CA2462098C - Method and electrode for defining and replicating structures in conducting materials - Google Patents

Method and electrode for defining and replicating structures in conducting materials Download PDF

Info

Publication number
CA2462098C
CA2462098C CA2462098A CA2462098A CA2462098C CA 2462098 C CA2462098 C CA 2462098C CA 2462098 A CA2462098 A CA 2462098A CA 2462098 A CA2462098 A CA 2462098A CA 2462098 C CA2462098 C CA 2462098C
Authority
CA
Canada
Prior art keywords
master electrode
electrode
substrate
layer
master
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2462098A
Other languages
English (en)
French (fr)
Other versions
CA2462098A1 (en
Inventor
Patrik Moeller
Mikael Fredenberg
Peter Wiwen-Nilsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luxembourg Institute of Science and Technology LIST
Original Assignee
Luxembourg Institute of Science and Technology LIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20284507&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2462098(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Luxembourg Institute of Science and Technology LIST filed Critical Luxembourg Institute of Science and Technology LIST
Publication of CA2462098A1 publication Critical patent/CA2462098A1/en
Application granted granted Critical
Publication of CA2462098C publication Critical patent/CA2462098C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Methods (AREA)
  • ing And Chemical Polishing (AREA)
CA2462098A 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials Expired - Lifetime CA2462098C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0102144-3 2001-06-15
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
PCT/SE2002/001179 WO2002103085A1 (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials

Publications (2)

Publication Number Publication Date
CA2462098A1 CA2462098A1 (en) 2002-12-27
CA2462098C true CA2462098C (en) 2014-01-14

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2462098A Expired - Lifetime CA2462098C (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials

Country Status (12)

