SE523309E - Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt - Google Patents

Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt

Info

Publication number
SE523309E
SE523309E SE0102144A SE0102144A SE523309E SE 523309 E SE523309 E SE 523309E SE 0102144 A SE0102144 A SE 0102144A SE 0102144 A SE0102144 A SE 0102144A SE 523309 E SE523309 E SE 523309E
Authority
SE
Sweden
Prior art keywords
electrode
nanostructures
patterning
electrolyte
conductive materials
Prior art date
Application number
SE0102144A
Other languages
English (en)
Swedish (sv)
Other versions
SE0102144D0 (sv
SE523309C2 (sv
SE0102144L (sv
Inventor
Patrik Moeller
Original Assignee
Replisaurus Technologies Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=20284507&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SE523309(E) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Replisaurus Technologies Ab filed Critical Replisaurus Technologies Ab
Priority to SE0102144A priority Critical patent/SE523309E/xx
Publication of SE0102144D0 publication Critical patent/SE0102144D0/xx
Priority to DK02739042.6T priority patent/DK1404899T3/da
Priority to EP02739042A priority patent/EP1404899B1/en
Priority to PCT/SE2002/001179 priority patent/WO2002103085A1/en
Priority to PT2739042T priority patent/PT1404899E/pt
Priority to KR1020037016336A priority patent/KR101250685B1/ko
Priority to ES02739042T priority patent/ES2397919T3/es
Priority to RU2003136088/02A priority patent/RU2296820C2/ru
Priority to JP2003505393A priority patent/JP4546078B2/ja
Priority to EP10182946.3A priority patent/EP2322694B1/en
Priority to HK05104929.3A priority patent/HK1072083B/xx
Priority to ES10182946.3T priority patent/ES2645700T3/es
Priority to CA2462098A priority patent/CA2462098C/en
Priority to CNB028119266A priority patent/CN1294296C/zh
Publication of SE0102144L publication Critical patent/SE0102144L/xx
Priority to US10/734,223 priority patent/US7790009B2/en
Publication of SE523309C2 publication Critical patent/SE523309C2/sv
Priority to US11/716,166 priority patent/US20070151858A1/en
Priority to JP2009142804A priority patent/JP2009235578A/ja
Publication of SE523309E publication Critical patent/SE523309E/xx
Priority to US12/801,219 priority patent/US20110000784A1/en
Priority to US13/417,808 priority patent/US8741113B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Micromachines (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Methods (AREA)
  • ing And Chemical Polishing (AREA)
SE0102144A 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt SE523309E (sv)

Priority Applications (19)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
CA2462098A CA2462098C (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials
EP02739042A EP1404899B1 (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials
EP10182946.3A EP2322694B1 (en) 2001-06-15 2002-06-17 Method for defining and replicating structures in conducting materials
CNB028119266A CN1294296C (zh) 2001-06-15 2002-06-17 确定与复制导电材料中的结构的方法与电极
PCT/SE2002/001179 WO2002103085A1 (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials
PT2739042T PT1404899E (pt) 2001-06-15 2002-06-17 Método e elétrodo para definir e replicar estruturas em materiais condutores
KR1020037016336A KR101250685B1 (ko) 2001-06-15 2002-06-17 전도 재료의 구조를 정의하고 복제하는 방법 및 전극
ES02739042T ES2397919T3 (es) 2001-06-15 2002-06-17 Procedimiento y electrodo para definir y reproducir estructuras en materiales conductores
RU2003136088/02A RU2296820C2 (ru) 2001-06-15 2002-06-17 Способ и электрод для определения и репликации шаблонов в проводящих материалах
JP2003505393A JP4546078B2 (ja) 2001-06-15 2002-06-17 伝導材料中の構造を定義し、複製するための方法及び電極
DK02739042.6T DK1404899T3 (da) 2001-06-15 2002-06-17 Fremgangsmåde og elektrode til at definere og duplikere strukturer i ledende materialer
HK05104929.3A HK1072083B (en) 2001-06-15 2002-06-17 Method and electrode for defining and replicating structures in conducting materials
ES10182946.3T ES2645700T3 (es) 2001-06-15 2002-06-17 Procedimiento para definir y reproducir estructuras en materiales conductores
US10/734,223 US7790009B2 (en) 2001-06-15 2003-12-15 Method and electrode for defining and replicating structures in conducting materials
US11/716,166 US20070151858A1 (en) 2001-06-15 2007-03-09 Method and electrode for defining and replicating structures in conducting materials
JP2009142804A JP2009235578A (ja) 2001-06-15 2009-06-15 伝導材料中の構造を画定し、複製するための方法及び電極
US12/801,219 US20110000784A1 (en) 2001-06-15 2010-05-27 Method and electrode for defining and replicating structures in conducting materials
US13/417,808 US8741113B2 (en) 2001-06-15 2012-03-12 Method and electrode for defining and replicating structures in conducting materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt

