PT100880A - Aparelho para tratamento por plasma e para revestimento com pelicula fina e processo de preparacao de um substrato - Google Patents

Aparelho para tratamento por plasma e para revestimento com pelicula fina e processo de preparacao de um substrato

Info

Publication number
PT100880A
PT100880A PT100880A PT10088092A PT100880A PT 100880 A PT100880 A PT 100880A PT 100880 A PT100880 A PT 100880A PT 10088092 A PT10088092 A PT 10088092A PT 100880 A PT100880 A PT 100880A
Authority
PT
Portugal
Prior art keywords
plasma
substrate
preparing
coating apparatus
film coating
Prior art date
Application number
PT100880A
Other languages
English (en)
Other versions
PT100880B (pt
Inventor
John T Felts
Hood Chatham Iii
Joseph Countrywood
Robert J Nelson
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boc Group Inc filed Critical Boc Group Inc
Publication of PT100880A publication Critical patent/PT100880A/pt
Publication of PT100880B publication Critical patent/PT100880B/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141Plasma treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • C23C16/545Apparatus specially adapted for continuous coating for coating elongated substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32752Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761Continuous moving
    • H01J37/3277Continuous moving of continuous material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/48Generating plasma using an arc
    • H05H1/50Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/47Generating plasma using corona discharges
    • H05H1/473Cylindrical electrodes, e.g. rotary drums

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrotherapy Devices (AREA)
  • Chemically Coating (AREA)
PT100880A 1991-09-27 1992-09-18 Aparelho para tratamento por plasma e para revestimento com pelicula fina e processo de preparacao de um substrato PT100880B (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/767,146 US5224441A (en) 1991-09-27 1991-09-27 Apparatus for rapid plasma treatments and method

Publications (2)

Publication Number Publication Date
PT100880A true PT100880A (pt) 1994-05-31
PT100880B PT100880B (pt) 1999-07-30

Family

ID=25078620

Family Applications (1)

Application Number Title Priority Date Filing Date
PT100880A PT100880B (pt) 1991-09-27 1992-09-18 Aparelho para tratamento por plasma e para revestimento com pelicula fina e processo de preparacao de um substrato

Country Status (21)

