RU2296820C2 - Способ и электрод для определения и репликации шаблонов в проводящих материалах - Google Patents

Способ и электрод для определения и репликации шаблонов в проводящих материалах Download PDF

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Publication number
RU2296820C2
RU2296820C2 RU2003136088/02A RU2003136088A RU2296820C2 RU 2296820 C2 RU2296820 C2 RU 2296820C2 RU 2003136088/02 A RU2003136088/02 A RU 2003136088/02A RU 2003136088 A RU2003136088 A RU 2003136088A RU 2296820 C2 RU2296820 C2 RU 2296820C2
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RU
Russia
Prior art keywords
electrode
master electrode
substrate
etching
master
Prior art date
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RU2003136088/02A
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English (en)
Russian (ru)
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RU2003136088A (ru
Inventor
Патрик МЕЛЛЕР (SE)
Патрик МЕЛЛЕР
Микаэль ФРЕДЕНБЕРГ (SE)
Микаэль ФРЕДЕНБЕРГ
Петер ВИВЕН-НИЛЬССОН (SE)
Петер ВИВЕН-НИЛЬССОН
Original Assignee
Реплизаурус Текнолоджиз Аб
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Application filed by Реплизаурус Текнолоджиз Аб filed Critical Реплизаурус Текнолоджиз Аб
Publication of RU2003136088A publication Critical patent/RU2003136088A/ru
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Printing Methods (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
RU2003136088/02A 2001-06-15 2002-06-17 Способ и электрод для определения и репликации шаблонов в проводящих материалах RU2296820C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
SE0102144-3 2001-06-15

Publications (2)

Publication Number Publication Date
RU2003136088A RU2003136088A (ru) 2005-05-10
RU2296820C2 true RU2296820C2 (ru) 2007-04-10

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2003136088/02A RU2296820C2 (ru) 2001-06-15 2002-06-17 Способ и электрод для определения и репликации шаблонов в проводящих материалах

Country Status (12)

Country Link
US (4) US7790009B2 (https=)
EP (2) EP1404899B1 (https=)
JP (2) JP4546078B2 (https=)
KR (1) KR101250685B1 (https=)
CN (1) CN1294296C (https=)
CA (1) CA2462098C (https=)
DK (1) DK1404899T3 (https=)
ES (2) ES2645700T3 (https=)
PT (1) PT1404899E (https=)
RU (1) RU2296820C2 (https=)
SE (1) SE523309E (https=)
WO (1) WO2002103085A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2463121C2 (ru) * 2010-08-31 2012-10-10 Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) Способ изготовления электрически изолированной металлической ленты и линия для его осуществления
RU2463642C2 (ru) * 2008-06-27 2012-10-10 Уорлдвижин Ко., Лтд. Емкостной сенсорный датчик, интегрированный с панелью окна, и способ его изготовления
RU2481422C2 (ru) * 2007-12-31 2013-05-10 Ниварокс-Фар С.А. Способ изготовления биметаллической микроструктуры
RU2497747C2 (ru) * 2011-04-05 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) Способ получения металлических реплик конической формы на основе полимерных шаблонов
RU2528522C2 (ru) * 2009-06-12 2014-09-20 Ниварокс-Фар С.А. Способ изготовления металлической микроструктуры и микроструктура, полученная указанным способом
RU2529592C2 (ru) * 2012-11-19 2014-09-27 Общество с Ограниченной Ответственностью "Фабрика новых материалов" Способ электрохимической рентгеновской бесконтактной литографии

