RU2296820C2 - Способ и электрод для определения и репликации шаблонов в проводящих материалах - Google Patents

Способ и электрод для определения и репликации шаблонов в проводящих материалах Download PDF

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Publication number
RU2296820C2
RU2296820C2 RU2003136088/02A RU2003136088A RU2296820C2 RU 2296820 C2 RU2296820 C2 RU 2296820C2 RU 2003136088/02 A RU2003136088/02 A RU 2003136088/02A RU 2003136088 A RU2003136088 A RU 2003136088A RU 2296820 C2 RU2296820 C2 RU 2296820C2
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RU
Russia
Prior art keywords
electrode
master electrode
substrate
etching
master
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RU2003136088/02A
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English (en)
Russian (ru)
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RU2003136088A (ru
Inventor
Патрик МЕЛЛЕР (SE)
Патрик МЕЛЛЕР
Микаэль ФРЕДЕНБЕРГ (SE)
Микаэль ФРЕДЕНБЕРГ
Петер ВИВЕН-НИЛЬССОН (SE)
Петер ВИВЕН-НИЛЬССОН
Original Assignee
Реплизаурус Текнолоджиз Аб
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Application filed by Реплизаурус Текнолоджиз Аб filed Critical Реплизаурус Текнолоджиз Аб
Publication of RU2003136088A publication Critical patent/RU2003136088A/ru
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Methods (AREA)
  • ing And Chemical Polishing (AREA)
RU2003136088/02A 2001-06-15 2002-06-17 Способ и электрод для определения и репликации шаблонов в проводящих материалах RU2296820C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102144-3 2001-06-15
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt

Publications (2)

Publication Number Publication Date
RU2003136088A RU2003136088A (ru) 2005-05-10
RU2296820C2 true RU2296820C2 (ru) 2007-04-10

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2003136088/02A RU2296820C2 (ru) 2001-06-15 2002-06-17 Способ и электрод для определения и репликации шаблонов в проводящих материалах

Country Status (12)

Country Link
US (4) US7790009B2 (https=)
EP (2) EP1404899B1 (https=)
JP (2) JP4546078B2 (https=)
KR (1) KR101250685B1 (https=)
CN (1) CN1294296C (https=)
CA (1) CA2462098C (https=)
DK (1) DK1404899T3 (https=)
ES (2) ES2645700T3 (https=)
PT (1) PT1404899E (https=)
RU (1) RU2296820C2 (https=)
SE (1) SE523309E (https=)
WO (1) WO2002103085A1 (https=)

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RU2463642C2 (ru) * 2008-06-27 2012-10-10 Уорлдвижин Ко., Лтд. Емкостной сенсорный датчик, интегрированный с панелью окна, и способ его изготовления
RU2463121C2 (ru) * 2010-08-31 2012-10-10 Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) Способ изготовления электрически изолированной металлической ленты и линия для его осуществления
RU2481422C2 (ru) * 2007-12-31 2013-05-10 Ниварокс-Фар С.А. Способ изготовления биметаллической микроструктуры
RU2497747C2 (ru) * 2011-04-05 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) Способ получения металлических реплик конической формы на основе полимерных шаблонов
RU2528522C2 (ru) * 2009-06-12 2014-09-20 Ниварокс-Фар С.А. Способ изготовления металлической микроструктуры и микроструктура, полученная указанным способом
RU2529592C2 (ru) * 2012-11-19 2014-09-27 Общество с Ограниченной Ответственностью "Фабрика новых материалов" Способ электрохимической рентгеновской бесконтактной литографии

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US7790009B2 (en) 2010-09-07
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US20070151858A1 (en) 2007-07-05
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US20040154828A1 (en) 2004-08-12
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