Country Link
US (2) US5224441A (pt)
EP (1) EP0605534B1 (pt)
JP (1) JP3155278B2 (pt)
KR (1) KR100294932B1 (pt)
CN (2) CN1036079C (pt)
AT (1) ATE148507T1 (pt)
AU (1) AU666675B2 (pt)
CA (1) CA2119561C (pt)
DE (1) DE69217233T2 (pt)
DK (1) DK0605534T3 (pt)
ES (1) ES2096768T3 (pt)
FI (1) FI941439A (pt)
ID (1) ID1054B (pt)
IL (1) IL102831A (pt)
MX (1) MX9205420A (pt)
MY (1) MY110816A (pt)
NO (1) NO941075L (pt)
NZ (1) NZ244055A (pt)
PT (1) PT100880B (pt)
WO (1) WO1993006258A1 (pt)
ZA (1) ZA926102B (pt)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3101330B2 (ja) * 1991-01-23 2000-10-23 キヤノン株式会社 マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する方法及び装置
US5670224A (en) * 1992-11-13 1997-09-23 Energy Conversion Devices, Inc. Modified silicon oxide barrier coatings produced by microwave CVD deposition on polymeric substrates
JPH06280026A (ja) * 1993-03-24 1994-10-04 Semiconductor Energy Lab Co Ltd 成膜装置及び成膜方法
FR2703073B1 (fr) * 1993-03-26 1995-05-05 Lorraine Laminage Procédé et dispositif pour le revêtement en continu d'un matériau métallique en défilement par un dépôt de polymère à gradient de composition, et produit obtenu par ce procédé.
FR2704558B1 (fr) * 1993-04-29 1995-06-23 Air Liquide Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement.
US6835523B1 (en) * 1993-05-09 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Apparatus for fabricating coating and method of fabricating the coating
CH685755A5 (de) * 1993-06-03 1995-09-29 Tetra Pak Suisse Sa Verfahren zur Herstellung eines Schichtstoffes.
US5932302A (en) * 1993-07-20 1999-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating with ultrasonic vibration a carbon coating
US5534066A (en) * 1993-10-29 1996-07-09 International Business Machines Corporation Fluid delivery apparatus having an infrared feedline sensor
US5803976A (en) * 1993-11-09 1998-09-08 Imperial Chemical Industries Plc Vacuum web coating
CH687601A5 (de) * 1994-02-04 1997-01-15 Tetra Pak Suisse Sa Verfahren zur Herstellung von im Innern sterilen Verpackungen mit hervorragenden Sperreigenschaften.
CH687614A5 (de) * 1994-02-04 1997-01-15 Tetra Pak Suisse Sa Verfahren zum Versehen einer Verpackung mit hervorragenden Sperreigenschaften in bezug auf Gase.
DE4404690A1 (de) * 1994-02-15 1995-08-17 Leybold Ag Verfahren zur Erzeugung von Sperrschichten für Gase und Dämpfe auf Kunststoff-Substraten
WO1995031717A1 (en) * 1994-05-13 1995-11-23 Novel Experimental Technology Coated plastic mold for electrophoresis gel
US6146724A (en) * 1994-06-06 2000-11-14 The University Of Tennessee Research Corporation One atmosphere uniform glow discharge plasma coating with gas barrier properties
US5558843A (en) * 1994-09-01 1996-09-24 Eastman Kodak Company Near atmospheric pressure treatment of polymers using helium discharges
DE69533828T2 (de) * 1994-09-19 2005-04-21 Invitrogen Corp Kunststoffgiessform fur elektrophoresegel
DE19523444A1 (de) * 1995-06-28 1997-01-02 Antec Angewandte Neue Technolo Verfahren zur Beschichtung von Kunststoffen oder ähnlichen weichen Werkstoffen
US5728224A (en) * 1995-09-13 1998-03-17 Tetra Laval Holdings & Finance S.A. Apparatus and method for manufacturing a packaging material using gaseous phase atmospheric photo chemical vapor deposition to apply a barrier layer to a moving web substrate
DE19538176A1 (de) * 1995-10-13 1997-04-17 Arcotec Oberflaechentech Gmbh Vorrichtung zur Behandlung flächiger Substrate mit einer Koronastation
US5968324A (en) * 1995-12-05 1999-10-19 Applied Materials, Inc. Method and apparatus for depositing antireflective coating
TW303480B (en) 1996-01-24 1997-04-21 Applied Materials Inc Magnetically confined plasma reactor for processing a semiconductor wafer
US6116185A (en) * 1996-05-01 2000-09-12 Rietzel; James G. Gas injector for plasma enhanced chemical vapor deposition