Country Link
US (4) US7790009B2 (https=)
EP (2) EP1404899B1 (https=)
JP (2) JP4546078B2 (https=)
KR (1) KR101250685B1 (https=)
CN (1) CN1294296C (https=)
CA (1) CA2462098C (https=)
DK (1) DK1404899T3 (https=)
ES (2) ES2645700T3 (https=)
PT (1) PT1404899E (https=)
RU (1) RU2296820C2 (https=)
SE (1) SE523309E (https=)
WO (1) WO2002103085A1 (https=)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
WO2003080502A1 (en) * 2002-03-25 2003-10-02 Matvice Ehf. A method and apparatus for processing nanoscopic structures
US8294025B2 (en) 2002-06-08 2012-10-23 Solarity, Llc Lateral collection photovoltaics
KR100868887B1 (ko) * 2004-01-12 2008-11-17 더 리전트 오브 더 유니버시티 오브 캘리포니아 나노 규모의 전기 석판 인쇄술
GB0416600D0 (en) 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices
GB0416952D0 (en) * 2004-07-30 2004-09-01 Renishaw Plc Scale making method
DE602005022084D1 (de) * 2004-09-08 2010-08-12 Nil Technology Aps Flexibler nano-druckstempel
FR2885913B1 (fr) * 2005-05-18 2007-08-10 Centre Nat Rech Scient Element composite comprenant un substrat conducteur et un revetement metallique nanostructure.
KR101147087B1 (ko) * 2005-06-28 2012-05-17 엘지디스플레이 주식회사 평판표시소자의 제조방법
WO2007058604A1 (en) * 2005-11-18 2007-05-24 Replisaurus Technologies Ab Master electrode and method of forming the master electrode
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
FR2898138B1 (fr) 2006-03-03 2008-05-16 Commissariat Energie Atomique Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre.
EP1835339B1 (fr) * 2006-03-15 2012-05-16 Rolex S.A. Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue
DE102006013362A1 (de) * 2006-03-16 2007-09-27 Siemens Ag Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
WO2008036423A2 (en) 2006-09-24 2008-03-27 Shocking Technologies, Inc. Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
JP4694519B2 (ja) * 2007-02-28 2011-06-08 富士通株式会社 マイクロ構造体およびマイクロ構造体製造方法
CN100545648C (zh) * 2007-05-15 2009-09-30 中国科学院长春应用化学研究所 一种微盘电极或微盘阵列电极的制备方法
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US9157141B2 (en) * 2007-08-24 2015-10-13 Schlumberger Technology Corporation Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well
CH704572B1 (fr) * 2007-12-31 2012-09-14 Nivarox Sa Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé.
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
KR100894710B1 (ko) * 2008-06-27 2009-04-24 (주) 월드비젼 윈도우 일체형 터치스크린 및 이의 제조방법
EP2166125A1 (en) * 2008-09-19 2010-03-24 ALSTOM Technology Ltd Method for the restoration of a metallic coating
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
EP2342722A2 (en) 2008-09-30 2011-07-13 Shocking Technologies Inc Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
EP2350357B1 (en) * 2008-11-14 2019-08-21 Luxembourg Institute of Science and Technology A substrate holder for holding a conductive substrate during plating thereof
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
WO2010110909A1 (en) 2009-03-26 2010-09-30 Shocking Technologies, Inc. Components having voltage switchable dielectric materials
EP2263972A1 (fr) * 2009-06-12 2010-12-22 Nivarox-FAR S.A. Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP4768848B2 (ja) * 2009-12-07 2011-09-07 株式会社東芝 電鋳用原盤及びその製造方法
USD642277S1 (en) 2009-12-23 2011-07-26 Christopher John Farrell Oral appliance
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
ES2592708T3 (es) 2010-07-15 2016-12-01 Luxembourg Institute Of Science And Technology (List) Una hoja de contactos para la disposición entre una pinza de sujeción y un electrodo maestro en un proceso ECPR
EP2593591B1 (en) 2010-07-15 2016-06-08 Luxembourg Institute of Science and Technology (LIST) Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore
ES2606321T3 (es) 2010-07-15 2017-03-23 Luxembourg Institute Of Science And Technology (List) Llenado de una cámara de impresión y mandril correspondiente
EP3269846B1 (en) 2010-07-15 2019-11-06 Luxembourg Institute of Science and Technology (LIST) A chuck, and a method for bringing a first and a second substrate together
WO2012007522A2 (en) 2010-07-15 2012-01-19 Replisaurus Group Sas Separation of master electrode and substrate in ecpr
EP2593584B1 (en) 2010-07-15 2017-04-19 Luxembourg Institute of Science and Technology (LIST) Device, system and method for use in machines for electrochemical pattern replication
EP2593590B1 (en) 2010-07-15 2017-10-04 Luxembourg Institute of Science and Technology (LIST) System for automated handling of masters and substrate
EP2593585B1 (en) 2010-07-15 2017-08-30 Luxembourg Institute of Science and Technology (LIST) Leveling of master electrode and substrate in ecpr, and a chuck therefor
RU2463121C2 (ru) * 2010-08-31 2012-10-10 Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) Способ изготовления электрически изолированной металлической ленты и линия для его осуществления
AT510593B1 (de) * 2010-12-15 2012-05-15 Markus Dipl Ing Dr Hacksteiner Vorrichtung zum metallisieren von wafern
WO2012084046A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas An ecpr master electrode, and a method for providing such master electrode
WO2012084047A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas An ecpr master electrode and a method for providing such ecpr master electrode
WO2012084048A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas A method for providing an ecpr master electrode
DK2655698T3 (da) 2010-12-23 2019-08-12 Luxembourg Institute Of Science And Tech Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne
RU2497747C2 (ru) * 2011-04-05 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) Способ получения металлических реплик конической формы на основе полимерных шаблонов
WO2012140262A1 (en) * 2011-04-15 2012-10-18 Cortec Gmbh Neural electrode and method for fabricating the same
EP2533272B1 (en) 2011-06-07 2014-03-12 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
EP2533271B1 (en) 2011-06-07 2014-05-21 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
EP2533273B1 (en) 2011-06-07 2017-02-08 Luxembourg Institute of Science and Technology (LIST) An ECPR master electrode, and a method for providing such master electrode
AU349029S (en) 2012-08-31 2013-06-06 Orthodontic appliance
RU2529592C2 (ru) * 2012-11-19 2014-09-27 Общество с Ограниченной Ответственностью "Фабрика новых материалов" Способ электрохимической рентгеновской бесконтактной литографии
JP6107799B2 (ja) * 2014-12-03 2017-04-05 トヨタ自動車株式会社 表面処理方法および表面処理装置
USD767146S1 (en) 2015-02-09 2016-09-20 Christopher John Farrell Orthodontic appliance
CA168308S (en) 2015-11-09 2017-03-22 Myosa Pty Ltd Oral appliance
WO2017087884A1 (en) * 2015-11-19 2017-05-26 Fabric8Labs, Inc. Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition
AU201710942S (en) 2017-02-16 2017-10-06 Orthodontic appliance
FR3072690B1 (fr) * 2017-10-24 2021-07-30 Centre Techn Ind Mecanique Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur
LU100919B1 (en) 2018-08-27 2020-02-27 Luxembourg Inst Science & Tech List Metal-CNT composite, production method and materials therefor
KR102210785B1 (ko) * 2019-02-07 2021-02-02 경북대학교 산학합력단 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체
US12139810B2 (en) * 2020-06-15 2024-11-12 Arizona Board Of Regents On Behalf Of Arizona State University Localized electrochemical deposition