Publications (4)

Publication Number Publication Date
SE0102144D0 SE0102144D0 (sv) 2001-06-15
SE0102144L SE0102144L (sv) 2002-12-19
SE523309C2 SE523309C2 (sv) 2004-04-13
SE523309E true SE523309E (sv) 2010-03-02

Family

ID=20284507

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102144A SE523309E (sv) 2001-06-15 2001-06-15 Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt

Country Status (12)

Country Link
US (4) US7790009B2 (https=)
EP (2) EP1404899B1 (https=)
JP (2) JP4546078B2 (https=)
KR (1) KR101250685B1 (https=)
CN (1) CN1294296C (https=)
CA (1) CA2462098C (https=)
DK (1) DK1404899T3 (https=)
ES (2) ES2645700T3 (https=)
PT (1) PT1404899E (https=)
RU (1) RU2296820C2 (https=)
SE (1) SE523309E (https=)
WO (1) WO2002103085A1 (https=)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
WO2003080502A1 (en) * 2002-03-25 2003-10-02 Matvice Ehf. A method and apparatus for processing nanoscopic structures
US8294025B2 (en) 2002-06-08 2012-10-23 Solarity, Llc Lateral collection photovoltaics
KR100868887B1 (ko) * 2004-01-12 2008-11-17 더 리전트 오브 더 유니버시티 오브 캘리포니아 나노 규모의 전기 석판 인쇄술
GB0416600D0 (en) 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices
GB0416952D0 (en) * 2004-07-30 2004-09-01 Renishaw Plc Scale making method
DE602005022084D1 (de) * 2004-09-08 2010-08-12 Nil Technology Aps Flexibler nano-druckstempel
FR2885913B1 (fr) * 2005-05-18 2007-08-10 Centre Nat Rech Scient Element composite comprenant un substrat conducteur et un revetement metallique nanostructure.
KR101147087B1 (ko) * 2005-06-28 2012-05-17 엘지디스플레이 주식회사 평판표시소자의 제조방법
WO2007058604A1 (en) * 2005-11-18 2007-05-24 Replisaurus Technologies Ab Master electrode and method of forming the master electrode
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
FR2898138B1 (fr) 2006-03-03 2008-05-16 Commissariat Energie Atomique Procede de structuration electrochimique d'un materiau conducteur ou semi-conducteur, et dispositif de mise en oeuvre.
EP1835339B1 (fr) * 2006-03-15 2012-05-16 Rolex S.A. Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue
DE102006013362A1 (de) * 2006-03-16 2007-09-27 Siemens Ag Verfahren zum Herstellen einer elektrischen Komponente mit einer Nanonadelstruktur
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
WO2008036423A2 (en) 2006-09-24 2008-03-27 Shocking Technologies, Inc. Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
JP4694519B2 (ja) * 2007-02-28 2011-06-08 富士通株式会社 マイクロ構造体およびマイクロ構造体製造方法
CN100545648C (zh) * 2007-05-15 2009-09-30 中国科学院长春应用化学研究所 一种微盘电极或微盘阵列电极的制备方法
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US9157141B2 (en) * 2007-08-24 2015-10-13 Schlumberger Technology Corporation Conditioning ferrous alloys into cracking susceptible and fragmentable elements for use in a well
CH704572B1 (fr) * 2007-12-31 2012-09-14 Nivarox Sa Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé.
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
KR100894710B1 (ko) * 2008-06-27 2009-04-24 (주) 월드비젼 윈도우 일체형 터치스크린 및 이의 제조방법
EP2166125A1 (en) * 2008-09-19 2010-03-24 ALSTOM Technology Ltd Method for the restoration of a metallic coating
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
EP2342722A2 (en) 2008-09-30 2011-07-13 Shocking Technologies Inc Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
EP2350357B1 (en) * 2008-11-14 2019-08-21 Luxembourg Institute of Science and Technology A substrate holder for holding a conductive substrate during plating thereof
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
WO2010110909A1 (en) 2009-03-26 2010-09-30 Shocking Technologies, Inc. Components having voltage switchable dielectric materials
EP2263972A1 (fr) * 2009-06-12 2010-12-22 Nivarox-FAR S.A. Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
JP4768848B2 (ja) * 2009-12-07 2011-09-07 株式会社東芝 電鋳用原盤及びその製造方法
USD642277S1 (en) 2009-12-23 2011-07-26 Christopher John Farrell Oral appliance
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