US5743966A (en) * 1996-05-31 1998-04-28 The Boc Group, Inc. Unwinding of plastic film in the presence of a plasma
US6110540A (en) * 1996-07-12 2000-08-29 The Boc Group, Inc. Plasma apparatus and method
KR100296692B1 (ko) * 1996-09-10 2001-10-24 사토 도리 플라즈마cvd장치
US6112695A (en) 1996-10-08 2000-09-05 Nano Scale Surface Systems, Inc. Apparatus for plasma deposition of a thin film onto the interior surface of a container
US5948166A (en) * 1996-11-05 1999-09-07 3M Innovative Properties Company Process and apparatus for depositing a carbon-rich coating on a moving substrate
US5888594A (en) * 1996-11-05 1999-03-30 Minnesota Mining And Manufacturing Company Process for depositing a carbon-rich coating on a moving substrate
US5829353A (en) * 1997-06-18 1998-11-03 Presstek, Inc. Method of modulating lithographic affinity and printing members made thereby
US6106659A (en) * 1997-07-14 2000-08-22 The University Of Tennessee Research Corporation Treater systems and methods for generating moderate-to-high-pressure plasma discharges for treating materials and related treated materials
US6083355A (en) * 1997-07-14 2000-07-04 The University Of Tennessee Research Corporation Electrodes for plasma treater systems
JP3906325B2 (ja) * 1997-10-09 2007-04-18 テトラ ラバル ホールデイングス アンド ファイナンス エス エイ 気体及び芳香バリア特性を備える包装積層体
DE19802506A1 (de) * 1998-01-23 1999-07-29 Leybold Systems Gmbh Metallhaltige Barriereschicht für Verpackungsmaterial und Verfahren zur Herstellung einer metallhaltigen Barriereschicht für Verpackungsmaterial
US6054379A (en) 1998-02-11 2000-04-25 Applied Materials, Inc. Method of depositing a low k dielectric with organo silane
US6303523B2 (en) 1998-02-11 2001-10-16 Applied Materials, Inc. Plasma processes for depositing low dielectric constant films
US6660656B2 (en) 1998-02-11 2003-12-09 Applied Materials Inc. Plasma processes for depositing low dielectric constant films
US6287990B1 (en) 1998-02-11 2001-09-11 Applied Materials, Inc. CVD plasma assisted low dielectric constant films
US6627532B1 (en) * 1998-02-11 2003-09-30 Applied Materials, Inc. Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
US6593247B1 (en) 1998-02-11 2003-07-15 Applied Materials, Inc. Method of depositing low k films using an oxidizing plasma
US6667553B2 (en) 1998-05-29 2003-12-23 Dow Corning Corporation H:SiOC coated substrates
US6159871A (en) 1998-05-29 2000-12-12 Dow Corning Corporation Method for producing hydrogenated silicon oxycarbide films having low dielectric constant
US6082292A (en) * 1999-01-05 2000-07-04 Wisconsin Alumni Research Foundation Sealing roller system for surface treatment gas reactors
SE520491C2 (sv) 1999-04-07 2003-07-15 Tetra Laval Holdings & Finance Förpackningslaminat med barriäregenskaper mot gas och aromämnen
DE19927540A1 (de) * 1999-06-16 2000-12-21 Ct Therm Elek Sche Anlagen Gmb Abgasreinigungssystem
US6149985A (en) 1999-07-07 2000-11-21 Eastman Kodak Company High-efficiency plasma treatment of imaging supports
US6399489B1 (en) 1999-11-01 2002-06-04 Applied Materials, Inc. Barrier layer deposition using HDP-CVD
JP4841023B2 (ja) * 2000-02-10 2011-12-21 株式会社半導体エネルギー研究所 成膜装置及び太陽電池の作製方法
US6863835B1 (en) 2000-04-25 2005-03-08 James D. Carducci Magnetic barrier for plasma in chamber exhaust
US6603121B2 (en) 2000-05-19 2003-08-05 Eastman Kodak Company High-efficiency plasma treatment of paper
JP4382265B2 (ja) * 2000-07-12 2009-12-09 日本電気株式会社 酸化シリコン膜の形成方法及びその形成装置
EP1401731A2 (en) * 2000-11-29 2004-03-31 American Aerogel Corporation Insulated barriers and methods for producing same
US7025856B2 (en) * 2001-02-02 2006-04-11 The Regents Of The University Of California Processing materials inside an atmospheric-pressure radiofrequency nonthermal plasma discharge
US6802315B2 (en) 2001-03-21 2004-10-12 Hollingsorth & Vose Company Vapor deposition treated electret filter media
