric Corp Res & Dev Ltd 薄膜形成装置
US5951835A (en) * 1996-03-18 1999-09-14 Matsushita Electric Industrial Co., Ltd. Continuous vacuum processing apparatus

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Also Published As

Publication number Publication date
RU2332523C2 (ru) 2008-08-27
AU2003292634A1 (en) 2004-07-22
EP1593754B1 (en) 2018-05-23
JP4529688B2 (ja) 2010-08-25
CN1732284A (zh) 2006-02-08
KR101045515B1 (ko) 2011-06-30
EP1593754A4 (en) 2011-03-23
US20050249875A1 (en) 2005-11-10
IN266855B (cg-RX-API-DMAC7.html) 2015-06-09
US7754015B2 (en) 2010-07-13
WO2004059032A1 (ja) 2004-07-15
JPWO2004059032A1 (ja) 2006-04-27
RU2005120006A (ru) 2006-02-10
EP1593754A1 (en) 2005-11-09
KR20050092724A (ko) 2005-09-22

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Address after: Tokyo, Japan

Co-patentee after: Applied Materials GmbH & Co.KG

Patentee after: TOPPAN PRINTING Co.,Ltd.

Address before: Tokyo, Japan

Co-patentee before: APPLIED FILMS GmbH & Co.KG

Patentee before: TOPPAN PRINTING Co.,Ltd.

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Granted publication date: 20100120