ES2592708T3 (es) 2010-07-15 2016-12-01 Luxembourg Institute Of Science And Technology (List) Una hoja de contactos para la disposición entre una pinza de sujeción y un electrodo maestro en un proceso ECPR
EP2593591B1 (en) 2010-07-15 2016-06-08 Luxembourg Institute of Science and Technology (LIST) Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore
ES2606321T3 (es) 2010-07-15 2017-03-23 Luxembourg Institute Of Science And Technology (List) Llenado de una cámara de impresión y mandril correspondiente
EP3269846B1 (en) 2010-07-15 2019-11-06 Luxembourg Institute of Science and Technology (LIST) A chuck, and a method for bringing a first and a second substrate together
WO2012007522A2 (en) 2010-07-15 2012-01-19 Replisaurus Group Sas Separation of master electrode and substrate in ecpr
EP2593584B1 (en) 2010-07-15 2017-04-19 Luxembourg Institute of Science and Technology (LIST) Device, system and method for use in machines for electrochemical pattern replication
EP2593590B1 (en) 2010-07-15 2017-10-04 Luxembourg Institute of Science and Technology (LIST) System for automated handling of masters and substrate
EP2593585B1 (en) 2010-07-15 2017-08-30 Luxembourg Institute of Science and Technology (LIST) Leveling of master electrode and substrate in ecpr, and a chuck therefor
RU2463121C2 (ru) * 2010-08-31 2012-10-10 Государственное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (КГЭУ) Способ изготовления электрически изолированной металлической ленты и линия для его осуществления
AT510593B1 (de) * 2010-12-15 2012-05-15 Markus Dipl Ing Dr Hacksteiner Vorrichtung zum metallisieren von wafern
WO2012084046A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas An ecpr master electrode, and a method for providing such master electrode
WO2012084047A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas An ecpr master electrode and a method for providing such ecpr master electrode
WO2012084048A1 (en) 2010-12-23 2012-06-28 Replisaurus Group Sas A method for providing an ecpr master electrode
DK2655698T3 (da) 2010-12-23 2019-08-12 Luxembourg Institute Of Science And Tech Hovedelektrode til ecpr samt fremgangsmåder til fremstilling af denne
RU2497747C2 (ru) * 2011-04-05 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский педагогический государственный университет" (МПГУ) Способ получения металлических реплик конической формы на основе полимерных шаблонов
WO2012140262A1 (en) * 2011-04-15 2012-10-18 Cortec Gmbh Neural electrode and method for fabricating the same
EP2533272B1 (en) 2011-06-07 2014-03-12 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
EP2533271B1 (en) 2011-06-07 2014-05-21 Centre de Recherche Public - Gabriel Lippmann An ecpr master electrode, and a method for providing such master electrode
EP2533273B1 (en) 2011-06-07 2017-02-08 Luxembourg Institute of Science and Technology (LIST) An ECPR master electrode, and a method for providing such master electrode
AU349029S (en) 2012-08-31 2013-06-06 Orthodontic appliance
RU2529592C2 (ru) * 2012-11-19 2014-09-27 Общество с Ограниченной Ответственностью "Фабрика новых материалов" Способ электрохимической рентгеновской бесконтактной литографии
JP6107799B2 (ja) * 2014-12-03 2017-04-05 トヨタ自動車株式会社 表面処理方法および表面処理装置
USD767146S1 (en) 2015-02-09 2016-09-20 Christopher John Farrell Orthodontic appliance
CA168308S (en) 2015-11-09 2017-03-22 Myosa Pty Ltd Oral appliance
WO2017087884A1 (en) * 2015-11-19 2017-05-26 Fabric8Labs, Inc. Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition
AU201710942S (en) 2017-02-16 2017-10-06 Orthodontic appliance
FR3072690B1 (fr) * 2017-10-24 2021-07-30 Centre Techn Ind Mecanique Procede de traitement de surface d'une piece mecanique realisee dans un materiau conducteur
LU100919B1 (en) 2018-08-27 2020-02-27 Luxembourg Inst Science & Tech List Metal-CNT composite, production method and materials therefor
KR102210785B1 (ko) * 2019-02-07 2021-02-02 경북대학교 산학합력단 더블 패터닝을 이용한 나노 메쉬 기반의 일체형 금속 전도체 제조방법 및 이에 의해 제조된 일체형 금속 전도체
US12139810B2 (en) * 2020-06-15 2024-11-12 Arizona Board Of Regents On Behalf Of Arizona State University Localized electrochemical deposition