US6709721B2 (en) 2001-03-28 2004-03-23 Applied Materials Inc. Purge heater design and process development for the improvement of low k film properties
ATE496388T1 (de) 2001-04-20 2011-02-15 Gen Plasma Inc Penningentladungsplasmaquelle
US7294283B2 (en) * 2001-04-20 2007-11-13 Applied Process Technologies, Inc. Penning discharge plasma source
US7023128B2 (en) * 2001-04-20 2006-04-04 Applied Process Technologies, Inc. Dipole ion source
JP2002322558A (ja) * 2001-04-25 2002-11-08 Konica Corp 薄膜形成方法、光学フィルム、偏光板及び画像表示装置
US6926926B2 (en) * 2001-09-10 2005-08-09 Applied Materials, Inc. Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
US6759327B2 (en) 2001-10-09 2004-07-06 Applied Materials Inc. Method of depositing low k barrier layers
US6890850B2 (en) 2001-12-14 2005-05-10 Applied Materials, Inc. Method of depositing dielectric materials in damascene applications
US6838393B2 (en) * 2001-12-14 2005-01-04 Applied Materials, Inc. Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
US7091137B2 (en) * 2001-12-14 2006-08-15 Applied Materials Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
US6878419B2 (en) * 2001-12-14 2005-04-12 3M Innovative Properties Co. Plasma treatment of porous materials
CN100380590C (zh) * 2002-08-26 2008-04-09 亚利桑那西格玛实验室公司 通过大气辉光放电产生屏蔽涂层的方法
CH696013A5 (de) * 2002-10-03 2006-11-15 Tetra Laval Holdings & Finance Vorrichtung zur Behandlung eines bandförmigen Materials in einem Plasma-unterstützten Prozess.
CH707466B1 (de) * 2002-10-03 2014-07-15 Tetra Laval Holdings & Finance Vorrichtung zur Durchführung eines Plasma-unterstützten Prozesses.
US7749563B2 (en) * 2002-10-07 2010-07-06 Applied Materials, Inc. Two-layer film for next generation damascene barrier application with good oxidation resistance
US7208389B1 (en) * 2003-03-31 2007-04-24 Novellus Systems, Inc. Method of porogen removal from porous low-k films using UV radiation
WO2005028697A1 (en) 2003-09-12 2005-03-31 Applied Process Technologies, Inc. Magnetic mirror plasma source and method using same
JP4581366B2 (ja) * 2003-10-03 2010-11-17 コニカミノルタオプト株式会社 放電プラズマ処理方法
US20050172897A1 (en) * 2004-02-09 2005-08-11 Frank Jansen Barrier layer process and arrangement
US7030041B2 (en) 2004-03-15 2006-04-18 Applied Materials Inc. Adhesion improvement for low k dielectrics
US7229911B2 (en) 2004-04-19 2007-06-12 Applied Materials, Inc. Adhesion improvement for low k dielectrics to conductive materials
JP4608944B2 (ja) * 2004-05-21 2011-01-12 ソニー株式会社 成膜装置及び成膜方法
US20050277302A1 (en) * 2004-05-28 2005-12-15 Nguyen Son V Advanced low dielectric constant barrier layers
US7229041B2 (en) * 2004-06-30 2007-06-12 Ohio Central Steel Company Lifting lid crusher
US7288205B2 (en) 2004-07-09 2007-10-30 Applied Materials, Inc. Hermetic low dielectric constant layer for barrier applications
BRPI0516670A (pt) * 2004-10-29 2008-09-16 Dow Global Technologies Inc processo para preparar um revestimento de multicamadas, processo para preparar um revestimento sobre uma superfìcie de um substrato polimérico orgánico, estrutura composta, material de vitrificação e automóvel ou edifìcio
US20080107820A1 (en) * 2004-10-29 2008-05-08 Gabelnick Aaron M Deposition Rate Plasma Enhanced Chemical Vapor Process
US7166531B1 (en) 2005-01-31 2007-01-23 Novellus Systems, Inc. VLSI fabrication processes for introducing pores into dielectric materials
US8016894B2 (en) * 2005-12-22 2011-09-13 Apjet, Inc. Side-specific treatment of textiles using plasmas
US7626135B2 (en) * 2006-05-10 2009-12-01 Sub-One Technology, Inc. Electrode systems and methods of using electrodes
JP4811108B2 (ja) * 2006-05-10 2011-11-09 住友電気工業株式会社 被覆層の厚み計量機構およびそれを用いた被覆層形成装置
US7838793B2 (en) * 2006-07-21 2010-11-23 Sub-One Technology, Inc. System and method for treating surfaces of components
WO2008053632A1 (en) * 2006-11-02 2008-05-08 Asahi Glass Company, Limited Ethylene-tetrafluoroethylene copolymer molded product and method for producing the same