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2306082A (en) * 1940-04-27 1942-12-22 Clarence O Prest Method for line or design reproduction by electrolysis
US3190822A (en) * 1961-01-09 1965-06-22 Burnham John Process for electrolytically etching valve metal surfaces
US3240685A (en) * 1962-02-23 1966-03-15 Ibm Method and device for selective anodization
GB1098182A (en) 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
CA791112A (en) * 1964-06-30 1968-07-30 International Business Machines Corporation Catalytically active palladium coatings
US3582477A (en) * 1969-02-20 1971-06-01 Paul Gelb Selective electroplating method
JPS5456619U (https=) * 1977-09-28 1979-04-19
JPS5456619A (en) 1977-10-13 1979-05-07 Tokyo Yogyo Kk Spray repairing material for blast furnace tapping spout
GB1600667A (en) 1978-05-26 1981-10-21 Pryor Edward & Son Electrolytic marking of metal articles
US4279709A (en) * 1979-05-08 1981-07-21 The Dow Chemical Company Preparation of porous electrodes
US4734174A (en) * 1986-12-17 1988-03-29 Polaroid Corporation Electrochemical formation of thin-film electrodes
JPH01234590A (ja) * 1988-03-16 1989-09-19 Toshiba Eng Co Ltd 部分メッキ装置
US4932518A (en) * 1988-08-23 1990-06-12 Shipley Company Inc. Method and apparatus for determining throwing power of an electroplating solution
US5294504A (en) * 1988-08-30 1994-03-15 Osaka Gas Company, Ltd. Three-dimensional microstructure as a substrate for a battery electrode
JPH04236800A (ja) * 1991-01-16 1992-08-25 Fujitsu Ltd 電解エッチング方法
US5196109A (en) * 1991-08-01 1993-03-23 Geoffrey Scott Trivalent chromium electrolytes and plating processes employing same
JPH0593300A (ja) * 1991-09-30 1993-04-16 Riyouichi Aogaki 電解エツチング方法
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
JPH06299390A (ja) * 1993-04-13 1994-10-25 Seiko Instr Inc 微細加工方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE69528897T2 (de) * 1994-06-09 2003-10-09 Tyco Electronics Corp., Middleton Elektrische bauelemente
DK172937B1 (da) * 1995-06-21 1999-10-11 Peter Torben Tang Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer
KR0147996B1 (ko) * 1995-06-30 1998-10-15 배순훈 박막 헤드의 패턴 평탄화 방법
CN1072737C (zh) * 1995-10-17 2001-10-10 佳能株式会社 刻蚀方法
JPH103233A (ja) * 1996-04-15 1998-01-06 Fuji Xerox Co Ltd 画像形成方法、画像形成媒体、被転写媒体及び画像形成装置
AU2591397A (en) 1996-07-02 1998-01-21 Wilson Greatbatch Ltd. Preparation and use of thin flexible cathodes in alkali metal electrochemical cells
CA2286326C (en) * 1997-04-04 2007-06-26 Adam L. Cohen Article, method, and apparatus for electrochemical fabrication
FR2773652B1 (fr) * 1998-01-14 2002-10-11 Sgs Thomson Microelectronics Circuit de generation d'un signal d'activation commande
EP1060299A1 (en) 1998-03-05 2000-12-20 Obducat AB Method of etching
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
DE19935558B4 (de) * 1999-07-30 2010-11-25 Nawotec Gmbh Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich
JP3441058B2 (ja) * 1999-12-03 2003-08-25 理化学研究所 キャピラリーゲル電気泳動用マイクロチップおよびその製造方法
SE515607C2 (sv) 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
KR100500684B1 (ko) * 1999-12-29 2005-07-12 비오이 하이디스 테크놀로지 주식회사 ４-마스크 공정을 이용한 액정 디스플레이의 제조 방법
KR20010105994A (ko) * 2000-05-20 2001-11-29 구자홍 디스크 드라이버의 트레이