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
WO2003080502A1 (en) * 2002-03-25 2003-10-02 Matvice Ehf. A method and apparatus for processing nanoscopic structures
US8294025B2 (en) 2002-06-08 2012-10-23 Solarity, Llc Lateral collection photovoltaics
JP4892684B2 (ja) * 2004-01-12 2012-03-07 ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア ナノスケール電気リソグラフィー法
GB0416600D0 (en) 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices
GB0416952D0 (en) * 2004-07-30 2004-09-01 Renishaw Plc Scale making method
ATE472749T1 (de) * 2004-09-08 2010-07-15 Nil Technology Aps Flexibler nano-druckstempel
FR2885913B1 (fr) * 2005-05-18 2007-08-10 Centre Nat Rech Scient Element composite comprenant un substrat conducteur et un revetement metallique nanostructure.
KR101147087B1 (ko) * 2005-06-28 2012-05-17 엘지디스플레이 주식회사 평판표시소자의 제조방법
WO2007058605A1 (en) * 2005-11-18 2007-05-24 Replisaurus Technologies Ab Master electrode and method of forming it
CN101496167A (zh) 2005-11-22 2009-07-29 肖克科技有限公司 用于过电压保护的包括电压可变换材料的半导体器件
FR2898138B1 (fr) 2006-03-03 2008-05-16 Commissariat Energie Atomique Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre.
EP1835339B1 (fr) * 2006-03-15 2012-05-16 Rolex S.A. Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue
DE102006013362A1 (de) * 2006-03-16 2007-09-27 Siemens Ag Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
JP2010521058A (ja) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
JP4694519B2 (ja) * 2007-02-28 2011-06-08 富士通株式会社 マイクロ構造体およびマイクロ構造体製造方法
CN100545648C (zh) * 2007-05-15 2009-09-30 中国科学院长春应用化学研究所 一种微盘电极或微盘阵列电极的制备方法
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US9157141B2 (en) * 2007-08-24 2015-10-13 Schlumberger Technology Corporation Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
EP2166125A1 (en) * 2008-09-19 2010-03-24 ALSTOM Technology Ltd Method for the restoration of a metallic coating
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
EP2342722A2 (en) 2008-09-30 2011-07-13 Shocking Technologies Inc Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
WO2010054677A1 (en) * 2008-11-14 2010-05-20 Replisaurus Technologies Inc. A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP4768848B2 (ja) * 2009-12-07 2011-09-07 株式会社東芝 電鋳用原盤及びその製造方法
USD642277S1 (en) 2009-12-23 2011-07-26 Christopher John Farrell Oral appliance
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
WO2012007523A1 (en) 2010-07-15 2012-01-19 Replisaurus Group Sas Leveling of master electrode and substrate in ecpr, and a chuck therefor
EP2593592B1 (en) 2010-07-15 2018-05-16 Luxembourg Institute of Science and Technology (LIST) Separation of master electrode and substrate in ecpr
ES2590130T3 (es) 2010-07-15 2016-11-18 Luxembourg Institute Of Science And Technology (List) Método para lavar y/o secar una cámara de replicación electroquímica de modelos (ECPR), y mandriles y conjuntos de mandril correspondientes
ES2651004T3 (es) 2010-07-15 2018-01-23 Luxembourg Institute Of Science And Technology (List) Un soporte, y un procedimiento para juntar un primer y segundo sustrato
ES2592708T3 (es) 2010-07-15 2016-12-01 Luxembourg Institute Of Science And Technology (List) Una hoja de contactos para la disposición entre una pinza de sujeción y un electrodo maestro en un proceso ECPR
EP2593587B1 (en) 2010-07-15 2016-09-07 Luxembourg Institute of Science and Technology (LIST) Filling of a printing chamber and a chuck therefore
EP2593590B1 (en) 2010-07-15 2017-10-04 Luxembourg Institute of Science and Technology (LIST) System for automated handling of masters and substrate
WO2012007526A2 (en) 2010-07-15 2012-01-19 Replisaurus Group Sas Device, system and method for use in machines for electrochemical pattern replication
AT510593B1 (de) * 2010-12-15 2012-05-15 Markus Dipl Ing Dr Hacksteiner Vorrichtung zum metallisieren von wafern
EP2655698B1 (en) 2010-12-23 2019-05-15 Luxembourg Institute of Science and Technology Master electrode for ecpr and manufacturing methods thereof
EP2655701B1 (en) 2010-12-23 2018-08-29 Luxembourg Institute of Science and Technology (LIST) A method for providing an ecpr master electrode and an ecpr master electrode
EP2655699B1 (en) 2010-12-23 2019-06-26 Luxembourg Institute of Science and Technology (LIST) An ecpr master electrode, and a method for providing such master electrode
WO2012084047A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas An ecpr master electrode and a method for providing such ecpr master electrode
WO2012140262A1 (en) * 2011-04-15 2012-10-18 Cortec Gmbh Neural electrode and method for fabricating the same
EP2533271B1 (en) 2011-06-07 2014-05-21 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
EP2533272B1 (en) 2011-06-07 2014-03-12 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
ES2624739T3 (es) 2011-06-07 2017-07-17 Luxembourg Institute Of Science And Technology (List) Electrodo maestro ECPR y un procedimiento para proporcionar dicho electrodo maestro
AU349029S (en) 2012-08-31 2013-06-06 Orthodontic appliance
JP6107799B2 (ja) * 2014-12-03 2017-04-05 トヨタ自動車株式会社 表面処理方法および表面処理装置
USD767146S1 (en) 2015-02-09 2016-09-20 Christopher John Farrell Orthodontic appliance
USD799049S1 (en) 2015-11-09 2017-10-03 Myosa Pty Ltd Oral appliance
US10465307B2 (en) 2015-11-19 2019-11-05 Fabric8Labs, Inc. Apparatus for electrochemical additive manufacturing
AU201710942S (en) 2017-02-16 2017-10-06 Orthodontic appliance
FR3072690B1 (fr) * 2017-10-24 2021-07-30 Centre Techn Ind Mecanique Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur
LU100919B1 (en) 2018-08-27 2020-02-27 Luxembourg Inst Science & Tech List Metal-CNT composite, production method and materials therefor
KR102210785B1 (ko) * 2019-02-07 2021-02-02 경북대학교 산학합력단 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체
US12139810B2 (en) * 2020-06-15 2024-11-12 Arizona Board Of Regents On Behalf Of Arizona State University Localized electrochemical deposition