WO2008121478A2 (en) * 2007-03-28 2008-10-09 Dow Corning Corporation Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon
MX2009010121A (es) 2007-04-04 2009-10-12 Tetra Laval Holdings & Finance Unidad laminar de empaque, metodo para fabricar la unidad laminar de empaque y contenedor de empaque producido a partir de la misma.
JP4870615B2 (ja) * 2007-04-25 2012-02-08 株式会社アルバック プラズマcvd成膜装置およびプラズマcvd成膜方法
JP4558810B2 (ja) * 2008-02-29 2010-10-06 富士フイルム株式会社 成膜装置
JP4999737B2 (ja) * 2008-03-14 2012-08-15 富士フイルム株式会社 成膜装置
KR20170005154A (ko) * 2008-06-30 2017-01-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 무기 또는 무기/유기 혼성 장벽 필름 제조 방법
JP5156552B2 (ja) * 2008-09-08 2013-03-06 富士フイルム株式会社 ガスバリアフィルムの製造方法
US9545360B2 (en) 2009-05-13 2017-01-17 Sio2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
DK2251454T3 (da) 2009-05-13 2014-10-13 Sio2 Medical Products Inc Coating og inspektion af beholder
US7985188B2 (en) * 2009-05-13 2011-07-26 Cv Holdings Llc Vessel, coating, inspection and processing apparatus
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
WO2011029096A2 (en) * 2009-09-05 2011-03-10 General Plasma, Inc. Plasma enhanced chemical vapor deposition apparatus
JP5270505B2 (ja) 2009-10-05 2013-08-21 株式会社神戸製鋼所 プラズマcvd装置
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
CN103930595A (zh) 2011-11-11 2014-07-16 Sio2医药产品公司 用于药物包装的钝化、pH保护性或润滑性涂层、涂布方法以及设备
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
WO2013100073A1 (ja) * 2011-12-28 2013-07-04 大日本印刷株式会社 プラズマを使った前処理装置を有した蒸着装置
JP5828770B2 (ja) 2012-01-24 2015-12-09 株式会社神戸製鋼所 真空成膜装置
JP2013204053A (ja) * 2012-03-27 2013-10-07 Ulvac Japan Ltd 成膜装置
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
EP2920567B1 (en) 2012-11-16 2020-08-19 SiO2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
WO2014080601A1 (ja) * 2012-11-20 2014-05-30 株式会社神戸製鋼所 プラズマcvd装置
WO2014085348A2 (en) 2012-11-30 2014-06-05 Sio2 Medical Products, Inc. Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
GB2534430B (en) * 2013-02-01 2017-09-27 Camvac Ltd Apparatus and methods for defining a plasma
US20140242367A1 (en) * 2013-02-25 2014-08-28 Au Optronics Corporation Barrier film and methods of making same
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
KR102211788B1 (ko) 2013-03-11 2021-02-04 에스아이오2 메디컬 프로덕츠, 인크. 코팅된 패키징
US9863042B2 (en) 2013-03-15 2018-01-09 Sio2 Medical Products, Inc. PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases
EP3122917B1 (en) 2014-03-28 2020-05-06 SiO2 Medical Products, Inc. Antistatic coatings for plastic vessels
KR20180048694A (ko) 2015-08-18 2018-05-10 에스아이오2 메디컬 프로덕츠, 인크. 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
DE102017204525A1 (de) 2016-03-23 2017-09-28 Basf Se Verbundfolienlaminate für flexible Verpackungen
US11673108B2 (en) * 2017-08-07 2023-06-13 Kasuga Denki, Inc. Surface modifying device
US11389825B2 (en) 2017-08-23 2022-07-19 Jiangsu Favored Nanotechnology Co., LTD Methods for preparing nano-protective coating with a modulation structure
CN107523809B (zh) * 2017-08-23 2019-06-25 江苏菲沃泰纳米科技有限公司 一种有机硅硬质纳米防护涂层的制备方法
CN107587119B (zh) * 2017-08-23 2018-11-13 江苏菲沃泰纳米科技有限公司 一种复合结构高绝缘硬质纳米防护涂层的制备方法
CN107523808B (zh) * 2017-08-23 2019-05-10 江苏菲沃泰纳米科技有限公司 一种有机硅纳米防护涂层的制备方法
US11185883B2 (en) 2017-08-23 2021-11-30 Jiangsu Favored Nanotechnology Co., LTD Methods for preparing nano-protective coating
WO2019083949A2 (en) 2017-10-27 2019-05-02 Corning Incorporated METHODS OF TREATING A SURFACE OF AN ATMOSPHERIC PRESSURE PLASMA POLYMER MATERIAL
CN108559974A (zh) * 2017-12-25 2018-09-21 兰州空间技术物理研究所 一种基于弧形电极结构的pecvd镀膜设备
CN108315722A (zh) * 2017-12-25 2018-07-24 兰州空间技术物理研究所 一种弧形电极等离子体增强化学气相沉积装置
GB201815842D0 (en) * 2018-09-28 2018-11-14 Power Roll Ltd Method of processing substrate for an energy storage device