Also Published As

Publication number Publication date
HK1072083A1 (en) 2005-08-12
US8741113B2 (en) 2014-06-03
RU2003136088A (ru) 2005-05-10
JP2004530050A (ja) 2004-09-30
EP2322694B1 (en) 2017-08-02
ES2645700T3 (es) 2017-12-07
US7790009B2 (en) 2010-09-07
CN1555428A (zh) 2004-12-15
JP2009235578A (ja) 2009-10-15
DK1404899T3 (da) 2013-02-04
EP1404899A1 (en) 2004-04-07
CA2462098A1 (en) 2002-12-27
CN1294296C (zh) 2007-01-10
US20070151858A1 (en) 2007-07-05
SE0102144D0 (sv) 2001-06-15
EP2322694A1 (en) 2011-05-18
WO2002103085A1 (en) 2002-12-27
KR101250685B1 (ko) 2013-04-03
SE523309C2 (sv) 2004-04-13
JP4546078B2 (ja) 2010-09-15
SE0102144L (sv) 2002-12-19
SE523309E (sv) 2010-03-02
RU2296820C2 (ru) 2007-04-10
US20040154828A1 (en) 2004-08-12
KR20040028781A (ko) 2004-04-03
ES2397919T3 (es) 2013-03-12
US20120228128A1 (en) 2012-09-13
EP1404899B1 (en) 2012-10-31
PT1404899E (pt) 2013-01-28
US20110000784A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
CA2462098C (en) Method and electrode for defining and replicating structures in conducting materials
JP2524458B2 (ja) 電気化学マイクロマシニング方法
JP2004530050A5 (https=)
Baldhoff et al. Through-mask electrochemical micromachining
Schönenberger et al. Microscale pattern transfer without photolithography of substrates
JP2008507630A (ja) マイクロ及びナノデバイスの製造工程
CN100406618C (zh) 金属表面复杂三维微结构的加工方法及其装置
KR101274155B1 (ko) 금속 마스크 제조방법
CN1740404A (zh) 金属光栅模版制作方法
CN102764920B (zh) 一种双面外扩形金属微小孔阵列加工方法
Serrà et al. Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method
HK1072083B (en) Method and electrode for defining and replicating structures in conducting materials
Datta Electrochemical micromachining
Datta Microfabrication by through-mask electrochemical micromachining
JP3829300B2 (ja) 動圧溝の加工方法
TWI782506B (zh) 具高深寬比之孔洞之製備方法
Bhat et al. Photo-defined electrically assisted etching method for metal stencil fabrication
CN121295316A (zh) 电铸网版侧壁粗糙度光滑处理技术

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20220617