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2306082A (en) * 1940-04-27 1942-12-22 Clarence O Prest Method for line or design reproduction by electrolysis
US3190822A (en) * 1961-01-09 1965-06-22 Burnham John Process for electrolytically etching valve metal surfaces
US3240685A (en) * 1962-02-23 1966-03-15 Ibm Method and device for selective anodization
GB1098182A (en) 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
CA791112A (en) * 1964-06-30 1968-07-30 International Business Machines Corporation Catalytically active palladium coatings
US3582477A (en) * 1969-02-20 1971-06-01 Paul Gelb Selective electroplating method
JPS5456619U (https=) * 1977-09-28 1979-04-19
JPS5456619A (en) 1977-10-13 1979-05-07 Tokyo Yogyo Kk Spray repairing material for blast furnace tapping spout
GB1600667A (en) 1978-05-26 1981-10-21 Pryor Edward & Son Electrolytic marking of metal articles
US4279709A (en) * 1979-05-08 1981-07-21 The Dow Chemical Company Preparation of porous electrodes
US4734174A (en) * 1986-12-17 1988-03-29 Polaroid Corporation Electrochemical formation of thin-film electrodes
JPH01234590A (ja) * 1988-03-16 1989-09-19 Toshiba Eng Co Ltd 部分メッキ装置
US4932518A (en) * 1988-08-23 1990-06-12 Shipley Company Inc. Method and apparatus for determining throwing power of an electroplating solution
US5294504A (en) * 1988-08-30 1994-03-15 Osaka Gas Company, Ltd. Three-dimensional microstructure as a substrate for a battery electrode
JPH04236800A (ja) * 1991-01-16 1992-08-25 Fujitsu Ltd 電解エッチング方法
US5196109A (en) * 1991-08-01 1993-03-23 Geoffrey Scott Trivalent chromium electrolytes and plating processes employing same
JPH0593300A (ja) * 1991-09-30 1993-04-16 Riyouichi Aogaki 電解エツチング方法
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
JPH06299390A (ja) * 1993-04-13 1994-10-25 Seiko Instr Inc 微細加工方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JPH10501373A (ja) * 1994-06-09 1998-02-03 レイケム・コーポレイション 電気デバイス
DK172937B1 (da) * 1995-06-21 1999-10-11 Peter Torben Tang Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer
KR0147996B1 (ko) * 1995-06-30 1998-10-15 배순훈 박막 헤드의 패턴 평탄화 방법
KR100217006B1 (ko) * 1995-10-17 1999-09-01 미따라이 하지메 에칭 방법, 이 에칭 방법을 사용한 반도체 소자의 제조 방법 및 이 에칭 방법의 실시에 적합한 장치
JPH103233A (ja) * 1996-04-15 1998-01-06 Fuji Xerox Co Ltd 画像形成方法、画像形成媒体、被転写媒体及び画像形成装置
WO1998000877A1 (en) 1996-07-02 1998-01-08 Wilson Greatbatch Ltd. Preparation and use of thin flexible cathodes in alkali metal electrochemical cells
JP3269827B2 (ja) * 1997-04-04 2002-04-02 ユニバーシティ・オブ・サザン・カリフォルニア 電気化学製造のための物品、方法、および装置
FR2773652B1 (fr) * 1998-01-14 2002-10-11 Sgs Thomson Microelectronics Circuit de generation d'un signal d'activation commande
WO1999045179A1 (en) 1998-03-05 1999-09-10 Obducat Ab Method of etching
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
DE19935558B4 (de) * 1999-07-30 2010-11-25 Nawotec Gmbh Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich
JP3441058B2 (ja) * 1999-12-03 2003-08-25 理化学研究所 キャピラリーゲル電気泳動用マイクロチップおよびその製造方法
SE515607C2 (sv) 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
KR100500684B1 (ko) * 1999-12-29 2005-07-12 비오이 하이디스 테크놀로지 주식회사 ４-마스크 공정을 이용한 액정 디스플레이의 제조 방법
KR20010105994A (ko) * 2000-05-20 2001-11-29 구자홍 디스크 드라이버의 트레이

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RU2481422C2 (ru) * 2007-12-31 2013-05-10 Ниварокс-Фар С.А. Способ изготовления биметаллической микроструктуры
RU2463642C2 (ru) * 2008-06-27 2012-10-10 Уорлдвижин Ко., Лтд. Емкостной сенсорный датчик, интегрированный с панелью окна, и способ его изготовления
RU2528522C2 (ru) * 2009-06-12 2014-09-20 Ниварокс-Фар С.А. Способ изготовления металлической микроструктуры и микроструктура, полученная указанным способом
RU2463121C2 (ru) * 2010-08-31 2012-10-10 Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) Способ изготовления электрически изолированной металлической ленты и линия для его осуществления
RU2497747C2 (ru) * 2011-04-05 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) Способ получения металлических реплик конической формы на основе полимерных шаблонов
RU2529592C2 (ru) * 2012-11-19 2014-09-27 Общество с Ограниченной Ответственностью "Фабрика новых материалов" Способ электрохимической рентгеновской бесконтактной литографии

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US20120228128A1 (en) 2012-09-13
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US20070151858A1 (en) 2007-07-05
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