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642054B2 (pt) * 1973-07-25 1981-10-02
DE2900772C2 (de) * 1979-01-10 1984-08-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Erzeugung von Schichten auf einer bandförmigen Trägerfolie
JPS5730733A (en) * 1980-07-30 1982-02-19 Shin Etsu Chem Co Ltd Device for continuous plasma treatment
DE3175345D1 (en) * 1980-08-21 1986-10-23 Nat Res Dev Coating insulating materials by glow discharge
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
US4741801A (en) * 1981-07-17 1988-05-03 Plasma Physics Corp. Glow discharge method and apparatus and photoreceptor devices made therewith
US4462333A (en) * 1982-10-27 1984-07-31 Energy Conversion Devices, Inc. Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus
JPS5984516A (ja) * 1982-11-08 1984-05-16 Hitachi Ltd 薄膜パタ−ンの連続形成装置
JPS59124038A (ja) * 1982-12-29 1984-07-18 Matsushita Electric Ind Co Ltd 磁気記録媒体の製造方法
JPS59213735A (ja) * 1983-05-18 1984-12-03 Kuraray Co Ltd プラズマ処理方法
US4557946A (en) * 1983-06-03 1985-12-10 Edward Sacher Moisture impermeability or organosilicone films
US4559112A (en) * 1983-10-07 1985-12-17 Nippon Telegraph & Telephone Electrically conducting polymer film and method of manufacturing the same
JPS60226533A (ja) * 1984-04-25 1985-11-11 Hitachi Ltd 連続式プラズマ処理装置
JPH0244854B2 (ja) * 1985-03-11 1990-10-05 Hiraoka Shokusen Shiitojobutsunopurazumashorisochi
US4626447A (en) * 1985-03-18 1986-12-02 Energy Conversion Devices, Inc. Plasma confining apparatus
US4599678A (en) * 1985-03-19 1986-07-08 Wertheimer Michael R Plasma-deposited capacitor dielectrics
DE3521318A1 (de) * 1985-06-14 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum behandeln, insbesondere zum beschichten, von substraten mittels einer plasmaentladung
JPH0734332B2 (ja) * 1986-03-12 1995-04-12 株式会社ト−ビ 透明導電性フイルムの製造方法
JPS62274080A (ja) * 1986-05-21 1987-11-28 Hitachi Ltd プラズマ処理方法
US4842707A (en) * 1986-06-23 1989-06-27 Oki Electric Industry Co., Ltd. Dry process apparatus
US4900625A (en) * 1987-03-03 1990-02-13 Kanebo, Ltd. Deep-colored fibers and a process for manufacturing the same
US4920917A (en) * 1987-03-18 1990-05-01 Teijin Limited Reactor for depositing a layer on a moving substrate
US4968918A (en) * 1987-07-06 1990-11-06 Kanebo, Ltd. Apparatus for plasma treatment
US4847469A (en) * 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
ZA884511B (en) * 1987-07-15 1989-03-29 Boc Group Inc Method of plasma enhanced silicon oxide deposition
KR930003136B1 (ko) * 1987-10-14 1993-04-22 후루가와덴기 고오교오 가부시기가이샤 프라즈마 cvd에 의한 박막 형성장치
JP2670623B2 (ja) * 1988-09-19 1997-10-29 アネルバ株式会社 マイクロ波プラズマ処理装置
JPH02267267A (ja) * 1989-04-06 1990-11-01 Tonen Corp フィルムへの薄膜形成方法およびその装置
JPH02281420A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Ind Co Ltd 金属薄膜型磁気記録媒体の保護膜製造方法およびその装置
JPH0791645B2 (ja) * 1989-04-28 1995-10-04 株式会社日立製作所 薄膜形成装置
DE3914065A1 (de) * 1989-04-28 1990-10-31 Leybold Ag Vorrichtung zur durchfuehrung von plasma-aetzverfahren
US5130170A (en) * 1989-06-28 1992-07-14 Canon Kabushiki Kaisha Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation
JP2587507B2 (ja) * 1989-12-13 1997-03-05 松下電器産業株式会社 薄膜製造装置
JP2990608B2 (ja) * 1989-12-13 1999-12-13 株式会社ブリヂストン 表面処理方法
WO1991017561A1 (en) * 1990-05-10 1991-11-14 Eastman Kodak Company Apparatus for-plasma treatment of continuous material