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2306082A (en) * 1940-04-27 1942-12-22 Clarence O Prest Method for line or design reproduction by electrolysis
US3190822A (en) * 1961-01-09 1965-06-22 Burnham John Process for electrolytically etching valve metal surfaces
US3240685A (en) * 1962-02-23 1966-03-15 Ibm Method and device for selective anodization
GB1098182A (en) 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
CA791112A (en) * 1964-06-30 1968-07-30 International Business Machines Corporation Catalytically active palladium coatings
US3582477A (en) * 1969-02-20 1971-06-01 Paul Gelb Selective electroplating method
JPS5456619U (https=) * 1977-09-28 1979-04-19
JPS5456619A (en) 1977-10-13 1979-05-07 Tokyo Yogyo Kk Spray repairing material for blast furnace tapping spout
GB1600667A (en) 1978-05-26 1981-10-21 Pryor Edward & Son Electrolytic marking of metal articles
US4279709A (en) * 1979-05-08 1981-07-21 The Dow Chemical Company Preparation of porous electrodes
US4734174A (en) * 1986-12-17 1988-03-29 Polaroid Corporation Electrochemical formation of thin-film electrodes
JPH01234590A (ja) * 1988-03-16 1989-09-19 Toshiba Eng Co Ltd 部分メッキ装置
US4932518A (en) * 1988-08-23 1990-06-12 Shipley Company Inc. Method and apparatus for determining throwing power of an electroplating solution
US5294504A (en) * 1988-08-30 1994-03-15 Osaka Gas Company, Ltd. Three-dimensional microstructure as a substrate for a battery electrode
JPH04236800A (ja) * 1991-01-16 1992-08-25 Fujitsu Ltd 電解エッチング方法
US5196109A (en) * 1991-08-01 1993-03-23 Geoffrey Scott Trivalent chromium electrolytes and plating processes employing same
JPH0593300A (ja) * 1991-09-30 1993-04-16 Riyouichi Aogaki 電解エツチング方法
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
JPH06299390A (ja) * 1993-04-13 1994-10-25 Seiko Instr Inc 微細加工方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE69528897T2 (de) * 1994-06-09 2003-10-09 Tyco Electronics Corp., Middleton Elektrische bauelemente
DK172937B1 (da) * 1995-06-21 1999-10-11 Peter Torben Tang Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer
KR0147996B1 (ko) * 1995-06-30 1998-10-15 배순훈 박막 헤드의 패턴 평탄화 방법
CN1072737C (zh) * 1995-10-17 2001-10-10 佳能株式会社 刻蚀方法
JPH103233A (ja) * 1996-04-15 1998-01-06 Fuji Xerox Co Ltd 画像形成方法、画像形成媒体、被転写媒体及び画像形成装置
AU2591397A (en) 1996-07-02 1998-01-21 Wilson Greatbatch Ltd. Preparation and use of thin flexible cathodes in alkali metal electrochemical cells
CA2286326C (en) * 1997-04-04 2007-06-26 Adam L. Cohen Article, method, and apparatus for electrochemical fabrication
FR2773652B1 (fr) * 1998-01-14 2002-10-11 Sgs Thomson Microelectronics Circuit de generation d'un signal d'activation commande
EP1060299A1 (en) 1998-03-05 2000-12-20 Obducat AB Method of etching
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
DE19935558B4 (de) * 1999-07-30 2010-11-25 Nawotec Gmbh Verfahren zur Erzeugung von Strukturen in einem Substrat im Nanometerbereich
JP3441058B2 (ja) * 1999-12-03 2003-08-25 理化学研究所 キャピラリーゲル電気泳動用マイクロチップおよびその製造方法
SE515607C2 (sv) 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
KR100500684B1 (ko) * 1999-12-29 2005-07-12 비오이 하이디스 테크놀로지 주식회사 ４-마스크 공정을 이용한 액정 디스플레이의 제조 방법
KR20010105994A (ko) * 2000-05-20 2001-11-29 구자홍 디스크 드라이버의 트레이