Also Published As

Publication number Publication date
NO941075D0 (no) 1994-03-24
CA2119561A1 (en) 1993-04-01
ES2096768T3 (es) 1997-03-16
US5364665A (en) 1994-11-15
EP0605534B1 (en) 1997-01-29
US5224441A (en) 1993-07-06
IL102831A0 (en) 1993-01-31
DE69217233D1 (de) 1997-03-13
IL102831A (en) 1996-11-14
CN1072734A (zh) 1993-06-02
JPH07502074A (ja) 1995-03-02
CN1125267A (zh) 1996-06-26
CN1036079C (zh) 1997-10-08
CN1054652C (zh) 2000-07-19
JP3155278B2 (ja) 2001-04-09
DE69217233T2 (de) 1997-05-22
FI941439A0 (fi) 1994-03-28
FI941439A (fi) 1994-03-28
MY110816A (en) 1999-05-31
AU2572492A (en) 1993-04-27
WO1993006258A1 (en) 1993-04-01
ID1054B (id) 1996-10-30
DK0605534T3 (da) 1997-02-17
AU666675B2 (en) 1996-02-22
ATE148507T1 (de) 1997-02-15
EP0605534A1 (en) 1994-07-13
CA2119561C (en) 2002-01-15
KR100294932B1 (ko) 2001-09-17
NZ244055A (en) 1995-12-21
NO941075L (no) 1994-03-24
MX9205420A (es) 1993-03-01
ZA926102B (en) 1993-03-02
PT100880B (pt) 1999-07-30

Similar Documents

Publication Publication Date Title
PT100880A (pt) Aparelho para tratamento por plasma e para revestimento com pelicula fina e processo de preparacao de um substrato
US5789040A (en) Methods and apparatus for simultaneous multi-sided coating of optical thin film designs using dual-frequency plasma-enhanced chemical vapor deposition
US5211995A (en) Method of protecting an organic surface by deposition of an inorganic refractory coating thereon
KR930022602A (ko) 박막형성법
EP0099724A3 (en) Deposition of coatings upon substrates utilising a high pressure, non-local thermal equilibrium arc plasma
US20030185982A1 (en) Method and device for treating surfaces using a glow discharge plasma
EP0359567B1 (en) Plasma processing method and apparatus
AU558048B2 (en) Glow discharge deposition apparatus
EP0095384A3 (en) Vacuum deposition apparatus
AU2001256178A1 (en) Method and device for coating substrates
KR100295618B1 (ko) 이온빔을이용한고진공마그네트론스퍼터링방법
KR950003958B1 (ko) 플라즈마 화학기상증착에 의한 박막제조방법
KR920002169B1 (ko) 플라즈마 증착방법과 이에 적합한 장치
WO1997044141A1 (en) Method and apparatus for dual-frequency plasma-enhanced cvd
TH14372EX (th) เครื่องมือสำหรับการกระทำด้วยพลาสมาว่องไวและวิธีการ
WO1997044141B1 (en) Method and apparatus for dual-frequency plasma-enhanced cvd
RU2028834C1 (ru) Способ динамической плазменной обработки поверхности твердого тела
ES8703533A3 (es) Metodo de aplicar un revestimiento de metal sobre una superficie de un substrato en una camara de deposicion fisica de vapor por arco electrico.
KR20030069575A (ko) 대면적 플라스틱 표면 처리용 플라스마 장치
KR20000027441A (ko) 다중 유전율의 접지전극을 갖는 플라즈마 발생 장치
IT1261819B (it) Impianto a doppia camera ed elettrodo mobile per la deposizione di film sottili, per tecniche pe-cvd.
JPH0238574A (ja) プラズマ処理方法及びその装置
JPH04131366A (ja) 基板のクリーニング方法
MX9704312A (es) Metodo para la deposicion de peliculas de carbon tipo diamante.

Legal Events

Date Code Title Description
BB1A Laying open of patent application

Effective date: 19931105

FG3A Patent granted, date of granting

Effective date: 19990412

PC3A Transfer or assignment

Free format text: 20001213 GENERAL VACUUM EQUIPMENT LIMITED GB

PD3A Change of proprietorship

Owner name: VALMET GENERAL LIMITED

Effective date: 20001213

MM3A Annulment or lapse

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 20011031