Also Published As

Publication number Publication date
HK1072083A1 (en) 2005-08-12
US8741113B2 (en) 2014-06-03
RU2003136088A (ru) 2005-05-10
JP2004530050A (ja) 2004-09-30
EP2322694B1 (en) 2017-08-02
ES2645700T3 (es) 2017-12-07
US7790009B2 (en) 2010-09-07
CN1555428A (zh) 2004-12-15
JP2009235578A (ja) 2009-10-15
DK1404899T3 (da) 2013-02-04
CA2462098C (en) 2014-01-14
EP1404899A1 (en) 2004-04-07
CA2462098A1 (en) 2002-12-27
CN1294296C (zh) 2007-01-10
US20070151858A1 (en) 2007-07-05
SE0102144D0 (sv) 2001-06-15
EP2322694A1 (en) 2011-05-18
WO2002103085A1 (en) 2002-12-27
KR101250685B1 (ko) 2013-04-03
SE523309C2 (sv) 2004-04-13
JP4546078B2 (ja) 2010-09-15
SE0102144L (sv) 2002-12-19
RU2296820C2 (ru) 2007-04-10
US20040154828A1 (en) 2004-08-12
KR20040028781A (ko) 2004-04-03
ES2397919T3 (es) 2013-03-12
US20120228128A1 (en) 2012-09-13
EP1404899B1 (en) 2012-10-31
PT1404899E (pt) 2013-01-28
US20110000784A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
SE523309E (sv) Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
DE69909233D1 (de) Vorrichtung zum Querschneiden von bahnförmigen Materialien
NO20042390L (no) Apparat for a separere materiale
ATE284428T1 (de) Verfahren zum kappen von polyphenylenäthern
DE10063216B8 (de) Vorrichtung zum Bearbeiten von fotosensiblem Material
AU2003263014A8 (en) Method for detecting electrical defects in membrane electrode assemblies
DE69940582D1 (de) Vorrichtung zum herstellen von plattenmaterial
NO20042287L (no) Apparat for utskilling av materiale
DE60131203D1 (de) Lithographischer Apparat
DE10196256T1 (de) Verbundelektrodenmaterial und Verfahren zum Herstellen desselben, und dasselbe verwendendes elektrochemisches Element
ATE348043T1 (de) Verfahren zum fördern von beuteln.
DE50003095D1 (de) Vorrichtung zum Bedrucken von Blattmaterial
FI20030602A7 (fi) Menetelmä hiukkasten varaamiseksi materiaalin valmistusprosessissa
DE50107852D1 (de) Träger zum tragen von zumindest einem apparat
FI20020925A0 (fi) Menetelmä ja laitteisto neste-nesteuuton dispersion ohjaamiseksi
NO20010717L (no) Et apparat for Õ begrense en elektrisk strøm
DE60144114D1 (de) System zum erkennen von postartikeln mit duplikatsstempeln
DE50012033D1 (de) Vorrichtung zum Herauslösen von Teilbereichen aus einem bahnartigen Folienmaterial
FI981602L (fi) Menetelmä prosessivesien LK-aineiden konsentroimiseksi
DE60018507D1 (de) Apparat zum Zuführen von Bögen
DE69908734D1 (de) Apparat zum Schärfen von Schneidemesser
DE69912731D1 (de) Vorrichtung zum Vulkanisieren von Reifen
DE60321095D1 (de) Drehende elektrische Maschine mit regelbarem Luftspalt
DE502004006581D1 (de) Verfahren zum herstellen eines druckerzeugnisses
DE50202678D1 (de) Verfahren und Vorrichtung zum Non-Stop-Stapelwechsel

Legal Events

Date Code Title Description
RPOP Patent has been republished in amended form after opposition
NUG Patent has lapsed